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Cypress Semiconductor Corp CY7C1470BV25-200AXI

Part No.:
CY7C1470BV25-200AXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1470BV25-200AXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,555

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Product details

Overview

CY7C1470BV25-200AXI from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory interfaces in network packet buffers and telecom line cards. It operates at 200 MHz with zero wait states, supports 2.5 V core and I/O supply, delivers 3.0 ns clock-to-output delay, and features fully registered inputs/outputs with byte-write capability.

For engineers reviewing the CY7C1470BV25-200AXI datasheet, CY7C1470BV25-200AXI pinout, CY7C1470BV25-200AXI application, or CY7C1470BV25-200AXI equivalent, key selection criteria include burst order configuration (linear/interleaved), synchronous self-timed write timing, JTAG boundary-scan support, and TQFP/FBGA package compatibility for PCB layout and thermal management.

Technical Context

The device implements a fully synchronous, rising-edge-triggered pipeline with three chip enables (CE1 active-low, CE2 active-high, CE3 active-low), Clock Enable (CEN) for cycle extension, and ADV/LD for burst address control. All address, data, and control signals pass through input registers synchronized to CLK.

Output drivers are synchronously tri-stated during write data phases, eliminating bus contention. Internal self-timed write logic removes external write pulse timing constraints, while MODE pin selects linear or interleaved burst order-critical for cache coherency and DMA engine alignment.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 or 4M × 18 configuration)
Max Clock Frequency 200 MHz - enables sustained 200 MT/s throughput without wait states
Access Time (tCO) 3.0 ns - deterministic clock-to-output delay for timing-critical read paths
Supply Voltage 2.5 V core (VDD) and 2.5 V I/O (VDDQ) - compatible with legacy 2.5 V system rails
Burst Capability Linear or interleaved - selectable via MODE pin for alignment with processor or ASIC burst engines
Power Consumption 450 mA max operating current - defines thermal envelope for dense memory subsystems
JTAG Support IEEE 1149.1 compliant - enables boundary-scan testing of memory interconnects on production PCBs

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm). Pin functions validated per Cypress Document 001-15032 Rev. *O.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference; qualified by CEN
CEN Clock enable Active-low; suspends clock recognition without deselecting device, extending previous cycle
ADV/LD Address advance/load control High = increment internal burst counter; Low = load new address from A[18:0]
BWa–BWd Byte write select (active-low) Independent control of four 9-bit data groups (DQa/DQPa through DQd/DQPd)
MODE Burst order configuration Strap pin: HIGH = interleaved burst; LOW = linear burst; must remain static during operation
ZZ Deep sleep mode enable Asynchronous entry into low-power state (<120 µA standby current)

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Enables true back-to-back read/write operations with no wait states, maximizing bandwidth utilization
Fully registered I/O path All inputs latched and outputs registered on CLK rising edge - simplifies timing closure in FPGA/ASIC interfaces
Synchronous self-timed writes Eliminates external write pulse width constraints; internal logic guarantees reliable write completion
Byte-selectable write masking Four independent BW pins allow partial-word updates without read-modify-write cycles
Configurable burst order MODE pin selects linear or interleaved addressing - matches CPU, DSP, or network processor burst patterns

Applications

Network Packet Buffer Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with MAC or switch fabric ASICs.

Use Value: 200 MHz zero-wait-state operation sustains full line-rate packet buffering without stalling ingress/egress pipelines.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface units.

IC Role / Device Role / Timing Role: Synchronous burst memory supporting deterministic latency for jitter-sensitive TDM and ATM cell handling.

Use Value: 3.0 ns tCO and fully registered I/O ensure setup/hold compliance with high-speed SerDes PHY timing budgets.

Baseband Processing Cache Radar Signal Processing Buffer

Use Scenario: Temporary storage for channel estimation and equalization coefficients in LTE/5G baseband processors.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed by multi-core DSP clusters via shared bus or crossbar.

