Cypress Semiconductor Corp CY7C1470BV33-167BZXC
- Part No.:
- CY7C1470BV33-167BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-167BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:561
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Product details
Overview
CY7C1470BV33-167BZXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.4 ns clock-to-output access time. Its fully registered inputs/outputs enable true back-to-back read/write operations in burst or single-cycle modes.
For engineers reviewing the CY7C1470BV33-167BZXC datasheet, CY7C1470BV33-167BZXC pinout, CY7C1470BV33-167BZXC application, or CY7C1470BV33-167BZXC equivalent, key selection criteria include its 100-pin TQFP package, byte-write capability across four 9-bit data groups (DQa–DQd + DQPa–DQPd), synchronous self-timed write control, and JTAG-compliant boundary scan support for system-level testability.
Technical Context
The device implements a pipelined No Bus Latency™ architecture with fully synchronous input and output registers clocked on the rising edge of CLK, enabling consecutive read/write transfers without bus turnaround delay. All address, control, and byte-write signals are sampled synchronously, while OE remains asynchronous for output tri-state control during write sequences.
It integrates burst logic supporting linear or interleaved addressing, internal self-timed write circuitry eliminating external write timing constraints, and three chip enables (CE1 low, CE2 high, CE3 low) for flexible bank selection. The ZZ Sleep Mode and Stop Clock option provide power management in idle states without losing data integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling 72-bit wide data paths for high-bandwidth packet buffering. |
| Max Clock Frequency | 167 MHz - supports sustained 167 MT/s throughput with no wait states in pipelined operation. |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing-critical read cycles in synchronous systems. |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - allows interoperability with both 3.3 V and 2.5 V logic families. |
| Operating Current | 450 mA max - determines thermal design margin and power delivery requirements for sustained burst operation. |
| Standby Current | 120 mA max - sets baseline power consumption during low-activity periods with CEN deasserted. |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - surface-mount compatible with standard PCB assembly processes and thermal relief pads. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, 0.5 mm pitch, body size 14 mm × 20 mm × 1.4 mm.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | 2M-word addressing (221 = 2M); sampled on rising CLK edge to select memory location. |
| BWa–BWd | Synchronous Byte Write Select | Four independent 9-bit write masks (DQa/DQPa through DQd/DQPd); qualified with WE for partial writes. |
| CLK | System Clock Input | Rising-edge-triggered master clock; gated by CEN to suspend operation without cycle termination. |
| CEN | Clock Enable | Active-low synchronous gate for CLK; extends previous cycle when deasserted, preserving pipeline state. |
| CE1, CE2, CE3 | Chip Enable Group | Three-input decode (CE1=L, CE2=H, CE3=L) for bank selection in multi-SRAM configurations. |
| OE | Asynchronous Output Enable | Tri-states DQ/DQP outputs when HIGH; masked during write data phase to prevent bus contention. |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus (four 9-bit groups); DQP pins serve as parity outputs in optional parity mode. |
| ADV/LD | Burst Address Control | HIGH advances internal counter for burst reads/writes; LOW loads new address from A[17:0]. |
| ZZ | Deep Sleep Control | Asynchronous entry into low-power sleep mode; retains data but disables clocks and I/O drivers. |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Pipelined Architecture | Enables unlimited back-to-back read/write operations with zero wait states, doubling effective bandwidth vs. asynchronous SRAM. |
| Byte-Write Select Logic | Four independent 9-bit write masks (BWa–BWd) allow granular 1–36 bit writes without read-modify-write overhead. |
| Synchronous Self-Timed Writes | On-chip write timing eliminates external write pulse generation, simplifying controller interface and improving reliability. |
| JTAG Boundary Scan (IEEE 1149.1) | Full scan chain support enables board-level interconnect testing and in-system debug without additional test fixtures. |
| Flexible Burst Modes | Configurable linear or interleaved burst order via MODE pin, matching legacy ZBT™ and modern processor cache behaviors. |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules requiring deterministic latency and burst depth. IC Role / Device Role / Timing Role: Primary data buffer between SERDES and traffic manager ASIC, operating at 167 MHz with full 36-bit bus utilization. Use Value: 3.4 ns access time and zero-wait-state pipelining ensure sub-6 ns read-to-read latency across consecutive packets, meeting SONET jitter budgets. |
