Cypress Semiconductor Corp CY7C1471BV25-133AXC
- Part No.:
- CY7C1471BV25-133AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1471BV25-133AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:289
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Product details
Overview
CY7C1471BV25-133AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous flow-through SRAM with NoBL™ architecture, supporting true back-to-back read/write operations at 133 MHz with zero wait states, 6.5 ns clock-to-output delay, and 2.5V VDDQ I/O supply - deployed in high-throughput packet buffering and network switch data path applications.
For engineers reviewing the CY7C1471BV25-133AXC datasheet, CY7C1471BV25-133AXC pinout, CY7C1471BV25-133AXC application, or CY7C1471BV25-133AXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select granularity (4 × 9-bit bytes), synchronous chip enable logic (CE1/CE2/CE3), and JTAG boundary-scan testability for system-level validation.
Technical Context
This SRAM implements registered synchronous inputs qualified by CLK rising edge and CEN assertion, with internal self-timed write control eliminating external write pulse timing constraints. The NoBL™ architecture ensures no dead cycles between consecutive read/write transitions via on-chip burst counter and address steering logic.
It supports linear or interleaved burst orders selected by the MODE strap pin, provides asynchronous OE for output tri-state control independent of clock, and integrates automatic output driver tri-stating during write data phases to prevent bus contention - all while maintaining IEEE 1149.1 JTAG compliance for production test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling single-chip replacement for dual 36-Mbit devices in telecom line cards. |
| Max Clock Frequency | 133 MHz - supports full-speed DDR-like throughput without wait states in FPGA-to-SRAM interfaces. |
| Access Time | 6.5 ns clock-to-output - guarantees deterministic latency for real-time traffic shaping in Layer 2/3 switches. |
| VDDQ Supply | 2.5 V - compatible with 2.5V LVTTL and SSTL-2 I/O standards, reducing level-shifting complexity. |
| Burst Capability | Linear or interleaved 4-word burst - matches CPU cache line sizes and DMA engine transfer widths. |
| Byte Write Control | Four active-low BWx signals (BWA–BWD) - enables granular 9-bit writes without read-modify-write overhead. |
| Power Management | ZZ sleep mode and CE deselect auto-power-down - reduces standby current to ≤120 mA in idle periods. |
Pinout & Package
Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch), Pb-free compliant per JEDEC standard. Pin layout optimized for signal integrity in high-speed memory buses with dedicated VSS/VDDQ decoupling zones.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Synchronous Address Input | Sampled on CLK rising edge; A[1:0] drive internal 2-bit burst counter for sequential access. |
| BWA–BWD | Synchronous Byte Write Select | Active-low, qualified by WE; each controls one 9-bit data byte (DQA–DQD) during write cycles. |
| CE1, CE2, CE3 | Synchronous Chip Enable | Three enables (CE1/CE3 active-low, CE2 active-high) allow depth expansion up to 8× without external logic. |
| CLK, CEN | Clock & Clock Enable | CEN masks CLK without deselecting device - enables cycle extension for timing margin or power gating. |
| OE | Asynchronous Output Enable | Tri-states DQ/DQP pins immediately on deassertion; masked automatically during write data phase. |
| ZZ | Asynchronous Sleep Input | Active-high entry into low-power ZZ mode with data retention; internal pull-down allows floating for normal operation. |
| MODE | Burst Order Strap | GND = linear burst; VDD/floating = interleaved burst - sets burst sequence without register programming. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Eliminates dead cycles between read/write transitions - enables 100% bus utilization at 133 MHz in burst-mode traffic. |
| Registered Flow-Through Operation | All inputs latched on CLK rising edge; outputs registered and aligned to clock - simplifies timing closure in FPGA-based systems. |
| Synchronous Self-Timed Writes | Internal write timing control removes dependency on external write pulse width - improves reliability across voltage/temperature. |
| JTAG Boundary Scan (IEEE 1149.1) | Full scan chain support on FBGA packages (TDO/TCK/TMS/TDI) - enables automated PCB test and interconnect verification. |
| Flexible Burst Configuration | Hardware-strapped MODE pin selects burst order - avoids firmware overhead and eliminates configuration register failure modes. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in multi-gigabit switches before classification and forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with MAC and switching fabric logic. Use Value: 133 MHz zero-wait-state operation sustains 9.5 Gbps aggregate throughput (36-bit × 133 MHz), matching 10GbE line rates. |
Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring deterministic latency and burst alignment. IC Role / Device Role / Timing Role: Synchronous SRAM acting as time-division multiplexing (TDM) buffer with precise 4-word burst delivery. Use Value: Linear burst mode aligns with STS-192 payload boundaries; 6.5 ns access enables sub-10 ns jitter-critical timing paths. |
