Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C1470V33-167AXI

Part No.:
CY7C1470V33-167AXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1470V33-167AXI.pdf
Description:
IC SRAM 72MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,371

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1470V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit pipelined synchronous SRAM with NoBL™ architecture, configured as 2M × 36, supporting 167 MHz bus operation with zero wait states, 3.3 V core supply, 3.3 V/2.5 V I/O supply, and 3.4 ns clock-to-output time. It enables true back-to-back read/write in high-throughput networking buffers.

For engineers reviewing the CY7C1470V33 datasheet, CY7C1470V33 pinout, CY7C1470V33 application, or CY7C1470V33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write capability (BWa–BWd), synchronous self-timed writes, JTAG boundary scan compliance, and TQFP/FBGA package options for memory subsystem integration.

Technical Context

The device implements fully registered inputs and outputs synchronized to the rising edge of CLK, with CEN enabling clock suspension and ZZ supporting sleep mode. Internal NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers on every clock cycle without wait states.

It supports three chip enables (CE1–CE3) and asynchronous OE for bank selection and output tristate control, while synchronous write timing is managed via on-chip self-timed circuitry. Burst addressing follows linear or interleaved order, and byte write selects (BWa–BWd) allow granular 8-bit write control within the 36-bit data bus.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency167 MHz - supports sustained burst throughput without wait states
Access Time3.4 ns - defines minimum clock-to-output delay for timing-critical interfaces
Supply Voltage3.3 V core, 3.3 V/2.5 V I/O - enables interoperability with mixed-voltage SoC buses
Power Consumption450 mA max operating current - determines thermal design margin at full-speed operation
Burst ModeLinear or interleaved - matches CPU or network processor prefetch patterns
JTAG SupportIEEE 1149.1 compliant - enables in-system test and debug during board validation

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and non-Pb-free 165-ball FBGA (15 × 17 × 1.4 mm). Pin functions validated per Document Number 38-05289 Rev. *Y.

Pin/TerminalCircuit RoleDesign Meaning
CLKPrimary synchronous clock inputQualifies all register transfers; rising-edge triggered for input/output registration
CENClock enable controlDeassertion suspends internal clocking while preserving state - reduces dynamic power
CE1–CE3Chip enable inputsThree-level decode for multi-bank memory expansion without external logic
BWa–BWdByte write enablesIndependent 8-bit write masking for 36-bit data bus - avoids read-modify-write cycles
OEAsynchronous output enableTristates DQ outputs independently of clock - prevents bus contention during writes
ZZDeep sleep controlMust be externally tied to GND per errata (Page 35); enables ultra-low standby current mode

Key Features

FeatureDesign Value
No Bus Latency™ architectureEnables unlimited back-to-back read/write operations with zero wait states - doubles effective bandwidth vs. conventional SRAM
Synchronous self-timed writesEliminates external write pulse timing constraints - simplifies controller interface design
Byte write capability (BWa–BWd)Supports partial 8-bit writes within 36-bit word - critical for packet header updates in telecom buffers
3.3 V/2.5 V I/O compatibilityAllows direct connection to both 3.3 V and 2.5 V logic families - reduces level-shifter count in mixed-voltage systems
JTAG boundary scan (IEEE 1149.1)Provides structural test access for PCB assembly verification - meets IPC-JEDEC JTAG compliance requirements

Applications

Telecom Line CardsNetwork Packet Buffers

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches.

IC Role / Device Role / Timing Role: High-speed shared buffer between ingress and egress traffic managers, synchronized to 167 MHz system clock.

Use Value: Zero-wait-state pipelining ensures deterministic latency under bursty traffic loads up to 1.3 Gbps aggregate throughput.

Use Scenario: Temporary storage for deep packet inspection engines requiring rapid random-access lookups.

IC Role / Device Role / Timing Role: Dual-port accessible SRAM used as pattern-matching cache with simultaneous read/write access.

Use Value: Byte-write capability allows atomic header field updates without corrupting adjacent payload bytes.

Radar Signal ProcessingIndustrial Motion Controllers

Use Scenario: Real-time buffering of ADC samples from phased-array radar receivers before FFT processing.

IC Role / Device Role / Timing Role: Low-latency FIFO replacement with burst-read capability aligned to DSP memory fetch patterns.

Use Value: 3.4 ns clock-to-output and linear burst mode reduce pipeline stalls in time-critical signal chains.

