Cypress Semiconductor Corp CY7C1470V33-167BZXI
- Part No.:
- CY7C1470V33-167BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470V33-167BZXI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470V33-167BZXI from Cypress Semiconductor is a 72 Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with 3.4 ns clock-to-output delay, supports byte-write control via four BW pins (BWa–BWd), uses single 3.3 V core supply and 3.3 V/2.5 V I/O supply, and delivers zero-wait-state back-to-back read/write operations in burst or single-access modes.
For engineers reviewing the CY7C1470V33-167BZXI datasheet, CY7C1470V33-167BZXI pinout, CY7C1470V33-167BZXI application, or CY7C1470V33-167BZXI equivalent, this device serves as a drop-in replacement for ZBT SRAMs in packet buffering, cache coherency, and FPGA interface applications requiring deterministic latency and full pipelining.
Technical Context
The CY7C1470V33-167BZXI implements fully registered synchronous operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to the same edge. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without inter-cycle gaps.
It features synchronous self-timed writes qualified by WE and BWa–BWd, internally timed output buffer control (removing need for asynchronous OE timing management), and dual-mode burst addressing (linear or interleaved) selected via the MODE strap pin. Clock Enable (CEN) suspends operation without deselecting the device, preserving internal state across clock gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling 72-bit-wide data paths for high-bandwidth packet buffers. |
| Max Clock Frequency | 167 MHz - defines maximum sustained transaction rate of 167 million read/write cycles per second. |
| Access Time (tCO) | 3.4 ns - guaranteed clock-to-output delay for timing-critical synchronous interfaces like ASIC/FPGA memory controllers. |
| Supply Voltages | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system integration and legacy 2.5 V logic compatibility. |
| Byte Write Pins | BWa–BWd (4 pins) - enables independent 9-bit write masking per DQ group (DQa/DQPa through DQd/DQPd), critical for partial-word updates. |
| Power Consumption | 450 mA max operating current, 120 mA CMOS standby - balances performance and thermal budget in dense line-card designs. |
| Package | 100-pin TQFP (14 × 14 mm) or 165-ball FBGA (15 × 17 mm) - surface-mount packages compatible with automated PCB assembly and thermal management requirements. |
Pinout & Package
CY7C1470V33-167BZXI is available in JEDEC-standard Pb-Free 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) and Pb-Free 165-ball FBGA (15 × 17 mm, 1.0 mm ball pitch). Both packages support industrial temperature range (–40°C to +85°C) and JTAG boundary scan (IEEE 1149.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 configuration. |
| BWa–BWd | Synchronous Byte Write Select | Active-low signals controlling 9-bit write enable per DQ group (e.g., BWa enables DQa/DQPa); qualified by WE. |
| CLK | Master Clock Input | Rising-edge-triggered timing reference for all synchronous operations; gated by CEN. |
| CEN | Clock Enable | Active-low input that masks CLK without deselecting device-enables cycle extension and power-aware clock gating. |
| CE1, CE3 | Synchronous Chip Enable (Low) | Used with CE2 (high-active) for 3-signal depth expansion; all three must be active for access initiation. |
| OE | Asynchronous Output Enable | Controls I/O direction: LOW enables output drivers; masked during write data phase to prevent bus contention. |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O (36-bit + 4-parity) | 36-bit data bus with optional parity; each DQ group paired with DQP for error detection in mission-critical systems. |
| ADV/LD | Advance/Load Control | LOW loads new address; HIGH advances internal burst counter-enables linear/interleaved burst reads without re-driving A[17:0]. |
| MODE | Burst Order Strap | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence; must remain stable during operation. |
| ZZ | Deep Sleep Mode | Active-low entry into low-power sleep state (<100 µA), reducing standby current while retaining data. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables true back-to-back read/write operations with no wait states-critical for packet forwarding engines requiring deterministic throughput. |
| Fully Registered Pipelining | All inputs and outputs synchronized to CLK rising edge-eliminates setup/hold violations and simplifies timing closure in high-speed FPGA/ASIC designs. |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write-pulse width constraints-reduces PCB routing complexity and improves signal integrity. |
| Byte-Write Capability (4× 9-bit) | Independent write enable per 9-bit segment allows precise partial-word updates without read-modify-write cycles-essential for header manipulation in network processors. |
| Zero-Wait-State Burst Access | Supports linear or interleaved 4-word bursts with single address load-reduces address bus traffic and controller overhead in streaming applications. |
| JTAG Boundary Scan (IEEE 1149.1) | Enables in-system testability and debug of memory interconnects-required for high-reliability telecom and industrial control board validation. |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Storing ingress/egress packets in Layer 3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfacing directly to packet parser and scheduler ASICs. Use Value: 167 MHz clock rate and 3.4 ns tCO ensure sub-6 ns round-trip access time, meeting 10 Gbps line-rate buffering requirements. |