Use Scenario: Temporary storage for ingress/egress packet headers and payloads in Layer 2/3 switches with deep buffer requirements. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used in shared memory switch fabric, configured for interleaved burst reads to match packet header alignment. Use Value: Byte-write capability (BWa–BWd) enables efficient 1–16 byte header updates without full-word overwrite, reducing memory bandwidth pressure. |
| Baseband Processing Units | Industrial Real-Time Controllers |
|
Use Scenario: Frame buffering in 4G/LTE baseband units where TDMA slot timing demands strict read/write predictability. IC Role / Device Role / Timing Role: Synchronous memory co-located with FPGA-based channel processors, using ADV/LD to manage cyclic frame buffers. Use Value: Fully registered I/O and CEN-controlled clock gating allow precise synchronization with FPGA logic clocks, eliminating metastability risks. |
Use Scenario: Deterministic data logging and motion control loop storage in CNC and PLC systems requiring guaranteed worst-case access. IC Role / Device Role / Timing Role: Local memory for real-time OS task stacks and sensor history buffers, accessed via microcontroller's external bus interface. Use Value: ZZ Sleep Mode reduces standby current to <120 mA while retaining data, extending uptime in battery-backed industrial enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2M × 36, 15 ns access, 133 MHz max, 165-ball FBGA only - lacks ZZ sleep mode and JTAG scan. | Targeted at cost-sensitive telecom systems where lower speed suffices and package flexibility is not required. | Select when JTAG testability and deep-sleep power savings are non-critical, and FBGA footprint is acceptable. |
| ISSI IS61WV204836BLL-167TQLI | 2M × 36, 167 MHz, 3.3 V only, 100-pin TQFP - no DQP parity pins, no ADV/LD burst control, no IEEE 1149.1 support. | Suitable for simpler embedded controllers needing basic pipelined SRAM without advanced test or burst features. | Choose when parity, burst address sequencing, and boundary scan are unnecessary, and BOM cost is primary driver. |
Compared with IDT72V2115L15PF and IS61WV204836BLL-167TQLI, CY7C1470BV33-167BZXC uniquely combines 100-pin TQFP packaging, integrated JTAG, ZZ sleep mode, and full NoBL™ burst control-making it optimal for space-constrained, testable, and power-aware telecom and industrial designs.
Availability
CY7C1470BV33-167BZXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and industrial real-time controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY7C1470BV33-167BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.
CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfaces in telecom infrastructure, enterprise networking, and real-time embedded systems.
FAQ
What is the function of the ADV/LD pin in CY7C1470BV33-167BZXC?
The ADV/LD pin controls burst address sequencing: when HIGH (with CEN active), it advances the internal address counter for consecutive burst accesses; when LOW, it loads a new base address from A[17:0]. This dual-mode operation enables both sequential packet buffering and random-access configuration register updates without external address generation logic.
Does CY7C1470BV33-167BZXC support 2.5 V I/O signaling?
Yes - the device supports 2.5 V I/O operation via the VDDQ supply pin, while maintaining 3.3 V core voltage (VDD). This allows direct interfacing with 2.5 V FPGAs and ASICs without level shifters, provided VDDQ is set to 2.5 V ± 0.1 V and all I/O timing parameters are validated per the 2.5 V AC specifications in the datasheet.
How does the ZZ Sleep Mode affect data retention and wake-up time?
In ZZ Sleep Mode, the device enters ultra-low-power state with current draw ≤120 mA while retaining full memory contents. Wake-up is asynchronous and completes within one CLK cycle after ZZ is deasserted, with no initialization delay - critical for real-time systems requiring rapid resumption of packet processing.
Can CY7C1470BV33-167BZXC be used in place of ZBT™-compatible SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT™ SRAMs (e.g., IDT72V2115), supporting identical control protocols, burst orders, and timing models. No hardware or firmware changes are needed beyond verifying VDDQ compatibility and confirming ADV/LD usage matches existing ZBT™ implementation.
CY7C1470BV33-167BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-167BZXC FAQ
1.How can I place an order for CY7C1470BV33-167BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-167BZXC reliable?
The price and inventory of CY7C1470BV33-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-167BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-167BZXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1470BV33-167BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-167BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-167BZXC?
For technical support, including CY7C1470BV33-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-167BZXC requirements.
6.How does Aetrix verify that CY7C1470BV33-167BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-167BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-167BZXC?
All CY7C1470BV33-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-167BZXC part is unused and in its original packaging.
Return procedure for CY7C1470BV33-167BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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