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Cypress Semiconductor Corp CY7C1460KV25-200BZXI

Part No.:
CY7C1460KV25-200BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1460KV25-200BZXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
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Payment
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Inventory:757

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Product details

Overview

CY7C1460KV25-200BZXI from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, 2.5 V core/I/O supply, on-chip ECC, and 200 MHz operation (3.2 ns access time). It supports zero-wait-state back-to-back read/write cycles in high-throughput networking and packet buffering applications.

For engineers reviewing the CY7C1460KV25-200BZXI datasheet, CY7C1460KV25-200BZXI pinout, CY7C1460KV25-200BZXI application, or CY7C1460KV25-200BZXI equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write capability with BWa–BWd controls, synchronous self-timed writes, JTAG boundary scan compliance, and 100-pin TQFP packaging with verified pin mapping.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs pass through input registers clocked on the rising edge of CLK; all outputs are driven through output registers also clocked on CLK's rising edge. The internal NoBL™ logic eliminates bus latency by enabling true consecutive read/write transitions without wait states.

It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. Burst addressing supports both linear and interleaved orders, and sleep mode (ZZ) is controlled via dedicated pin for dynamic power management.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1M × 36 configuration)
Max Clock Frequency200 MHz - enables 5 ns cycle time for sustained burst throughput
Access Time3.2 ns - defines minimum clock-to-output delay for timing-critical interfaces
Core/I/O Voltage2.5 V - requires single-supply rail; eliminates level-shifting in 2.5 V system designs
ECC SupportOn-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time
Burst CapabilityLinear or interleaved - matches processor/cache burst patterns without external logic
Power Dissipation210 mA (max operating current at ×36, 200 MHz) - informs thermal design and supply sizing

Pinout & Package

The CY7C1460KV25-200BZXI is packaged in a JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch and exposed thermal pad. Pin layout supports standard PCB routing and thermal dissipation for high-speed memory subsystems.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address Input20-bit synchronous address bus sampled on CLK rising edge; selects one of 1M locations
DQa–DQd / DQPa–DQPdData I/O + Parity I/O32-bit data + 4-bit parity bidirectional bus; each byte pair controlled by dedicated BWx signal
BWa–BWdByte Write SelectActive-low synchronous controls for independent 8-bit write masking (DQa/DQPa, etc.)
CLK, CENClock & EnableCLK qualified by CEN; deasserting CEN extends previous cycle without deselection
CE1, CE2, CE3Chip Enable GroupThree-signal decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems
ADV/LD, MODEBurst ControlADV/LD advances internal counter or loads new address; MODE selects burst order (linear/interleaved)
ZZDeep SleepAsynchronous entry to low-power sleep mode; reduces ICC to <50 µA
OEOutput EnableAsynchronous control; outputs tristated during write cycles regardless of OE state

Key Features

FeatureDesign Value
NoBL™ ArchitectureEnables unlimited back-to-back read/write operations with zero wait states - critical for packet forwarding engines
Synchronous Self-Timed WritesEliminates external write pulse timing constraints; internal logic manages write duration based on clock phase
JTAG Boundary Scan (IEEE 1149.1)Supports production test and board-level debug without additional test fixtures or probes
Byte-Write with ParityIndependent 8-bit write enable per data byte plus corresponding parity bit - preserves data integrity during partial updates
Zero-Setup/Takedown TimingAll synchronous signals meet setup/hold relative to CLK rising edge only - simplifies timing closure in FPGA-attached systems

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly with MAC controllers and traffic managers.

Use Value: 200 MHz pipelined operation sustains 7.2 GB/s aggregate bandwidth (36-bit × 200 MHz), eliminating bottlenecks in 10G+ switching fabric.

Use Scenario: Holding voice/data payload in TDM-over-IP gateways and SDH/SONET add-drop multiplexers.

IC Role / Device Role / Timing Role: Synchronous burst memory for jitter-buffering and frame reassembly under deterministic timing constraints.

Use Value: On-chip ECC ensures bit-error resilience in telecom environments where soft errors impact service continuity and SLA compliance.

High-Speed Test Equipment MemoryRadar Signal Processing Buffer

Use Scenario: Capturing high-sample-rate analog waveforms in automated test equipment (ATE) digitizers.

