Cypress Semiconductor Corp CY7C1425KV18-250BZI
- Part No.:
- CY7C1425KV18-250BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1425KV18-250BZI.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,170
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Product details
Overview
CY7C1425KV18 from Cypress Semiconductor is a 4M × 9 (36-Mbit), 1.8 V QDR® II SRAM with independent read/write ports, 333 MHz clock operation (666 MHz DDR data rate), 1.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers concurrent burst transfers of two 9-bit words per access for high-bandwidth networking buffer applications.
For engineers reviewing the CY7C1425KV18 datasheet, CY7C1425KV18 pinout, CY7C1425KV18 application, or CY7C1425KV18 equivalent, key selection criteria include dual-clock DDR timing support (K/K and C/C), echo clocks (CQ/CQ) for source-synchronous capture, HSTL-compatible I/O (VDDQ = 1.4–1.8 V), JTAG 1149.1 testability, and programmable impedance calibration via ZQ pin.
Technical Context
This QDR II SRAM implements fully pipelined, synchronous architecture with physically separate read and write data paths-eliminating bus turnaround delays. It uses rising edges only of K/K for address/data capture and C/C for output registration, enabling deterministic 1.5-cycle read latency when DOFF is asserted HIGH.
The device integrates a PLL for precise internal timing alignment, supports depth expansion via RPS/WPS and byte-write selects (BWS0), and provides full data coherency through on-chip self-timed write circuitry. Echo clocks CQ/CQ are free-running and phase-aligned to C/C, simplifying high-speed PCB layout and receiver timing closure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4M × 9 organization) |
| Max Clock Frequency | 333 MHz - enables 666 MT/s DDR throughput per port |
| Read Latency | 1.5 cycles (with DOFF = HIGH) - balances bandwidth and timing margin in pipeline-constrained systems |
| VDD / VDDQ | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V - supports mixed-voltage system integration |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-pin-count memory |
| Interface Standard | HSTL Class I - ensures signal integrity at 666 MHz with controlled drive strength and termination |
| JTAG Support | IEEE 1149.1 compliant - enables boundary scan testing and production diagnostics |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data inputs | Sampled on rising edge of K clock; 9-bit parallel input path for burst writes |
| Q[8:0] | Synchronous read data outputs | Driven on rising edges of C/C clocks; tristated when RPS is deasserted |
| RPS / WPS | Read/Write port select (active LOW) | Enables independent port activation; allows concurrent read+write on same clock cycle |
| BWS0 | Byte write select (active LOW) | Controls write enable for D[8:0]; supports partial-word updates without read-modify-write |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, data, control); rising-edge triggered only |
| C / C | Positive/negative output clocks | Register and drive Q[8:0]; used with CQ/CQ for deskewed source-synchronous capture |
| CQ / CQ | Echo clocks (output-referenced) | Free-running, phase-aligned to C/C; simplify timing closure at controller receiver |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to ground; enables dynamic HSTL output driver tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround overhead - enables true concurrent access for packet buffering and streaming |
| Two-Word Burst Architecture | Delivers two sequential 9-bit words per address access - doubles effective bandwidth vs. single-word devices |
| Source-Synchronous Echo Clocks (CQ/CQ) | Match flight time of Q[8:0] signals - removes skew between clock and data at receiver, critical above 500 MHz |
| Programmable HSTL Drive Strength | Calibrated via ZQ pin against external resistor - maintains signal integrity across voltage/temperature/process variation |
| 1.5-Cycle Read Latency Mode | Configurable via DOFF pin - optimizes timing margin in high-frequency switch/router datapaths |
Applications
| Network Packet Buffering | High-Speed Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches with sub-10 ns latency requirements. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffering between ingress parser and egress scheduler, synchronized to 333 MHz fabric clock. Use Value: Concurrent read/write eliminates arbitration delay; 666 MT/s DDR bandwidth sustains 5+ Gbps line-rate traffic per port. |
Use Scenario: Holding forwarding tables and queue state in modular chassis-based routers with distributed control planes. IC Role / Device Role / Timing Role: Shared memory resource accessed by multiple ASICs via dedicated read/write ports and echo-clock–synchronized interfaces. Use Value: Full data coherency ensures consistent table lookups; CQ/CQ timing reduces setup/hold margin by >150 ps vs. single-ended clocking. |
