Cypress Semiconductor Corp CY7C1460KV25-200BZXI
- Part No.:
- CY7C1460KV25-200BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1460KV25-200BZXI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:757
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1460KV25-200BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, 2.5 V core/I/O supply, on-chip ECC, and 200 MHz operation (3.2 ns access time). It supports zero-wait-state back-to-back read/write cycles in high-throughput networking and packet buffering applications.
For engineers reviewing the CY7C1460KV25-200BZXI datasheet, CY7C1460KV25-200BZXI pinout, CY7C1460KV25-200BZXI application, or CY7C1460KV25-200BZXI equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write capability with BWa–BWd controls, synchronous self-timed writes, JTAG boundary scan compliance, and 100-pin TQFP packaging with verified pin mapping.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs pass through input registers clocked on the rising edge of CLK; all outputs are driven through output registers also clocked on CLK's rising edge. The internal NoBL™ logic eliminates bus latency by enabling true consecutive read/write transitions without wait states.
It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. Burst addressing supports both linear and interleaved orders, and sleep mode (ZZ) is controlled via dedicated pin for dynamic power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables 5 ns cycle time for sustained burst throughput |
| Access Time | 3.2 ns - defines minimum clock-to-output delay for timing-critical interfaces |
| Core/I/O Voltage | 2.5 V - requires single-supply rail; eliminates level-shifting in 2.5 V system designs |
| ECC Support | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time |
| Burst Capability | Linear or interleaved - matches processor/cache burst patterns without external logic |
| Power Dissipation | 210 mA (max operating current at ×36, 200 MHz) - informs thermal design and supply sizing |
Pinout & Package
The CY7C1460KV25-200BZXI is packaged in a JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch and exposed thermal pad. Pin layout supports standard PCB routing and thermal dissipation for high-speed memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | 20-bit synchronous address bus sampled on CLK rising edge; selects one of 1M locations |
| DQa–DQd / DQPa–DQPd | Data I/O + Parity I/O | 32-bit data + 4-bit parity bidirectional bus; each byte pair controlled by dedicated BWx signal |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for independent 8-bit write masking (DQa/DQPa, etc.) |
| CLK, CEN | Clock & Enable | CLK qualified by CEN; deasserting CEN extends previous cycle without deselection |
| CE1, CE2, CE3 | Chip Enable Group | Three-signal decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems |
| ADV/LD, MODE | Burst Control | ADV/LD advances internal counter or loads new address; MODE selects burst order (linear/interleaved) |
| ZZ | Deep Sleep | Asynchronous entry to low-power sleep mode; reduces ICC to <50 µA |
| OE | Output Enable | Asynchronous control; outputs tristated during write cycles regardless of OE state |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited back-to-back read/write operations with zero wait states - critical for packet forwarding engines |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic manages write duration based on clock phase |
| JTAG Boundary Scan (IEEE 1149.1) | Supports production test and board-level debug without additional test fixtures or probes |
| Byte-Write with Parity | Independent 8-bit write enable per data byte plus corresponding parity bit - preserves data integrity during partial updates |
| Zero-Setup/Takedown Timing | All synchronous signals meet setup/hold relative to CLK rising edge only - simplifies timing closure in FPGA-attached systems |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before classification and forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly with MAC controllers and traffic managers. Use Value: 200 MHz pipelined operation sustains 7.2 GB/s aggregate bandwidth (36-bit × 200 MHz), eliminating bottlenecks in 10G+ switching fabric. | Use Scenario: Holding voice/data payload in TDM-over-IP gateways and SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: Synchronous burst memory for jitter-buffering and frame reassembly under deterministic timing constraints. Use Value: On-chip ECC ensures bit-error resilience in telecom environments where soft errors impact service continuity and SLA compliance. |
| High-Speed Test Equipment Memory | Radar Signal Processing Buffer |