Use Scenario: Storing motion profile trajectories and encoder feedback data in closed-loop servo drives.

IC Role / Device Role / Timing Role: Deterministic-access memory for real-time trajectory interpolation engines running at 100+ kHz update rates.

Use Value: Synchronous self-timed writes guarantee consistent write completion timing - essential for jitter-sensitive position control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2135L16PF2M × 36, 166 MHz, 3.3 V only I/O, no ZZ sleep modeLacks deep-sleep capability; higher standby current (150 mA vs. 120 mA)Select when JTAG test is not required and thermal headroom permits higher idle power
AS7C3256A-16JIN256K × 36, 166 MHz, asynchronous OE only, no burst modeLower density, no linear/interleaved burst - limits throughput in streaming applicationsSelect for cost-sensitive designs where burst bandwidth is not required and memory footprint is constrained

Compared with IDT72V2135L16PF and AS7C3256A-16JIN, CY7C1470V33 uniquely combines 72-Mbit density, NoBL™ zero-latency pipelining, byte-write granularity, and JTAG testability - making it optimal for high-reliability telecom and defense systems requiring verified structural test coverage and deterministic timing.

Availability

CY7C1470V33 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, radar signal processors, and industrial motion controllers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1470V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader focused on power systems, automotive, industrial, and security solutions, with headquarters in Munich, Germany.

This device belongs to Infineon's legacy Cypress high-performance memory portfolio, designed specifically for zero-latency, high-bandwidth buffering in real-time communication and signal processing infrastructure.

FAQ

What is the correct handling for the ZZ pin on CY7C1470V33?

The ZZ pin (Pin 64 in TQFP, Ball H11 in FBGA) must be externally connected to ground per documented errata on page 35 of datasheet 38-05289 Rev. *Y. Leaving ZZ floating or pulling high disables deep-sleep mode and may cause undefined standby behavior. This requirement applies regardless of whether sleep functionality is actively used in the design.

Does CY7C1470V33 support 2.5 V-only I/O operation?

Yes - the device supports 2.5 V I/O supply (VDDQ) while maintaining 3.3 V core (VDD), enabling direct interfacing with 2.5 V logic families. VDDQ must be decoupled independently from VDD, and I/O voltage tolerance is strictly limited to 2.5 V ±0.2 V when VDDQ = 2.5 V; exceeding this risks parametric failure per AC switching specifications.

How does the NoBL™ architecture improve system performance over standard synchronous SRAM?

NoBL™ eliminates bus turnaround delays by allowing immediate read-after-write or write-after-read transitions without wait states. Unlike conventional SRAMs requiring bus release/reacquisition, CY7C1470V33 pipelines address and data transfers continuously - achieving up to 2× effective bandwidth in burst-intensive applications like packet buffering and radar sampling.

Can CY7C1470V33 be used in place of ZBT SRAMs?

Yes - it is pin-compatible and functionally equivalent to ZBT devices per datasheet claims, supporting identical control protocols, burst orders, and timing models. However, designers must verify OE timing margins and confirm that CEN-based clock suspension meets their controller's power management sequence, as ZBT implementations vary in clock-gating behavior.

CY7C1470V33-167AXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1470V33-167AXI FAQ

1.How can I place an order for CY7C1470V33-167AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470V33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470V33-167AXI reliable?

The price and inventory of CY7C1470V33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V33-167AXI is usually 5 days.

3.What payment methods are accepted for CY7C1470V33-167AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V33-167AXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470V33-167AXI?

CY7C1470V33-167AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470V33-167AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470V33-167AXI?

For technical support, including CY7C1470V33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V33-167AXI requirements.

6.How does Aetrix verify that CY7C1470V33-167AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1470V33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V33-167AXI meets industry standards.

7.What is the process for return or replacement of CY7C1470V33-167AXI?

All CY7C1470V33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V33-167AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470V33-167AXI part is unused and in its original packaging.

Return procedure for CY7C1470V33-167AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1470V33-167AXI Tags

  • CY7C1470V33-167AXI
  • CY7C1470V33-167AXI PDF
  • CY7C1470V33-167AXI Datasheet
  • CY7C1470V33-167AXI Specifications
  • CY7C1470V33-167AXI Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C1470V33-167AXI
  • Buy CY7C1470V33-167AXI
  • CY7C1470V33-167AXI Price
  • CY7C1470V33-167AXI Distributor
  • CY7C1470V33-167AXI Supplier
  • CY7C1470V33-167AXI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER