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Cypress Semiconductor Corp CY7C1470BV33-167AXI

Part No.:
CY7C1470BV33-167AXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1470BV33-167AXI.pdf
Description:
IC SRAM 72MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:243

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Product details

Overview

CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with zero wait states, supports 3.3 V core and 3.3 V/2.5 V I/O supplies, and delivers 3.4 ns clock-to-output time. Its fully registered inputs/outputs and byte-write capability enable true back-to-back read/write operations in burst-capable systems.

For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include its 100-pin TQFP package, synchronous self-timed write control, IEEE 1149.1 JTAG compliance, and support for linear/interleaved burst modes - all critical for deterministic latency in packet buffering and cache coherency designs.

Technical Context

The CY7C1470BV33 implements a fully synchronous, pipelined memory interface where all address, control, and data signals are registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers without inter-cycle gaps.

It features four independent byte-write enables (BWa–BWd), three chip enables (CE1/CE2/CE3) with mixed polarity for flexible bank decoding, and an asynchronous OE that is masked during write cycles to prevent bus contention. The device supports both linear and interleaved burst addressing and includes ZZ Sleep Mode for dynamic power reduction.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 organization)
Max Clock Frequency167 MHz - enables 167 million read/write operations per second
Access Time3.4 ns - defines minimum clock-to-output delay for timing-critical interfaces
Supply Voltage3.3 V core, 3.3 V/2.5 V I/O - supports mixed-voltage system integration
Operating Current450 mA max - determines thermal design margin and power rail sizing
Standby Current120 mA max - sets baseline power consumption during idle periods
Burst CapabilityLinear or interleaved - matches CPU or ASIC burst patterns without address re-issuance

Pinout & Package

The CY7C1470BV33 is packaged in a JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) with exposed pad for thermal management. Pin assignments are validated per Document 001-15031 Rev. *O, Figure 1.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Synchronous Address Input18-bit address bus sampled on rising CLK edge; selects one of 2M locations
BWa–BWdSynchronous Byte Write SelectActive-low controls DQa/DQPa through DQd/DQPd; enables 8-bit granularity writes
CLK, CENClock & EnableRising-edge-triggered clock qualified by CEN; CEN deassertion extends previous cycle without deselection
CE1, CE2, CE3Chip Enable GroupMixed-polarity enables (CE1/CE3 active low, CE2 active high) allow hierarchical memory banking
OEAsynchronous Output EnableTri-states outputs when HIGH; masked during write data phase to avoid bus conflicts
DQa–DQd, DQPa–DQPdBidirectional Data I/O36-bit data bus with parity bits (DQPa–DQPd); direction controlled by OE and internal state
ADV/LDBurst Address ControlHIGH advances internal counter; LOW loads new address - enables burst vs. random access mode selection
ZZDeep Sleep ControlActive-low entry into low-power sleep mode; reduces current draw while preserving data

Key Features

FeatureDesign Value
No Bus Latency™ ArchitectureEnables unlimited back-to-back read/write operations with zero wait states - eliminates pipeline stalls in high-bandwidth switching fabrics
Fully Registered InterfaceAll inputs and outputs synchronized to CLK rising edge - ensures deterministic setup/hold timing across temperature and voltage
Synchronous Self-Timed WritesOn-chip write timing control eliminates external write pulse generation - simplifies controller logic and improves reliability
IEEE 1149.1 JTAG Boundary ScanSupports in-system test and debug of memory interconnects - critical for high-density PCB validation
3.3 V Core / Dual-Voltage I/OAllows direct interfacing with 2.5 V or 3.3 V logic families without level shifters - reduces BOM count and board area

Applications

Packet Buffering in Switch ASICsCache Coherency Directory Storage

Use Scenario: High-speed Ethernet switch fabric buffers ingress/egress packets before forwarding decisions.

IC Role / Device Role / Timing Role: Primary burst-access SRAM for temporary packet payload storage with deterministic 3.4 ns access latency.

Use Value: Enables full-line-rate buffering at 10 Gbps+ with zero wait-state throughput, reducing packet loss under burst traffic.

