Cypress Semiconductor Corp CY7C1426KV18-300BZXC

Overview

CY7C1426KV18-300BZXC from Cypress Semiconductor is a 36-Mbit QDR® II SRAM with 4 M × 9 organization, 300 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking line cards and packet buffer applications.

For engineers reviewing the CY7C1426KV18-300BZXC datasheet, CY7C1426KV18-300BZXC pinout, CY7C1426KV18-300BZXC application, or CY7C1426KV18-300BZXC equivalent, key selection considerations include concurrent read/write bandwidth, DOFF-controlled read latency (1 or 1.5 cycles), FBGA-165 package compatibility, and HSTL-18 I/O drive compliance.

Technical Context

This QDR II SRAM uses dual independent clock domains: K/K for address/data input timing and C/C for output timing, enabling true concurrent read and write operations without bus turnaround. Its internal pipelined architecture supports synchronous self-timed writes and full data coherency across both ports.

The device integrates a PLL for precise data placement, JTAG 1149.1 test access, and programmable impedance via ZQ pin. Read latency is configurable via DOFF pin-1 cycle when LOW, 1.5 cycles when HIGH-allowing trade-offs between timing margin and throughput in high-speed switch fabric designs.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10BG and AS7C33618B-300BIN, CY7C1426KV18-300BZXC uniquely supports 1.8 V core, DOFF-selectable latency, and HSTL-18 I/O in a standardized FBGA-165 package-making it optimal for new 300 MHz networking designs requiring timing adaptability and power efficiency.

Availability

CY7C1426KV18-300BZXC is available at Aetrix Electronics and suitable for network packet buffers, high-speed switch fabrics, telecom line card memory, and ATE data capture systems requiring stable component supply across extended production lifecycles.

Supply support for CY7C1426KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1426KV18 belongs to Cypress's QDR II SRAM product line, designed specifically for ultra-low-latency, high-bandwidth buffering in packet-switched infrastructure where concurrent read/write throughput and timing predictability are critical.

FAQ

What is the function of the DOFF pin on CY7C1426KV18-300BZXC?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin; when LOW, it selects 1-cycle latency for minimal delay. This setting directly affects the number of clock cycles between address assertion and valid Q[8:0] output, and must be held stable during operation.

Can CY7C1426KV18-300BZXC operate with a single clock domain?

Yes - the device supports single-clock mode where C and C are tied to K and K respectively. In this configuration, read data is output on the same clock edges used for address and write data sampling, simplifying clock distribution at the cost of reduced timing flexibility compared to dual-clock operation.

What is the purpose of the ZQ pin and how should it be connected?

The ZQ pin enables output driver impedance calibration for HSTL-18 I/O. It must be connected to a precision 240 Ω resistor to ground. During power-up or calibration command, the device measures this reference to adjust internal termination and drive strength, ensuring signal integrity across process/voltage/temperature variations.

How does depth expansion work with RPS and WPS pins?

RPS (Read Port Select) and WPS (Write Port Select) are active-LOW enables that gate access to the respective port. When multiple CY7C1426KV18 devices are stacked, asserting RPS/WPS on only one device per transaction allows logical depth expansion (e.g., 8 M × 9) while maintaining independent port control per chip - essential for scalable buffer architectures.