Use Scenario: Capturing high-sample-rate analog waveforms in automated test equipment (ATE) digitizers. IC Role / Device Role / Timing Role: Deep, fast-access memory staging raw ADC samples prior to FFT or pattern analysis. Use Value: 3.2 ns access time and full pipelining allow continuous capture at >150 MS/s without dead time between bursts. | Use Scenario: Temporary storage of chirp-matched filter outputs in pulsed-Doppler radar front ends. IC Role / Device Role / Timing Role: Low-jitter, deterministic latency memory for real-time beamforming and CFAR processing loops. Use Value: ZZ sleep mode reduces standby power to <50 µA, extending operational life in battery-backed radar modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2.5 V, 36-Mbit ZBT-style SRAM; no on-chip ECC; 15 ns access at 133 MHz | Lacks ECC and NoBL™ zero-latency pipelining; suited for cost-sensitive non-critical buffers | Select when ECC is not required and system clock ≤133 MHz; verify pinout compatibility for drop-in replacement |
| ISSI IS61WV102436B | 2.5 V, 36-Mbit NoBL™ SRAM; no ECC; 200 MHz rated but 3.5 ns access time | Higher access time increases timing margin pressure; no JTAG or ZZ sleep mode | Prefer for simpler BOMs where ECC and debug features are unnecessary; validate burst order support matches design |
Compared with IDT72V2115L15PF and IS61WV102436B, the CY7C1460KV25-200BZXI uniquely combines 200 MHz operation, on-chip SEC-DED ECC, IEEE 1149.1 JTAG, and deep-sleep mode - making it optimal for mission-critical, high-reliability embedded memory subsystems requiring deterministic latency and fault resilience.
Availability
CY7C1460KV25-200BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1460KV25-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
The CY7C1460KV25 series belongs to Cypress' high-speed synchronous SRAM product line, designed specifically for zero-latency, ECC-enabled memory subsystems in networking infrastructure, test instrumentation, and real-time signal processing platforms.
FAQ
What is the function of the MODE pin on CY7C1460KV25-200BZXI?
The MODE pin selects burst addressing order: logic HIGH configures linear burst (sequential increment), while LOW selects interleaved burst (bit-reversed increment). This setting is latched at power-up or reset and remains static during operation - it must match the host controller's burst protocol to prevent address misalignment and data corruption.
Does CY7C1460KV25-200BZXI support asynchronous read operations?
No. All read operations are strictly synchronous: address and control signals (CE1/CE2/CE3, ADV/LD, OE) are sampled only on the rising edge of CLK. There is no asynchronous read path - even OE is masked during write cycles and first-clock recovery, ensuring deterministic timing behavior aligned to the system clock domain.
How does the on-chip ECC operate during write and read cycles?
ECC encoding occurs automatically during every write: 4 parity bits (DQPa–DQPd) are generated per 32-bit word and stored alongside data. During reads, the full 36-bit word (32 data + 4 parity) is decoded; single-bit errors are corrected in real time and flagged via internal status, while double-bit errors trigger uncorrectable error indication - no software intervention required.
Can CY7C1460KV25-200BZXI be used in place of a ZBT SRAM?
Yes - it is pin-compatible and functionally equivalent to ZBT devices per Cypress documentation. Key behavioral alignment includes identical burst protocols, byte-write signaling, and clock-enable operation. However, differences exist: CY7C1460KV25-200BZXI adds ECC, ZZ sleep, and JTAG, and uses NoBL™ instead of ZBT's separate read/write clocks - verify timing margins and feature enablement in legacy ZBT designs.
CY7C1460KV25-200BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1460KV25-200BZXI FAQ
1.How can I place an order for CY7C1460KV25-200BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KV25-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KV25-200BZXI reliable?
The price and inventory of CY7C1460KV25-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-200BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1460KV25-200BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-200BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1460KV25-200BZXI?
CY7C1460KV25-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1460KV25-200BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1460KV25-200BZXI?
For technical support, including CY7C1460KV25-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-200BZXI requirements.
6.How does Aetrix verify that CY7C1460KV25-200BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1460KV25-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-200BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1460KV25-200BZXI?
All CY7C1460KV25-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-200BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KV25-200BZXI part is unused and in its original packaging.
Return procedure for CY7C1460KV25-200BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1460KV25-200BZXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

