Cypress Semiconductor Corp CY7C1470BV25-200BZI

Overview

CY7C1470BV25-200BZI from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 200 MHz with zero wait states, supports 2.5V core and I/O supply, delivers 3.0 ns clock-to-output delay, and enables true back-to-back read/write transitions in burst or single-access mode.

For engineers reviewing the CY7C1470BV25-200BZI datasheet, CY7C1470BV25-200BZI pinout, CY7C1470BV25-200BZI application, or CY7C1470BV25-200BZI equivalent, this device serves as a pin-compatible ZBT™-equivalent SRAM optimized for low-latency, high-bandwidth packet buffering, cache coherency tracking, and FPGA/ASIC interface acceleration where deterministic timing and byte-selectable writes are critical.

Technical Context

The CY7C1470BV25-200BZI implements fully registered synchronous interfaces: all address, control, and data inputs pass through rising-edge-triggered input registers, while outputs are latched by output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without inter-cycle gaps.

It uses three synchronous chip enables (CE1 active-low, CE2 active-high, CE3 active-low), asynchronous OE for output tri-state control, and CEN to gate clock recognition-allowing cycle extension without deselection. Burst order (linear or interleaved) is set by the MODE strap pin, and self-timed write circuitry ensures consistent write completion independent of external timing margins.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), Pb-free, RoHS-compliant, JEDEC-standard footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with CY7C1470BV25-250BZI, this 200 MHz variant trades peak frequency for lower power and relaxed timing closure; versus IDT72V2115L10PF, it offers simpler single-clock control and ZBT™ compatibility at the cost of no true dual-port capability.

Availability

CY7C1470BV25-200BZI is available at Aetrix Electronics and suitable for packet buffering, cache coherency tracking, FPGA protocol acceleration, and telecom frame storage requiring stable component supply across extended production lifecycles.

Supply support for CY7C1470BV25-200BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT™ SRAMs in systems demanding zero-wait-state, high-frequency, burst-capable memory with simplified timing and robust signal integrity.

FAQ

What is the function of the MODE pin on CY7C1470BV25-200BZI?

The MODE pin is a static configuration input that selects burst order: tied HIGH for interleaved burst (e.g., 0,2,4,6), pulled LOW for linear burst (e.g., 0,1,2,3). It must be held stable during operation and defaults to HIGH if left floating. This setting determines how the internal burst counter increments during sequential accesses initiated by ADV/LD.

How does the ZZ (Sleep) pin reduce power consumption?

Asserting ZZ LOW places the device into deep sleep mode, disabling internal clocks, output drivers, and most logic blocks while retaining memory contents. This reduces standby current to ≤120 mA - critical for power-sensitive telecom modules where memory remains idle between traffic bursts but must retain state.

Can CY7C1470BV25-200BZI operate with only two chip enables?

No. The device requires all three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) to be asserted simultaneously at the rising CLK edge to initiate any access. CE2's active-high polarity and the three-signal decode scheme are fixed per datasheet and cannot be bypassed or reduced to two signals without violating functional operation.

Is the CY7C1470BV25-200BZI compatible with 3.3V I/O interfaces?

No. It requires strict 2.5V ±0.2V for both VDD (core) and VDDQ (I/O), and is not 3.3V-tolerant. Connecting to 3.3V logic without level translation risks damage or undefined behavior. Interface with 3.3V FPGAs or processors requires dedicated 2.5V-compatible I/O banks or external level shifters.