Cypress Semiconductor Corp CY7C1425KV18-250BZXC

Overview

CY7C1425KV18 from Cypress Semiconductor is a 4M × 9 (36-Mbit) QDR® II SRAM with dual independent read/write ports, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent burst reads/writes with 1.5-cycle read latency (DOFF = HIGH) and supports high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C1425KV18 datasheet, CY7C1425KV18 pinout, CY7C1425KV18 application, or CY7C1425KV18 equivalent, key selection criteria include QDR II two-word burst timing, echo clock (CQ/CQ) support for source-synchronous capture, FBGA-165 package compatibility, and HSTL-18 I/O compliance at 333 MHz.

Technical Context

The CY7C1425KV18 implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround delays. It uses four dedicated clocks-K/K for address/data input timing and C/C for output timing-enabling precise DDR edge alignment and skew management via echo clocks CQ/CQ.

Internally, it organizes memory as two 2M × 9 arrays accessed via a shared 21-bit address bus latched on alternating K/K edges. Write operations are self-timed and synchronous; read latency is configurable between 1 cycle (DOFF = LOW) and 1.5 cycles (DOFF = HIGH), with full data coherency maintained across concurrent accesses.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch and HSTL-18 compatible I/Os.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1425KV18, IDT72T3615L10BG trades bandwidth for LVDS interoperability, while IS61QW25636A-250BQ offers drop-in package compatibility at reduced speed - both require revalidation of echo clock timing and DOFF-dependent latency paths.

Availability

CY7C1425KV18 is available at Aetrix Electronics and suitable for network line cards, high-speed test equipment, and telecom baseband processing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1425KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR® II SRAM product line targets high-throughput, low-latency buffering in infrastructure equipment where deterministic timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1425KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when HIGH, it enables 1.5-cycle latency for improved timing margin; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly affects the C/C clock-to-Q[8:0] valid window and must be matched to controller capabilities and PCB routing delays.

Can CY7C1425KV18 operate with only K and C clocks (single-clock mode)?

Yes - in single-clock mode, K serves as both input and output clock, and C is unused. Q[8:0] data is driven on K's rising edge, and CQ echoes K instead of C. This reduces clock routing complexity but sacrifices deskew capability and limits maximum frequency to 250 MHz per Cypress documentation.

How does byte write select (BWS0) work in CY7C1425KV18?

BWS0 is an active-low signal controlling all 9 bits of D[8:0]. When asserted, the corresponding byte is written; when deasserted, that byte remains unaltered. Unlike wider variants, CY7C1425KV18 uses only BWS0 - no BWS1–BWS3 - because its 9-bit width maps to a single byte group.

Is the 165-ball FBGA package of CY7C1425KV18 pin-compatible with CY7C1412KV18 or CY7C1414KV18?

No - although all three share the same 165-ball FBGA mechanical outline, their pin functions differ significantly. For example, CY7C1412KV18 uses BWS1 for upper byte control, and CY7C1414KV18 assigns additional BWS signals and data bits to pins reused as NC or auxiliary functions in CY7C1425KV18. Direct substitution is not electrically valid.