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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Cypress Semiconductor Corp CY7C1472BV33-200BZC

Name: CY7C1472BV33-200BZC
Brand: Cypress Semiconductor Corp
SKU: CY7C1472BV33-200BZC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CY7C1472BV33-200BZC

Manufacturer:: Cypress Semiconductor Corp

Category:: Memory

Package:: 165-LBGA

Datasheet:: CY7C1472BV33-200BZC.pdf

Description:: IC SRAM 72MBIT PARALLEL 165FBGA

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Product details

Overview

CY7C1472BV33-200BZC from Cypress Semiconductor is a 3.3 V, 4M × 18 (72-Mbit) synchronous pipelined SRAM with NoBL™ architecture, supporting 200 MHz zero-wait-state bus operation, 3.0 ns clock-to-output time, and byte-write capability via BWa–BWb inputs. It serves as high-throughput data buffer in network packet processors requiring back-to-back read/write transitions.

For engineers reviewing the CY7C1472BV33-200BZC datasheet, CY7C1472BV33-200BZC pinout, CY7C1472BV33-200BZC application, or CY7C1472BV33-200BZC equivalent, this device delivers deterministic latency, JTAG boundary-scan testability, synchronous self-timed writes, and dual-voltage I/O (3.3 V core / 2.5 V or 3.3 V I/O) for FPGA-adjacent memory interfacing.

Technical Context

The CY7C1472BV33-200BZC implements fully registered synchronous interfaces: all address, control, and data inputs pass through input registers on CLK rising edge; all outputs are latched on the same edge. Its NoBL™ logic eliminates bus latency by enabling true back-to-back reads/writes without wait states.

It supports linear or interleaved burst orders, features three synchronous chip enables (CE1 low, CE2 high, CE3 low), asynchronous OE for output tri-state control, and CEN to suspend clock recognition without deselection. Byte write select pins BWa and BWb independently control DQa/DQPa and DQb/DQPb groups.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	72 Mbit (4M × 18 organization), enabling compact high-bandwidth buffering for 18-bit data paths.
Max Clock Frequency	200 MHz - guarantees 5 ns cycle time for sustained pipelined throughput in real-time systems.
Access Time	3.0 ns - defines minimum clock-to-valid-output delay, critical for timing closure with FPGAs or ASICs.
I/O Voltage Support	3.3 V or 2.5 V - allows direct interface to mixed-voltage SoCs without level shifters.
Power Supply	Single 3.3 V core supply - simplifies power delivery design versus split-rail SRAMs.
Standby Current	120 mA max - quantifies low-power retention state consumption for always-on subsystems.
JTAG Compliance	IEEE 1149.1 boundary scan - enables production testability and board-level debug without physical probes.

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, JEDEC-standard Pb-free.

Pin/Terminal	Circuit Role	Design Meaning
A0, A1, A[2:17]	Synchronous Address Input	Sampled on CLK rising edge; selects one of 4M addresses in 18-bit word space.
BWa, BWb	Synchronous Byte Write Select	Active-low controls write enable for DQa/DQPa and DQb/DQPb groups respectively.
CLK	Master Clock Input	Rising-edge-triggered; qualified by CEN; drives all internal register transfers.
CEN	Clock Enable	Active-low; masks CLK without deselecting device, enabling cycle extension for timing margin.
CE1, CE2, CE3	Synchronous Chip Enables	Three-input decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems.
OE	Asynchronous Output Enable	Active-low; tri-states outputs during write cycles to prevent bus contention.
DQa–DQb, DQPa–DQPb	Bidirectional Data I/O	18-bit data bus (9×2-bit pairs); direction controlled by OE and internal read/write state.
ADV/LD	Address Counter Control	High = advance burst counter; Low = load new address - enables flexible burst vs random access.
ZZ	Deep Sleep Mode	Active-low entry into ultra-low-power state; reduces current draw significantly below standby.

Key Features

Feature	Design Value
No Bus Latency™ Architecture	Enables unlimited consecutive read/write operations with zero wait states, maximizing effective bandwidth.
Synchronous Self-Timed Writes	Eliminates external write pulse timing constraints - internal logic manages write duration based on clock.
Byte Write Select (BWa/BWb)	Allows independent 9-bit sub-word writes within 18-bit word, reducing unnecessary data overwrites.
3.3 V Core / Dual-Voltage I/O	Supports 2.5 V or 3.3 V I/O signaling while maintaining 3.3 V core voltage, easing integration with legacy and modern logic.
JTAG Boundary Scan (IEEE 1149.1)	Provides full pin-level test access for PCB assembly verification and fault isolation without physical probing.

Applications

Network Packet Buffering

FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10 Gbps line cards.

IC Role / Device Role / Timing Role: High-speed, low-latency data buffer interfacing directly with MAC-layer logic.