| Telecom Line Card Buffering | Test Equipment Pattern Memory |
|
Use Scenario: Temporary storage of OTN/SONET frame payloads during grooming and multiplexing in 10G/40G line cards. IC Role / Device Role / Timing Role: High-reliability SRAM interfaced to SerDes PHYs via HSTL I/O, operating at 1.8 V core with 1.5 V I/O for compatibility. Use Value: 165-ball FBGA enables dense placement near FPGA logic; JTAG support simplifies in-system validation and field diagnostics. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic-latency memory providing synchronized pattern delivery to DUT pins using C/C-controlled output registers. Use Value: 1.5-cycle read latency mode guarantees fixed timing relationship between trigger and vector output - essential for jitter-sensitive ATE timing engines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 36-Mbit QDR II+, 250 MHz max, ×9 config, 135-ball FBGA (10 × 13 mm) | Lower frequency ceiling; smaller package footprint but reduced thermal mass | Prefer when board space is constrained and 500 MT/s bandwidth suffices |
| ISSI IS61WV102418BLL-15BLI | 18-Mbit QDR II, 250 MHz, ×18 config, 165-ball FBGA, no echo clocks or ZQ | Half density; lacks CQ/CQ and impedance calibration - limits >400 MHz reliability | Acceptable for cost-sensitive, lower-bandwidth control-plane buffers where timing margin is generous |
Compared with IDT72T3615L10PA and IS61WV102418BLL-15BLI, the CY7C1425KV18 uniquely supports 333 MHz operation with echo clocks and ZQ calibration-making it the only choice for 666 MT/s deterministic buffering in carrier-grade infrastructure.
Availability
CY7C1425KV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, and telecom line card buffering requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY7C1425KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
The QDR II SRAM product line targets high-bandwidth, low-latency buffering in networking and test equipment-emphasizing deterministic timing, concurrent access, and signal integrity at multi-Gbps rates.
FAQ
What is the function of the DOFF pin on CY7C1425KV18?
The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-frequency systems; when LOW, it reverts to 1-cycle latency like QDR I. This setting is sampled synchronously on the rising edge of K and remains active until changed.
How does the ZQ pin enable impedance calibration?
The ZQ pin connects to an external 240 Ω resistor to ground, allowing the device to calibrate its HSTL output drivers' pull-up/pull-down strengths. This compensation maintains consistent signal rise/fall times and termination matching across voltage, temperature, and process variations-critical for reliable 666 MT/s operation.
Can CY7C1425KV18 operate with only one clock domain?
Yes. When C and C are tied together and driven by K (or K), the device operates in single-clock mode. In this configuration, Q[8:0] is registered on K/K edges, and CQ/CQ are generated relative to K. All timing parameters shift accordingly, and echo-clock benefits are forfeited.
What is the purpose of BWS0 in CY7C1425KV18?
BWS0 (Byte Write Select 0) is an active-LOW signal that gates write enable for the entire D[8:0] bus. When deasserted, incoming data on D[8:0] is ignored-preserving existing memory contents. It enables partial-word writes without requiring read-modify-write sequences, reducing controller overhead in burst-oriented protocols.
CY7C1425KV18-250BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1425KV18-250BZI FAQ
1.How can I place an order for CY7C1425KV18-250BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1425KV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1425KV18-250BZI reliable?
The price and inventory of CY7C1425KV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1425KV18-250BZI is usually 5 days.
3.What payment methods are accepted for CY7C1425KV18-250BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1425KV18-250BZI transactions.
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CY7C1425KV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1425KV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1425KV18-250BZI?
For technical support, including CY7C1425KV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1425KV18-250BZI requirements.
6.How does Aetrix verify that CY7C1425KV18-250BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1425KV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1425KV18-250BZI meets industry standards.
7.What is the process for return or replacement of CY7C1425KV18-250BZI?
All CY7C1425KV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1425KV18-250BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1425KV18-250BZI part is unused and in its original packaging.
Return procedure for CY7C1425KV18-250BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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