Cypress Semiconductor Corp CY7C1470BV25-167BZXC
- Part No.:
- CY7C1470BV25-167BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV25-167BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:190
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Product details
Overview
CY7C1470BV25-167BZXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 167 MHz with 3.4 ns maximum access time, supports zero-wait-state back-to-back reads/writes, and uses single 2.5V VDD with separate 2.5V VDDQ I/O supply.
For engineers reviewing the CY7C1470BV25-167BZXC datasheet, CY7C1470BV25-167BZXC pinout, CY7C1470BV25-167BZXC application, or CY7C1470BV25-167BZXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select granularity (BWa–BWd), synchronous self-timed write timing, and JEDEC-compliant 100-pin TQFP packaging with JTAG boundary scan support.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. The internal NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states.
It features three synchronous chip enables (CE1 active-low, CE2 active-high, CE3 active-low), asynchronous OE for tri-state control, Clock Enable (CEN) for cycle extension, and ADV/LD to load or advance the burst counter. Burst order (linear or interleaved) is set by the MODE strap pin, which must remain static during operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling 9 MB of fast buffer storage per device |
| Max Clock Frequency | 167 MHz - supports sustained 167 MT/s throughput with no wait states |
| Access Time (tCO) | 3.4 ns - defines maximum clock-to-output delay for timing-critical read paths |
| Supply Voltages | VDD = 2.5V ±0.2V, VDDQ = 2.5V ±0.2V - dual-rail I/O allows clean signal integrity in mixed-voltage systems |
| Burst Capability | Linear or interleaved 4-word burst - reduces address bus traffic and improves bandwidth efficiency |
| Byte Write Control | Four independent BWa–BWd signals - enables selective 9-bit writes to DQa/DQPa through DQd/DQPd |
| Power Consumption | 400 mA max operating current, 120 mA CMOS standby - suitable for thermally constrained telecom modules |
Pinout & Package
Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch), RoHS-compliant Pb-free, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 mode |
| BWa–BWd | Synchronous Byte Write Select | Active-low controls 9-bit write segments: BWa→DQa/DQPa, BWb→DQb/DQPb, etc. |
| CE1, CE3 | Synchronous Chip Enable (active-low) | Combined with CE2 (active-high) for 3-signal depth expansion and bank isolation |
| CLK, CEN | Clock and Clock Enable | CEN masks CLK without deselecting device - enables precise cycle extension for timing alignment |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data + 4-bit parity; automatically tri-stated during write data phase to prevent bus contention |
| OE | Asynchronous Output Enable | Tri-states outputs when HIGH; masked during write sequences and device deselection to ensure safe bus handoff |
| MODE | Strap Pin | Static configuration of burst order: HIGH = interleaved, LOW = linear; floating defaults to HIGH |
| ADV/LD | Advance/Load Control | LOW loads new address; HIGH advances internal burst counter - enables seamless burst sequencing |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write operations with zero wait states, delivering sustained 167 MT/s throughput |
| Fully Registered Pipelined Interface | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in high-speed FPGA/ASIC interfaces |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse width constraints and reduces PCB routing complexity |
| JTAG Boundary Scan (IEEE 1149.1) | Supports in-system testability and interconnect verification without additional test fixtures or probes |
| Flexible Burst and Byte-Write Granularity | Configurable 4-word burst order + independent 9-bit byte writes - optimizes bandwidth and data integrity in packet buffer applications |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches. IC Role / Device Role / Timing Role: High-speed, low-latency buffer SRAM interfacing directly with packet processor's 36-bit data bus. Use Value: 167 MHz zero-wait-state operation ensures full line-rate packet buffering without stalling the processor pipeline. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface cards. IC Role / Device Role / Timing Role: Synchronous burst-access memory for ATM cell or GFP frame assembly/disassembly engines. Use Value: Interleaved burst mode aligns with SONET's time-division multiplexing structure, reducing address overhead by 75%. |
| Baseband Processing Buffer | Radar Signal Processing FIFO |
|
Use Scenario: Temporary storage of IQ samples between digital down-conversion and channel decoding in LTE eNodeB basebands. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer with FPGA controller managing CE1/CE2 bank switching. Use Value: Byte-write capability (BWa–BWd) enables efficient partial updates of complex sample buffers without full-word overwrites. |