| FPGA Co-Processor Cache | Industrial Motion Controller Buffer |
|
Use Scenario: Off-chip instruction/data cache for Xilinx Virtex or Intel Stratix FPGAs executing real-time control algorithms. IC Role / Device Role / Timing Role: Low-latency memory extension with registered interface to match FPGA I/O timing models. Use Value: Registered inputs eliminate setup/hold violations at 133 MHz; CE1/CE2/CE3 support banked memory mapping for parallel access. |
Use Scenario: Buffered position/velocity command storage in CNC controllers synchronizing multiple servo axes. IC Role / Device Role / Timing Role: Deterministic-access memory for motion profile look-up tables and real-time trajectory interpolation. Use Value: ZZ sleep mode reduces power during axis dwell periods; byte-write capability enables efficient partial update of multi-axis parameter sets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L133PFI | Same 2M × 36 density and 133 MHz speed, but uses QDR-II+ interface with separate read/write clocks and no MODE pin. | Requires dual-clock routing and lacks ZZ sleep mode - less suitable for power-constrained embedded motion controllers. | Select when migrating from legacy QDR designs or when simultaneous read/write bandwidth >133 MHz is required. |
| ISSI IS61WV204836BLL-133TQLI | Pin-compatible 2M × 36 NoBL SRAM, identical 100-pin TQFP footprint and timing, but lacks JTAG and uses only two CE pins. | No IEEE 1149.1 test support - limits production test coverage in high-reliability telecom hardware. | Choose for cost-sensitive industrial applications where JTAG is unused and depth expansion beyond 4× is unnecessary. |
Compared with IDT72V2115L133PFI and IS61WV204836BLL-133TQLI, CY7C1471BV25-133AXC uniquely combines JTAG testability, triple CE depth scalability, and hardware-configurable burst order - critical for field-upgradable telecom infrastructure and safety-certified motion systems.
Availability
CY7C1471BV25-133AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA co-processor cache, and industrial motion controller buffer applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1471BV25-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
This device belongs to the NoBL™ SRAM product line, engineered specifically for zero-wait-state, burst-mode data buffering in high-speed networking and real-time control systems.
FAQ
What is the function of the MODE pin, and how must it be connected?
The MODE pin selects burst order: tied to GND for linear burst, or to VDD/floating for interleaved burst. It is a static strap pin sampled at power-up; no dynamic reconfiguration is supported. Leaving it unconnected defaults to interleaved mode due to internal pull-up behavior confirmed in Rev. *F datasheet Section 3.1.
Can CY7C1471BV25-133AXC operate with only two chip enables?
Yes - CE2 is active-high while CE1 and CE3 are active-low; any combination can be used for device selection. For simple single-bank operation, tie CE2 HIGH and use CE1 as primary enable, leaving CE3 HIGH or LOW per system decode logic - all three are independently sampled on CLK edge per datasheet Table 1.
Does the ZZ sleep mode retain data during power loss?
No - ZZ mode reduces active current to ≤120 mA while preserving data only as long as VDD and VDDQ remain within specification (2.3–2.7 V). It is not a battery-backed or nonvolatile state; full power loss results in memory content corruption, consistent with standard SRAM behavior.
Is the 100-pin TQFP package RoHS-compliant?
Yes - the "X" suffix in -133AXC denotes JEDEC-standard Pb-free packaging. Cypress documentation (Doc #001-15013 Rev. *F, Page 1) explicitly states CY7C1471BV25 is available in "Pb-free 100-pin TQFP", meeting RoHS Directive 2011/65/EU requirements.
CY7C1471BV25-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1471BV25-133AXC FAQ
1.How can I place an order for CY7C1471BV25-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1471BV25-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1471BV25-133AXC reliable?
The price and inventory of CY7C1471BV25-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1471BV25-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1471BV25-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1471BV25-133AXC transactions.
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CY7C1471BV25-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1471BV25-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1471BV25-133AXC?
For technical support, including CY7C1471BV25-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1471BV25-133AXC requirements.
6.How does Aetrix verify that CY7C1471BV25-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1471BV25-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1471BV25-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1471BV25-133AXC?
All CY7C1471BV25-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1471BV25-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1471BV25-133AXC part is unused and in its original packaging.
Return procedure for CY7C1471BV25-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1471BV25-133AXC Tags

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