Use Scenario: Multi-core processor cluster maintains shared memory coherency using directory-based protocols.

IC Role / Device Role / Timing Role: Low-latency tag/directory memory supporting concurrent read-modify-write operations across cores.

Use Value: Fully registered interface ensures timing closure at 167 MHz across large die-to-die interconnects, improving scalability.

Telecom Line Card Frame BuffersReal-Time Signal Processing FIFOs

Use Scenario: SONET/SDH line cards buffer frame-aligned data between framer and DSP subsystems.

IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as elastic buffer between asynchronous clock domains.

Use Value: ZZ Sleep Mode reduces standby power by >60% during idle frames, meeting NEBS Level 3 thermal requirements.

Use Scenario: Radar or baseband processing chain requires deep, low-jitter FIFOs for ADC sample streaming.

IC Role / Device Role / Timing Role: Pipelined SRAM configured as dual-port FIFO with ADV/LD-controlled burst addressing.

Use Value: Linear burst mode delivers continuous 36-bit samples at 167 MHz without address overhead, minimizing jitter accumulation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L10PFI100-pin TQFP, 2M × 36, 100 MHz max clock, 4.5 ns accessLower speed grade; lacks ZZ Sleep Mode and JTAG scanPreferred for cost-sensitive, non-burst-intensive legacy systems where 100 MHz suffices
ISSI IS61WV204836BLL-167TQLI100-pin TQFP, 2M × 36, 167 MHz, 3.4 ns access, no NoBL™ or burst modeSingle-cycle random access only; no burst addressing or ADV/LD controlSelected when deterministic single-access latency is prioritized over burst throughput

Compared with IDT72V2115L10PFI and IS61WV204836BLL-167TQLI, the CY7C1470BV33 uniquely delivers zero-wait-state burst operation and integrated sleep control - essential for next-generation packet-processing pipelines requiring both bandwidth and dynamic power scaling.

Availability

CY7C1470BV33 is available at Aetrix Electronics and suitable for packet buffering, cache coherency, telecom frame storage, and real-time signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in networking infrastructure and real-time embedded systems.

FAQ

What is the function of the ADV/LD pin in CY7C1470BV33?

The ADV/LD pin controls burst address generation: when HIGH (with CEN active), it advances the internal burst counter; when LOW, it loads a new starting address from A[17:0]. This enables seamless transition between sequential burst access and random-address operation without external address sequencing logic.

Does CY7C1470BV33 support 2.5 V I/O operation?

Yes - the device supports 2.5 V I/O voltage via the dedicated VDDQ supply pin, while maintaining 3.3 V core operation. This allows direct interface with 2.5 V logic families without level shifters, provided VDDQ is externally regulated to 2.5 V ±0.1 V and meets AC loading specifications in the datasheet.

How does the ZZ Sleep Mode reduce power consumption?

When ZZ is asserted LOW, the device enters deep sleep mode, disabling internal clocks and output drivers while retaining memory contents. This reduces operating current from 450 mA to ≤120 mA - matching standby current - making it ideal for intermittent traffic scenarios in telecom and networking equipment.

Is CY7C1470BV33 pin-compatible with ZBT™ SRAMs?

Yes - the CY7C1470BV33 is explicitly designed to be pin-compatible and functionally equivalent to standard ZBT™ SRAMs. This allows drop-in replacement in existing ZBT-based designs while delivering enhanced features including NoBL™ architecture, ZZ Sleep Mode, and JTAG boundary scan.

CY7C1470BV33-167AXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1470BV33-167AXI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV33-167AXI reliable?

The price and inventory of CY7C1470BV33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167AXI is usually 5 days.

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CY7C1470BV33-167AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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5.How can I obtain technical support or documentation for CY7C1470BV33-167AXI?

For technical support, including CY7C1470BV33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-167AXI requirements.

6.How does Aetrix verify that CY7C1470BV33-167AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-167AXI meets industry standards.

7.What is the process for return or replacement of CY7C1470BV33-167AXI?

All CY7C1470BV33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV33-167AXI part is unused and in its original packaging.

Return procedure for CY7C1470BV33-167AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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