IC Role / Device Role / Timing Role: Deep, fast-access memory staging raw ADC samples prior to FFT or pattern analysis.

Use Value: 3.2 ns access time and full pipelining allow continuous capture at >150 MS/s without dead time between bursts.

Use Scenario: Temporary storage of chirp-matched filter outputs in pulsed-Doppler radar front ends.

IC Role / Device Role / Timing Role: Low-jitter, deterministic latency memory for real-time beamforming and CFAR processing loops.

Use Value: ZZ sleep mode reduces standby power to <50 µA, extending operational life in battery-backed radar modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L15PF2.5 V, 36-Mbit ZBT-style SRAM; no on-chip ECC; 15 ns access at 133 MHzLacks ECC and NoBL™ zero-latency pipelining; suited for cost-sensitive non-critical buffersSelect when ECC is not required and system clock ≤133 MHz; verify pinout compatibility for drop-in replacement
ISSI IS61WV102436B2.5 V, 36-Mbit NoBL™ SRAM; no ECC; 200 MHz rated but 3.5 ns access timeHigher access time increases timing margin pressure; no JTAG or ZZ sleep modePrefer for simpler BOMs where ECC and debug features are unnecessary; validate burst order support matches design

Compared with IDT72V2115L15PF and IS61WV102436B, the CY7C1460KV25-200BZXI uniquely combines 200 MHz operation, on-chip SEC-DED ECC, IEEE 1149.1 JTAG, and deep-sleep mode - making it optimal for mission-critical, high-reliability embedded memory subsystems requiring deterministic latency and fault resilience.

Availability

CY7C1460KV25-200BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460KV25-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The CY7C1460KV25 series belongs to Cypress' high-speed synchronous SRAM product line, designed specifically for zero-latency, ECC-enabled memory subsystems in networking infrastructure, test instrumentation, and real-time signal processing platforms.

FAQ

What is the function of the MODE pin on CY7C1460KV25-200BZXI?

The MODE pin selects burst addressing order: logic HIGH configures linear burst (sequential increment), while LOW selects interleaved burst (bit-reversed increment). This setting is latched at power-up or reset and remains static during operation - it must match the host controller's burst protocol to prevent address misalignment and data corruption.

Does CY7C1460KV25-200BZXI support asynchronous read operations?

No. All read operations are strictly synchronous: address and control signals (CE1/CE2/CE3, ADV/LD, OE) are sampled only on the rising edge of CLK. There is no asynchronous read path - even OE is masked during write cycles and first-clock recovery, ensuring deterministic timing behavior aligned to the system clock domain.

How does the on-chip ECC operate during write and read cycles?

ECC encoding occurs automatically during every write: 4 parity bits (DQPa–DQPd) are generated per 32-bit word and stored alongside data. During reads, the full 36-bit word (32 data + 4 parity) is decoded; single-bit errors are corrected in real time and flagged via internal status, while double-bit errors trigger uncorrectable error indication - no software intervention required.

Can CY7C1460KV25-200BZXI be used in place of a ZBT SRAM?

Yes - it is pin-compatible and functionally equivalent to ZBT devices per Cypress documentation. Key behavioral alignment includes identical burst protocols, byte-write signaling, and clock-enable operation. However, differences exist: CY7C1460KV25-200BZXI adds ECC, ZZ sleep, and JTAG, and uses NoBL™ instead of ZBT's separate read/write clocks - verify timing margins and feature enablement in legacy ZBT designs.

CY7C1460KV25-200BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1460KV25-200BZXI FAQ

1.How can I place an order for CY7C1460KV25-200BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KV25-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KV25-200BZXI reliable?

The price and inventory of CY7C1460KV25-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KV25-200BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1460KV25-200BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KV25-200BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1460KV25-200BZXI?

CY7C1460KV25-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KV25-200BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KV25-200BZXI?

For technical support, including CY7C1460KV25-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KV25-200BZXI requirements.

6.How does Aetrix verify that CY7C1460KV25-200BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1460KV25-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KV25-200BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1460KV25-200BZXI?

All CY7C1460KV25-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KV25-200BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KV25-200BZXI part is unused and in its original packaging.

Return procedure for CY7C1460KV25-200BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1460KV25-200BZXI Tags

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