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Cypress Semiconductor Corp CY7C1471BV25-133AXC

Part No.:
CY7C1471BV25-133AXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1471BV25-133AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:289

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Product details

Overview

CY7C1471BV25-133AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous flow-through SRAM with NoBL™ architecture, supporting true back-to-back read/write operations at 133 MHz with zero wait states, 6.5 ns clock-to-output delay, and 2.5V VDDQ I/O supply - deployed in high-throughput packet buffering and network switch data path applications.

For engineers reviewing the CY7C1471BV25-133AXC datasheet, CY7C1471BV25-133AXC pinout, CY7C1471BV25-133AXC application, or CY7C1471BV25-133AXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select granularity (4 × 9-bit bytes), synchronous chip enable logic (CE1/CE2/CE3), and JTAG boundary-scan testability for system-level validation.

Technical Context

This SRAM implements registered synchronous inputs qualified by CLK rising edge and CEN assertion, with internal self-timed write control eliminating external write pulse timing constraints. The NoBL™ architecture ensures no dead cycles between consecutive read/write transitions via on-chip burst counter and address steering logic.

It supports linear or interleaved burst orders selected by the MODE strap pin, provides asynchronous OE for output tri-state control independent of clock, and integrates automatic output driver tri-stating during write data phases to prevent bus contention - all while maintaining IEEE 1149.1 JTAG compliance for production test.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization), enabling single-chip replacement for dual 36-Mbit devices in telecom line cards.
Max Clock Frequency 133 MHz - supports full-speed DDR-like throughput without wait states in FPGA-to-SRAM interfaces.
Access Time 6.5 ns clock-to-output - guarantees deterministic latency for real-time traffic shaping in Layer 2/3 switches.
VDDQ Supply 2.5 V - compatible with 2.5V LVTTL and SSTL-2 I/O standards, reducing level-shifting complexity.
Burst Capability Linear or interleaved 4-word burst - matches CPU cache line sizes and DMA engine transfer widths.
Byte Write Control Four active-low BWx signals (BWA–BWD) - enables granular 9-bit writes without read-modify-write overhead.
Power Management ZZ sleep mode and CE deselect auto-power-down - reduces standby current to ≤120 mA in idle periods.

Pinout & Package

Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch), Pb-free compliant per JEDEC standard. Pin layout optimized for signal integrity in high-speed memory buses with dedicated VSS/VDDQ decoupling zones.

Pin/Terminal Circuit Role Design Meaning
A0, A1, A[2:18] Synchronous Address Input Sampled on CLK rising edge; A[1:0] drive internal 2-bit burst counter for sequential access.
BWA–BWD Synchronous Byte Write Select Active-low, qualified by WE; each controls one 9-bit data byte (DQA–DQD) during write cycles.
CE1, CE2, CE3 Synchronous Chip Enable Three enables (CE1/CE3 active-low, CE2 active-high) allow depth expansion up to 8× without external logic.
CLK, CEN Clock & Clock Enable CEN masks CLK without deselecting device - enables cycle extension for timing margin or power gating.
OE Asynchronous Output Enable Tri-states DQ/DQP pins immediately on deassertion; masked automatically during write data phase.
ZZ Asynchronous Sleep Input Active-high entry into low-power ZZ mode with data retention; internal pull-down allows floating for normal operation.
MODE Burst Order Strap GND = linear burst; VDD/floating = interleaved burst - sets burst sequence without register programming.

Key Features

Feature Design Value
No Bus Latency™ Architecture Eliminates dead cycles between read/write transitions - enables 100% bus utilization at 133 MHz in burst-mode traffic.
Registered Flow-Through Operation All inputs latched on CLK rising edge; outputs registered and aligned to clock - simplifies timing closure in FPGA-based systems.
Synchronous Self-Timed Writes Internal write timing control removes dependency on external write pulse width - improves reliability across voltage/temperature.
JTAG Boundary Scan (IEEE 1149.1) Full scan chain support on FBGA packages (TDO/TCK/TMS/TDI) - enables automated PCB test and interconnect verification.
Flexible Burst Configuration Hardware-strapped MODE pin selects burst order - avoids firmware overhead and eliminates configuration register failure modes.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in multi-gigabit switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with MAC and switching fabric logic.

Use Value: 133 MHz zero-wait-state operation sustains 9.5 Gbps aggregate throughput (36-bit × 133 MHz), matching 10GbE line rates.

Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring deterministic latency and burst alignment.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as time-division multiplexing (TDM) buffer with precise 4-word burst delivery.

Use Value: Linear burst mode aligns with STS-192 payload boundaries; 6.5 ns access enables sub-10 ns jitter-critical timing paths.

FPGA Co-Processor Cache Industrial Motion Controller Buffer

Use Scenario: Off-chip instruction/data cache for Xilinx Virtex or Intel Stratix FPGAs executing real-time control algorithms.

IC Role / Device Role / Timing Role: Low-latency memory extension with registered interface to match FPGA I/O timing models.

Use Value: Registered inputs eliminate setup/hold violations at 133 MHz; CE1/CE2/CE3 support banked memory mapping for parallel access.

Use Scenario: Buffered position/velocity command storage in CNC controllers synchronizing multiple servo axes.

IC Role / Device Role / Timing Role: Deterministic-access memory for motion profile look-up tables and real-time trajectory interpolation.

Use Value: ZZ sleep mode reduces power during axis dwell periods; byte-write capability enables efficient partial update of multi-axis parameter sets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L133PFI Same 2M × 36 density and 133 MHz speed, but uses QDR-II+ interface with separate read/write clocks and no MODE pin. Requires dual-clock routing and lacks ZZ sleep mode - less suitable for power-constrained embedded motion controllers. Select when migrating from legacy QDR designs or when simultaneous read/write bandwidth >133 MHz is required.
ISSI IS61WV204836BLL-133TQLI Pin-compatible 2M × 36 NoBL SRAM, identical 100-pin TQFP footprint and timing, but lacks JTAG and uses only two CE pins. No IEEE 1149.1 test support - limits production test coverage in high-reliability telecom hardware. Choose for cost-sensitive industrial applications where JTAG is unused and depth expansion beyond 4× is unnecessary.

Compared with IDT72V2115L133PFI and IS61WV204836BLL-133TQLI, CY7C1471BV25-133AXC uniquely combines JTAG testability, triple CE depth scalability, and hardware-configurable burst order - critical for field-upgradable telecom infrastructure and safety-certified motion systems.

Availability

CY7C1471BV25-133AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA co-processor cache, and industrial motion controller buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1471BV25-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

This device belongs to the NoBL™ SRAM product line, engineered specifically for zero-wait-state, burst-mode data buffering in high-speed networking and real-time control systems.

FAQ

What is the function of the MODE pin, and how must it be connected?

The MODE pin selects burst order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin sampled at power-up; no dynamic reconfiguration is supported. Leaving it unconnected defaults to interleaved mode due to internal pull-up behavior confirmed in Rev. *F datasheet Section 3.1.

Can CY7C1471BV25-133AXC operate with only two chip enables?

Yes - CE2 is active-high while CE1 and CE3 are active-low; any combination can be used for device selection. For simple single-bank operation, tie CE2 HIGH and use CE1 as primary enable, leaving CE3 HIGH or LOW per system decode logic - all three are independently sampled on CLK edge per datasheet Table 1.

Does the ZZ sleep mode retain data during power loss?

No - ZZ mode reduces active current to ≤120 mA while preserving data only as long as VDD and VDDQ remain within specification (2.3–2.7 V). It is not a battery-backed or nonvolatile state; full power loss results in memory content corruption, consistent with standard SRAM behavior.

Is the 100-pin TQFP package RoHS-compliant?

Yes - the "X" suffix in -133AXC denotes JEDEC-standard Pb-free packaging. Cypress documentation (Doc #001-15013 Rev. *F, Page 1) explicitly states CY7C1471BV25 is available in "Pb-free 100-pin TQFP", meeting RoHS Directive 2011/65/EU requirements.

CY7C1471BV25-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1471BV25-133AXC FAQ

1.How can I place an order for CY7C1471BV25-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1471BV25-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1471BV25-133AXC reliable?

The price and inventory of CY7C1471BV25-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1471BV25-133AXC is usually 5 days.

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CY7C1471BV25-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1471BV25-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1471BV25-133AXC?

For technical support, including CY7C1471BV25-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1471BV25-133AXC requirements.

6.How does Aetrix verify that CY7C1471BV25-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1471BV25-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1471BV25-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1471BV25-133AXC?

All CY7C1471BV25-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1471BV25-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1471BV25-133AXC part is unused and in its original packaging.

Return procedure for CY7C1471BV25-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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