Cypress Semiconductor Corp CY7C1472BV33-200AXC
- Part No.:
- CY7C1472BV33-200AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1472BV33-200AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1472BV33-200AXC from Cypress Semiconductor is a 3.3 V, 4M × 18 (72-Mbit) synchronous pipelined SRAM with NoBL™ architecture, supporting 200 MHz zero-wait-state bus operation, 3.0 ns clock-to-output time, and fully registered inputs/outputs for true back-to-back read/write cycles in high-throughput memory subsystems such as network packet buffers and baseband processors.
For engineers reviewing the CY7C1472BV33-200AXC datasheet, CY7C1472BV33-200AXC pinout, CY7C1472BV33-200AXC application, or CY7C1472BV33-200AXC equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability via BWa–BWb, synchronous self-timed writes, and compatibility with 3.3 V/2.5 V I/O voltage domains.
Technical Context
The CY7C1472BV33-200AXC implements a No Bus Latency™ architecture that eliminates pipeline stalls by synchronously registering all address, control, and data signals on the rising edge of CLK, enabling consecutive read or write operations without wait states. Its internal burst logic supports both linear and interleaved addressing sequences.
It features three synchronous chip enables (CE1 low, CE2 high, CE3 low), asynchronous OE for output tri-state control, and Clock Enable (CEN) to suspend clock recognition without deselecting the device. Write operations are controlled by WE and two byte write selects (BWa, BWb), each governing 18-bit data lanes including parity bits DQPa/DQPb.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization with parity) |
| Max Clock Frequency | 200 MHz - enables sustained 200 MT/s throughput with no wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical read paths |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| Power Consumption | 500 mA max operating current - sets thermal and PSU sizing requirements at full speed |
| Burst Capability | Linear or interleaved - determines compatibility with CPU/cache controller burst protocols |
| Byte Write Control | BWa/BWb active-low - enables independent 18-bit lane writes without masking overhead |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:17] | Synchronous Address Input | Sampled on rising CLK edge; selects one of 4M addresses in 18-bit word space |
| BWa, BWb | Synchronous Byte Write Select | Active-low controls write enable for DQa/DQPa and DQb/DQPb lanes respectively |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN to gate recognition |
| CEN | Clock Enable | Active-low suspends CLK sampling while preserving internal state and extending prior cycle |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-input decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems |
| OE | Asynchronous Output Enable | Active-low tri-states outputs during writes or deselected states to prevent bus contention |
| DQa–DQb, DQPa–DQPb | Bidirectional Data I/O | 18-bit data + 2-bit parity interface; direction controlled by OE and internal read/write state |
| ADV/LD | Advance/Load Control | HIGH advances internal burst counter; LOW loads new address after deselection |
| ZZ | Deep Sleep Mode | Active-low reduces standby current to <120 µA by gating internal clocks and buffers |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited back-to-back reads/writes with zero wait states, eliminating pipeline bubbles in burst-intensive traffic |
| Fully Registered Interface | All inputs and outputs synchronized to CLK rising edge-ensures deterministic setup/hold timing across PVT corners |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write pulse width constraints and simplifies controller design |
| IEEE 1149.1 JTAG Support | Enables boundary-scan testing of PCB interconnects without requiring functional memory access |
| 3.3 V Core / 2.5 V I/O Option | Allows direct interfacing with 2.5 V logic families while maintaining 3.3 V core stability and noise margin |
Applications
| Network Packet Buffer | Baseband Processor Cache |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer between ingress/egress engines and traffic manager. Use Value: 200 MHz zero-wait-state operation sustains 3.6 Gbps aggregate bandwidth (18-bit × 200 MHz), matching line-rate switching requirements. |
Use Scenario: Serving as L2 cache for multi-core DSPs in 4G/LTE femtocell baseband units handling real-time channel estimation and FFT processing. IC Role / Device Role / Timing Role: Burst-accessible scratchpad memory supporting interleaved read/write patterns during symbol-level processing. Use Value: Interleaved burst mode aligns with FFT engine's natural memory access stride, reducing average latency by 40% vs. random access. |
| Industrial PLC Data Log | Avionics Sensor Fusion Buffer |
|
Use Scenario: Capturing timestamped analog I/O and motion control events in deterministic industrial controllers with microsecond jitter tolerance. IC Role / Device Role / Timing Role: Deterministic, register-controlled memory staging area for cyclic data acquisition and reporting cycles. Use Value: Fully registered interface guarantees ±0.5 ns input skew control, meeting IEC 61131-3 cycle-time repeatability requirements. |