Use Value: Byte-write capability enables efficient coefficient updates without corrupting adjacent data in 36-bit wide memory words.

Use Scenario: Real-time buffering of ADC samples and FFT intermediate results in phased-array radar front ends.

IC Role / Device Role / Timing Role: Pipelined memory supporting continuous burst reads/writes synchronized to radar pulse repetition interval.

Use Value: Interleaved burst mode aligns with FFT butterfly access patterns, reducing memory controller overhead by 40% vs. linear addressing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 3.3 V core/I/O; 10 ns tCO at 100 MHz; supports ZBT™ but not NoBL™ architecture Lacks zero-wait-state back-to-back capability; requires external OE timing control Choose when migrating legacy 3.3 V ZBT designs where power efficiency and burst depth are secondary to pin compatibility
ISSI IS61WV102436BLL-150TQLI 2.5 V core/I/O; 150 MHz max; 3.5 ns tCO; no JTAG or ZZ sleep mode Missing IEEE 1149.1 boundary scan and deep-sleep functionality Choose for cost-sensitive industrial control applications where testability and ultra-low standby current are not required

Compared with IDT72T36120L10BG and IS61WV102436BLL-150TQLI, CY7C1470BV25-200AXI uniquely delivers 200 MHz zero-wait-state operation with integrated JTAG testability and configurable burst order-enabling higher throughput and lower system-level validation effort in telecom and defense systems.

Availability

CY7C1470BV25-200AXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1470BV25-200AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for applications demanding deterministic, wait-state-free memory access in high-speed packet processing and real-time signal chains.

FAQ

What is the function of the MODE pin on CY7C1470BV25-200AXI?

The MODE pin is a strap input that selects burst address order: pulled HIGH for interleaved burst (default when floating), or pulled LOW for linear burst. It must remain static during device operation and is sampled only at power-up or reset. This setting determines how the internal address counter increments during burst accesses and directly affects compatibility with host processor burst engines.

Does CY7C1470BV25-200AXI support asynchronous output enable (OE)?

Yes, OE is an asynchronous active-low input that controls I/O direction. When asserted LOW, outputs are enabled; when HIGH, outputs enter high-impedance state. However, OE is masked during write data phases, first clock after deselection, and full device deselection-ensuring automatic tri-state behavior without external timing control.

How does the Clock Enable (CEN) pin affect timing behavior?

CEN is a synchronous active-low input that qualifies CLK. When CEN is HIGH, CLK is ignored and all internal states hold; when LOW, CLK is recognized and operations proceed. Unlike chip disable, CEN assertion extends the previous clock cycle without disrupting pipeline state-enabling precise cycle stretching for glueless interface with slower controllers.

Can CY7C1470BV25-200AXI be used in place of ZBT™ SRAMs?

Yes, it is pin-compatible and functionally equivalent to ZBT™ devices, supporting identical control protocols and timing models. However, CY7C1470BV25-200AXI adds NoBL™ advantages: zero-wait-state back-to-back operations, internal self-timed writes, and MODE-configurable burst order-providing measurable throughput gains in burst-intensive applications.

CY7C1470BV25-200AXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1470BV25-200AXI FAQ

1.How can I place an order for CY7C1470BV25-200AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470BV25-200AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV25-200AXI reliable?

The price and inventory of CY7C1470BV25-200AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-200AXI is usually 5 days.

3.What payment methods are accepted for CY7C1470BV25-200AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-200AXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470BV25-200AXI?

CY7C1470BV25-200AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470BV25-200AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470BV25-200AXI?

For technical support, including CY7C1470BV25-200AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-200AXI requirements.

6.How does Aetrix verify that CY7C1470BV25-200AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV25-200AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-200AXI meets industry standards.

7.What is the process for return or replacement of CY7C1470BV25-200AXI?

All CY7C1470BV25-200AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-200AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV25-200AXI part is unused and in its original packaging.

Return procedure for CY7C1470BV25-200AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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