Use Scenario: Providing low-latency scratchpad memory for Xilinx Virtex or Intel Stratix FPGA-based acceleration engines. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as instruction/data cache between FPGA fabric and external DDR controller. Use Value: Fully registered I/O and NoBL™ architecture eliminate timing closure bottlenecks at >150 MHz interface speeds. |
| Telecom Line Card Control Memory | Real-Time Signal Processing Buffer |
|
Use Scenario: Holding configuration tables and status registers in carrier-grade SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: Deterministic-access memory for real-time control plane updates and alarm logging. Use Value: ZZ sleep mode reduces standby power to <100 µA during idle periods-extending thermal headroom in fanless chassis. |
Use Scenario: Buffering I/Q samples between ADC/DAC and DSP cores in software-defined radio base stations. IC Role / Device Role / Timing Role: Burst-capable SRAM serving as ping-pong memory for continuous sample streaming. Use Value: Interleaved burst mode (via MODE pin) matches FFT engine addressing patterns-reducing address generation logic in DSP firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2M × 36, 15 ns access, 133 MHz max clock, 3.3 V only, no ZZ sleep mode. | Lacks deep-sleep and burst capability; suited for cost-sensitive non-real-time buffering. | Select when lower frequency and absence of sleep mode are acceptable, and JTAG is not required. |
| ISSI IS61WV204836BLL-167TQLI | 2M × 36, 167 MHz, 3.4 ns tCO, 3.3 V core/I/O, no parity pins or MODE strap. | Omits DQP parity lines and burst-order selection-simpler interface but no ECC support or configurable burst order. | Choose when parity and burst flexibility are unnecessary, and footprint compatibility with CY7C1470V33 is maintained. |
Compared with IDT72V2115L15PF and IS61WV204836BLL-167TQLI, CY7C1470V33-167BZXI uniquely combines NoBL™ zero-wait-state operation, programmable burst order, integrated parity I/O, and deep-sleep mode-making it optimal for latency-constrained, power-aware, and fault-tolerant telecom infrastructure.
Availability
CY7C1470V33-167BZXI is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor cache, and telecom line card control memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470V33-167BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1470V33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in packet-switched networks and real-time embedded systems.
FAQ
What is the function of the MODE pin on CY7C1470V33-167BZXI?
The MODE pin is a static strap input that selects burst addressing order: pulled LOW for linear burst (sequential address increment), HIGH for interleaved burst (bit-swapped increment). It must remain stable during operation; floating defaults to HIGH (interleaved). This setting directly determines how the internal burst counter increments during ADV/LD-HIGH cycles and affects compatibility with memory controller burst expectations.
Does CY7C1470V33-167BZXI support 2.5 V I/O signaling?
Yes-CY7C1470V33-167BZXI supports 2.5 V I/O operation via its dedicated VDDQ supply pin, while maintaining 3.3 V core voltage (VDD). This dual-supply design allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ is set to 2.5 V and all timing parameters (e.g., setup/hold) are validated per the 2.5 V I/O section of the datasheet.
How does the ZZ (Sleep) mode reduce power consumption?
Asserting ZZ LOW places CY7C1470V33-167BZXI into deep-sleep mode, reducing ICC standby current to under 100 µA while retaining memory contents. Unlike standard standby (CE-only), ZZ disables internal clocks and bias circuits more aggressively. Exit time is 100 ns max, and the device resumes normal operation on the next valid clock edge after ZZ is deasserted.
Can CY7C1470V33-167BZXI be used as a direct replacement for ZBT SRAMs?
Yes-CY7C1470V33-167BZXI is pin-compatible and functionally equivalent to ZBT SRAMs (e.g., IDT72V2115), supporting identical control protocols, timing models, and burst behaviors. Key differentiators include integrated ZZ sleep, MODE-selectable burst order, and parity I/O-features that extend functionality without compromising drop-in compatibility in existing ZBT-based designs.
CY7C1470V33-167BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470V33-167BZXI FAQ
1.How can I place an order for CY7C1470V33-167BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470V33-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470V33-167BZXI reliable?
The price and inventory of CY7C1470V33-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V33-167BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1470V33-167BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V33-167BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470V33-167BZXI?
CY7C1470V33-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470V33-167BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470V33-167BZXI?
For technical support, including CY7C1470V33-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V33-167BZXI requirements.
6.How does Aetrix verify that CY7C1470V33-167BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1470V33-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V33-167BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1470V33-167BZXI?
All CY7C1470V33-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V33-167BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470V33-167BZXI part is unused and in its original packaging.
Return procedure for CY7C1470V33-167BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1470V33-167BZXI Tags

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