Use Scenario: Real-time buffering of ADC samples prior to FFT processing in phased-array radar front ends. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory providing continuous 167 MT/s streaming to DSP DMA engines. Use Value: 3.4 ns tCO and fully registered interface minimize timing uncertainty in sample-to-FFT latency budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 36-Mbit (1M × 36), 10 ns access, 100 MHz max frequency, 3.3V core/I/O | Lower density and speed; suited for legacy 3.3V systems with relaxed timing margins | Select when migrating older ZBT designs with 3.3V infrastructure and no need for >133 MHz operation |
| ISSI IS61WV102436B | 36-Mbit (1M × 36), 2.5V core/I/O, 167 MHz, but lacks NoBL™ and burst counter - requires external address generation | No internal burst logic; requires FPGA to manage sequential addressing - increases logic utilization and latency | Choose only if cost sensitivity outweighs performance and design simplicity; verify FPGA resource availability for burst address gen |
Compared with IDT72V2115L10PF and IS61WV102436B, CY7C1470BV25-167BZXC delivers double the density, 67% higher throughput, and integrated burst/byte-write control - reducing system-level timing risk and FPGA logic burden in next-gen packet processing.
Availability
CY7C1470BV25-167BZXC is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, and radar signal processors requiring stable component supply, long-lifecycle support, and RoHS-compliant 100-pin TQFP packaging.
Supply support for CY7C1470BV25-167BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth buffering in real-time data-path applications such as packet switching, baseband processing, and high-speed test equipment.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin is a static strap input that selects burst order: pulled HIGH for interleaved burst, LOW for linear burst. It must be held stable during operation - floating defaults to HIGH (interleaved). This setting determines how the internal burst counter increments addresses and cannot be changed dynamically during active bursts.
How does the CY7C1470BV25-167BZXC handle bus contention during write cycles?
During the data portion of a write sequence, the device automatically tri-states all DQ and DQP outputs regardless of OE state - preventing bus contention without requiring external bus arbitration logic. This behavior is hardwired in the NoBL™ control logic and occurs synchronously with the write data capture clock edge.
Can CE2 be used as an active-low enable like CE1 and CE3?
No - CE2 is defined as active-HIGH per the datasheet and pin definition table. Using it as active-low would violate the device's synchronous enable protocol and may cause undefined behavior or failed accesses. CE1 and CE3 must both be active-low, while CE2 must be active-high for proper chip selection.
Is the ZZ Sleep Mode supported in the CY7C1470BV25-167BZXC variant?
Yes - the ZZ pin is present and functional in the 100-pin TQFP package (Pin 81), enabling hardware-controlled deep sleep mode to reduce standby current. When asserted LOW, ZZ places the device in low-power state with retention of memory contents; recovery time is specified as 20 ns max after ZZ deassertion.
CY7C1470BV25-167BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV25-167BZXC FAQ
1.How can I place an order for CY7C1470BV25-167BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV25-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV25-167BZXC reliable?
The price and inventory of CY7C1470BV25-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-167BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1470BV25-167BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-167BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV25-167BZXC?
CY7C1470BV25-167BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV25-167BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV25-167BZXC?
For technical support, including CY7C1470BV25-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-167BZXC requirements.
6.How does Aetrix verify that CY7C1470BV25-167BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV25-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-167BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1470BV25-167BZXC?
All CY7C1470BV25-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-167BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV25-167BZXC part is unused and in its original packaging.
Return procedure for CY7C1470BV25-167BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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