Use Value: 200 MHz pipelined operation ensures deterministic 5 ns cycle time, eliminating packet drop due to memory stall.

Use Scenario: Acting as instruction/data scratchpad between FPGA fabric and soft-core processor (e.g., MicroBlaze).

IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state memory access for tightly coupled execution.

Use Value: Fully registered interface aligns perfectly with FPGA register stages, simplifying timing closure at 200 MHz.

Telecom Line Card FIFO

Industrial Motion Controller Buffer

Use Scenario: Implementing elastic store FIFOs in SONET/SDH framer modules handling variable-length ATM cells.

IC Role / Device Role / Timing Role: Burst-capable SRAM supporting linear/interleaved addressing for efficient cell reassembly.

Use Value: ADV/LD pin enables seamless burst chaining across multiple 18-bit words without address overhead.

Use Scenario: Holding real-time position/velocity command buffers in servo drive controllers with deterministic update cycles.

IC Role / Device Role / Timing Role: Deterministic-access memory ensuring jitter-free command delivery to PWM and feedback loops.

Use Value: ZZ sleep mode reduces idle power to <120 mA, meeting industrial thermal and efficiency requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT72V2115L10PF	4M × 18, 10 ns access, 100 MHz max - slower speed grade, no ZZ sleep mode.	Lacks deep sleep and JTAG; suitable only where 100 MHz suffices and testability is secondary.	Select when cost sensitivity outweighs performance and test requirements.
ISSI IS61WV102418BLL-10TLI	1M × 18, 10 ns, 100 MHz - lower density, no burst capability or ADV/LD control.	Cannot support 4M depth or burst addressing; requires external address sequencing logic.	Choose only for legacy designs constrained to 1M depth and non-pipelined timing.

Compared with IDT72V2115L10PF and IS61WV102418BLL-10TLI, CY7C1472BV33-200BZC uniquely combines 200 MHz operation, NoBL™ zero-wait-state throughput, JTAG testability, and ZZ sleep - making it optimal for next-gen telecom and real-time embedded buffers where latency, density, and debugability are co-constrained.

Availability

CY7C1472BV33-200BZC is available at Aetrix Electronics and suitable for network packet processors, FPGA co-processor caches, and telecom line card FIFOs requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1472BV33-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.

CY7C1472BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency buffering in packet-switched infrastructure and real-time control applications.

FAQ

What is the function of the ADV/LD pin in CY7C1472BV33-200BZC?

The ADV/LD pin controls the internal burst address counter: when HIGH and CEN is active, it advances the counter for sequential burst access; when LOW, it loads a new base address from A[17:0]. This enables flexible mix of burst and random accesses without external address generation logic.

Does CY7C1472BV33-200BZC support 2.5 V I/O signaling?

Yes - the device supports 2.5 V or 3.3 V I/O voltage levels via separate VDDQ pins, while maintaining a fixed 3.3 V VDD core supply. This allows direct interfacing with 2.5 V FPGAs or ASICs without level-shifting circuitry.

How does the ZZ (Sleep) mode reduce power consumption?

Asserting ZZ LOW places the device in deep sleep mode, reducing current draw to well below the 120 mA maximum standby specification. This state retains memory contents while minimizing dynamic and leakage power, ideal for intermittent-operation systems.

Can CY7C1472BV33-200BZC be used in place of ZBT™ SRAMs?

Yes - it is pin-compatible and functionally equivalent to ZBT™ devices, supporting identical control protocols, timing, and burst modes. Migration requires no PCB change and preserves existing firmware timing assumptions.

CY7C1472BV33-200BZC Specifications

Product attributes: Attribute value

Manufacturer:: Cypress Semiconductor Corp

Series:: NoBL™

Package/Case:: 165-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Synchronous, SDR

Memory Size:: 72Mbit

Memory Organization:: 4M x 18

Memory Interface:: Parallel

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3 ns

Voltage - Supply:: 3.135V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 165-FBGA (15x17)

CY7C1472BV33-200BZC FAQ

1.How can I place an order for CY7C1472BV33-200BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1472BV33-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1472BV33-200BZC reliable?

The price and inventory of CY7C1472BV33-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472BV33-200BZC is usually 5 days.

3.What payment methods are accepted for CY7C1472BV33-200BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472BV33-200BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1472BV33-200BZC?

CY7C1472BV33-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1472BV33-200BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1472BV33-200BZC?

For technical support, including CY7C1472BV33-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472BV33-200BZC requirements.

6.How does Aetrix verify that CY7C1472BV33-200BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1472BV33-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472BV33-200BZC meets industry standards.

7.What is the process for return or replacement of CY7C1472BV33-200BZC?

All CY7C1472BV33-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472BV33-200BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1472BV33-200BZC part is unused and in its original packaging.

Return procedure for CY7C1472BV33-200BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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