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Cypress Semiconductor Corp CY7C1460KV25-167BZC

Part No.:
CY7C1460KV25-167BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1460KV25-167BZC.pdf
Description:
SRAM - SYNCHRONOUS, SDR MEMORY I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,259

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Product details

Overview

CY7C1460KV25-167BZC from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, ECC support, 2.5 V core/I/O supply, and 167 MHz operation (3.4 ns access). It delivers zero-wait-state back-to-back read/write capability in high-throughput packet buffering and network switching applications.

For engineers reviewing the CY7C1460KV25-167BZC datasheet, CY7C1460KV25-167BZC pinout, CY7C1460KV25-167BZC application, or CY7C1460KV25-167BZC equivalent, key selection criteria include burst mode support (linear/interleaved), on-chip ECC for SER reduction, byte-write granularity (BWa–BWd), synchronous self-timed writes, and TQFP-100 package compatibility with ZBT™-legacy systems.

Technical Context

This SRAM implements fully registered pipelined I/O with rising-edge clock sampling for all inputs and outputs, enabling deterministic timing across 167 MHz operation. Its NoBL™ logic eliminates bus latency by supporting true back-to-back read/write cycles without wait states.

The device integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. It supports linear or interleaved burst orders, ZZ sleep mode, and IEEE 1149.1 JTAG boundary scan for system-level testability.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 or 2M × 18 configuration)
Max Clock Frequency 167 MHz - enables 167 million synchronous transactions/sec
Access Time 3.4 ns - defines minimum clock-to-output delay for timing closure
Core/I/O Voltage 2.5 V - requires dedicated 2.5 V power rails; not 3.3 V tolerant
ECC Support On-chip SEC-DED - corrects single-bit errors, detects double-bit errors in real time
Burst Capability Linear or interleaved - matches CPU/cache burst patterns without address re-latching
Byte Write Control BWa–BWd (active LOW) - enables independent 9-bit write masking per DQ group

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, body size 14 mm × 14 mm, 0.5 mm pitch.

Pin Circuit Role Design Meaning
A0–A19 Address Input Synchronous inputs sampled on CLK rising edge; selects 1M-word location (1M × 36 mode)
DQa–DQd / DQPa–DQPd Data I/O (36-bit + 4-bit parity) 36-bit bidirectional data bus with 4 parity bits; direction controlled by OE and internal write state
BWa–BWd Byte Write Select Active-LOW signals enabling independent 9-bit writes to DQa/DQPa through DQd/DQPd groups
CLK, CEN Clock & Enable CLK qualified by CEN (active LOW); CEN suspends clock recognition without deselection
CE1/CE3, CE2 Chip Enable Three-signal bank select: CE1/CE3 active LOW, CE2 active HIGH - enables multi-SRAM decoding
ADV/LD Burst Address Control HIGH advances internal counter; LOW loads new address - controls burst sequence initiation
OE Output Enable Asynchronous, active-LOW; masked during write data phase to prevent bus contention
ZZ Deep Sleep Mode Active-LOW entry into low-power standby; retains data but disables clocks and I/O drivers

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables unlimited consecutive read/write operations with no wait states - critical for line-rate packet processing
Synchronous Self-Timed Writes Eliminates external write pulse timing constraints; internal logic guarantees data capture within one clock cycle
IEEE 1149.1 JTAG Boundary Scan Supports PCB-level interconnect testing without requiring functional access to memory array or control logic
Zero Wait State Burst Operation Delivers full bandwidth at 167 MHz regardless of read/write alternation pattern - no pipeline stalls
2.5 V Core + I/O Supply Reduces dynamic power vs. 3.3 V SRAMs while maintaining signal integrity in high-speed parallel buses

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G Ethernet switch fabric ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared buffer between MAC and switch fabric; operates as synchronous dual-port via burst interleaving.

Use Value: 3.4 ns access + zero-wait-state pipelining ensures sub-10 ns round-trip latency for 64-byte packets at line rate.

Use Scenario: Frame assembly/disassembly in carrier-grade SDH/SONET line cards handling OC-192 traffic.

IC Role / Device Role / Timing Role: Burst-mode FIFO for ATM cell reassembly; uses linear burst to match SAR controller addressing.

Use Value: On-chip ECC prevents bit flips from cosmic rays in telco central office environments - validated SER < 1E-15/bit-hour.

Baseband Processing Cache Radar Signal Processing Buffer

Use Scenario: Temporary storage of FFT coefficients and channel estimation data in LTE eNodeB baseband units.

IC Role / Device Role / Timing Role: Low-jitter, deterministic-access scratchpad memory for DSP co-processors; synchronized to FPGA fabric clock.

Use Value: Fully registered I/O eliminates setup/hold violations at 167 MHz, enabling direct connection to Xilinx Kintex-7 I/O banks.

Use Scenario: Real-time buffering of digitized IF samples in airborne AESA radar receivers before DSP downconversion.

IC Role / Device Role / Timing Role: High-reliability burst memory for pulse-Doppler processing chains; leverages ZZ sleep mode between chirps.

Use Value: ZZ mode reduces standby current to < 50 µA - extends battery life in portable radar test equipment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L15PF 2.5 V, 36-Mbit, 15 ns access, no on-chip ECC, supports only linear burst Lacks ECC and interleaved burst - unsuitable for radiation-prone or legacy bus protocol environments Select when cost sensitivity outweighs SER requirements and burst flexibility is unnecessary
ISSI IS61WV102436B 3.3 V core/I/O, 36-Mbit, 167 MHz, no ECC, TQFP-100 pinout identical Higher voltage increases power and noise; no ECC or ZZ sleep - limits use in low-power or high-reliability systems Choose only for drop-in replacement where existing 3.3 V infrastructure prohibits voltage redesign

Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1460KV25-167BZC uniquely combines ECC, ZZ sleep, and dual-burst mode in a 2.5 V, pin-compatible package - making it the sole option for new designs requiring SER mitigation and dynamic power scaling.

Availability

CY7C1460KV25-167BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460KV25-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with focus on reliability and signal integrity.

CY7C1460KV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in packet-switched and real-time signal processing systems.

FAQ

Does CY7C1460KV25-167BZC support both 1M × 36 and 2M × 18 configurations?

Yes. The device supports configurable organization via MODE pin: MODE = HIGH selects 1M × 36 mode (A0–A19 used); MODE = LOW selects 2M × 18 mode (A0–A20 used). This dual-mode capability allows flexible memory mapping without hardware redesign.

How does the on-chip ECC operate during read and write cycles?

ECC encoding occurs automatically during every write cycle using dedicated on-die logic; no external controller involvement is required. During reads, ECC decoding and correction happen transparently - corrected data appears at DQ outputs within the specified 3.4 ns access time, with uncorrectable errors flagged via parity pins.

What is the functional impact of asserting CEN HIGH during active operation?

Asserting CEN HIGH masks the CLK input but maintains internal state - the device holds its last valid cycle indefinitely without deselecting. This extends the previous read or write cycle, enabling precise timing alignment with external controllers that cannot meet strict clock duty-cycle requirements.

Can ADV/LD be used to initiate burst sequences without external address generation?

Yes. With ADV/LD held HIGH and CEN active LOW, the internal address counter auto-increments on each CLK rising edge, enabling continuous burst reads/writes starting from the initial loaded address - eliminating need for external address counters in streaming applications.

CY7C1460KV25-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1460KV25-167BZC FAQ

1.How can I place an order for CY7C1460KV25-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KV25-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KV25-167BZC reliable?

The price and inventory of CY7C1460KV25-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1460KV25-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-167BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1460KV25-167BZC?

CY7C1460KV25-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KV25-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KV25-167BZC?

For technical support, including CY7C1460KV25-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-167BZC requirements.

6.How does Aetrix verify that CY7C1460KV25-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1460KV25-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1460KV25-167BZC?

All CY7C1460KV25-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KV25-167BZC part is unused and in its original packaging.

Return procedure for CY7C1460KV25-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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