Use Scenario: Aggregating synchronized inertial measurement unit (IMU), GPS, and barometer streams in flight control computers before Kalman filtering. IC Role / Device Role / Timing Role: Time-aligned sensor data buffer with hardware-supported burst writes to minimize CPU intervention. Use Value: Byte-write capability (BWa/BWb) allows selective update of individual sensor channels without corrupting adjacent data words. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 10 ns access time, 100 MHz max frequency, 2.5 V only I/O, no ZZ sleep mode | Limited to lower-bandwidth control-plane buffering; lacks deep power-down for battery-backed systems | Select when cost sensitivity outweighs speed/power needs and 2.5 V-only interface suffices |
| ISSI IS61WV102418B | 15 ns access, 66 MHz max, asynchronous interface, no burst or NoBL logic | Suitable for non-pipelined legacy controllers; cannot sustain back-to-back transfers | Choose only for retrofit into non-burst-capable designs where timing margin is ample |
Compared with IDT72V2115L10PF and IS61WV102418B, the CY7C1472BV33-200AXC delivers 2× higher throughput, integrated burst control, and active power management-making it essential for modern packet-processing and real-time signal chain architectures.
Availability
CY7C1472BV33-200AXC is available at Aetrix Electronics and suitable for network packet buffers, baseband processor caches, industrial PLC data logs, and avionics sensor fusion buffers requiring stable component supply across extended production lifecycles.
Supply support for CY7C1472BV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1472BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory subsystems in telecom infrastructure and real-time embedded systems demanding deterministic timing and high reliability.
FAQ
What is the function of the ADV/LD pin in CY7C1472BV33-200AXC?
The ADV/LD pin controls the internal address counter behavior: when HIGH and CEN is active, it advances the burst address counter; when LOW, it loads a new starting address from A[17:0]. After device deselection, ADV/LD must be driven LOW to accept a new address, ensuring deterministic burst initialization in multi-cycle memory access sequences.
Does CY7C1472BV33-200AXC support 2.5 V I/O operation with 3.3 V core supply?
Yes. The device uses separate VDD (3.3 V) and VDDQ (2.5 V or 3.3 V) supplies, allowing direct interface with 2.5 V logic families while maintaining 3.3 V core stability. VDDQ must be powered before or simultaneously with VDD, and the 2.5 V I/O mode requires proper termination and AC timing validation per the datasheet's 2.5 V TAP test conditions.
How does the ZZ (Sleep) mode reduce power consumption?
Asserting ZZ LOW disables internal clocks, shuts down output drivers, and places memory arrays in retention mode, reducing standby current to ≤120 µA. This mode retains data without refresh and resumes normal operation within one clock cycle after ZZ is deasserted, making it ideal for intermittent data capture in power-constrained systems.
Can CY7C1472BV33-200AXC operate in interleaved burst mode without external address generation?
Yes. The device implements on-chip burst logic that automatically generates sequential or interleaved addresses based on the ADV/LD and MODE pin state. Once initiated, burst sequences require no external address updates-only CLK, CEN, and OE control-reducing controller overhead and improving bus efficiency in high-throughput applications.
CY7C1472BV33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1472BV33-200AXC FAQ
1.How can I place an order for CY7C1472BV33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1472BV33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1472BV33-200AXC reliable?
The price and inventory of CY7C1472BV33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472BV33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1472BV33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472BV33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1472BV33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1472BV33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1472BV33-200AXC?
For technical support, including CY7C1472BV33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472BV33-200AXC requirements.
6.How does Aetrix verify that CY7C1472BV33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1472BV33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472BV33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1472BV33-200AXC?
All CY7C1472BV33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472BV33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1472BV33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1472BV33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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