Cypress Semiconductor Corp CY7C1474BV33-200BGC
- Part No.:
- CY7C1474BV33-200BGC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474BV33-200BGC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 209FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1474BV33-200BGC from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 200 MHz with zero wait states, supports synchronous self-timed writes, features 8-byte write capability via BWSa–BWh pins, and uses a single 3.3 V core supply with 3.3 V/2.5 V I/O compatibility.
For engineers reviewing the CY7C1474BV33-200BGC datasheet, CY7C1474BV33-200BGC pinout, CY7C1474BV33-200BGC application, or CY7C1474BV33-200BGC equivalent, key selection criteria include burst mode support (linear/interleaved), ZZ sleep mode, IEEE 1149.1 JTAG boundary scan, and 209-ball FBGA package compatibility with high-density PCB layouts.
Technical Context
This SRAM implements fully registered synchronous operation: all address, control, and data inputs pass through input registers on the rising edge of CLK; all outputs are clocked through output registers on the same edge. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write cycles without wait states.
It supports three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tri-state control, and synchronous CEN to suspend clock recognition without deselecting the device. Burst addressing is controlled by ADV/LD, supporting both linear and interleaved sequences per JEDEC standard.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1M × 72 configuration) |
| Maximum Clock Frequency | 200 MHz - enables 200 million transfers per second in pipelined mode |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical interfaces |
| Supply Voltage | Core: 3.3 V ±0.3 V; I/O: 3.3 V or 2.5 V - supports mixed-voltage system integration |
| Operating Current | 500 mA max at 200 MHz - critical for thermal and power delivery design |
| Standby Current | 120 mA max - determines quiescent power in low-activity states |
| Burst Capability | Linear or interleaved - matches CPU/DMA burst patterns without address re-latching |
Pinout & Package
The CY7C1474BV33-200BGC is housed in a Pb-free 209-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 14 mm × 22 mm × 1.76 mm, optimized for high-speed signal integrity and thermal dissipation in dense router/switch modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | 18-bit address bus sampled on rising CLK edge; selects one of 1M locations in 1M × 72 mode |
| BWSa–BWh | Synchronous Byte Write Select | Eight active-low signals controlling individual 9-bit byte lanes (DQa–DQh + DQPa–DQPh); enables partial writes without read-modify-write |
| CLK, CEN | Clock & Clock Enable | CLK qualified by CEN (active-low); CEN suspension extends previous cycle without losing state |
| CE1, CE2, CE3 | Chip Enable Group | Three-signal decode (CE1/L, CE2/H, CE3/L) allows hierarchical memory banking with minimal external logic |
| OE | Asynchronous Output Enable | Tri-states DQ/DQP pins during write cycles and deselected states to prevent bus contention |
| ZZ | Deep Sleep Control | Active-low entry into ultra-low-power mode (<120 mA standby); retains memory contents |
| VDD, VDDQ | Power Supplies | VDD = 3.3 V core; VDDQ = 3.3 V or 2.5 V I/O - decoupling must separate these domains |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write operations with no wait states - sustains full 200 MHz throughput under mixed-access workloads |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints - internal logic manages write duration based on clock phase |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system testability and interconnect verification without additional test fixtures or bed-of-nails |
| Byte-Write Select (8-channel) | Permits independent update of any 9-bit byte lane in 1M × 72 mode - avoids full-word overwrites in packet buffering |
| ZZ Sleep Mode | Reduces active current to ≤120 mA while preserving data - critical for thermal management in fanless chassis |
Applications
| Packet Buffering in Switch ASIC Interfaces | High-Speed Protocol Accelerator Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switching fabric where deterministic latency and burst depth are critical. IC Role / Device Role / Timing Role: Primary data buffer interfacing directly with switch fabric controller via 72-bit parallel bus; provides zero-wait-state access for frame assembly/disassembly. Use Value: 200 MHz clock rate and NoBL™ architecture deliver sustained 14.4 GB/s bandwidth (72 bits × 200 MHz), eliminating pipeline stalls during back-to-back packet bursts. | Use Scenario: Offloading TCP/IP or encryption processing in network security appliances requiring rapid context switching between sessions. IC Role / Device Role / Timing Role: Shared memory resource for protocol engine microcode and session state tables; synchronized via ADV/LD-controlled burst reads/writes. Use Value: Linear/interleaved burst modes align with DMA engine addressing patterns, reducing address setup overhead by >60% versus discrete address strobes. |
| Telecom Line Card Data Buffers | Real-Time Signal Processing FIFO |
Use Scenario: Buffering TDM voice channels and packetized media streams in carrier-grade DSLAMs and OLTs operating under strict jitter budgets. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via pipelined reads/writes; CE1/CE2/CE3 enable dynamic bank switching across multiple DSP cores. Use Value: Synchronous CEN and ZZ sleep allow precise power gating per channel group, cutting idle power by 45% compared to asynchronous SRAMs. | Use Scenario: Acting as a deep FIFO between ADC sampling engine and FPGA-based FFT processor in radar or spectrum analyzers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory stage accepting 200 MSPS samples and delivering burst-aligned blocks to compute logic. Use Value: 3.0 ns clock-to-output ensures sample-to-compute latency remains <15 ns - meeting sub-20 ns real-time processing deadlines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2123L15PF | 54-Mbit (1.5M × 36), 167 MHz max, 100-pin TQFP only | Limited density and speed; lacks 1M × 72 configuration and ZZ sleep mode | Select only when board space constraints prohibit 209-ball FBGA and 72-Mbit capacity is not required |
| ISSI IS61WV102472BLL-200B | 72-Mbit (1M × 72), 200 MHz, but no JTAG, no ZZ mode, and only 3.3 V I/O (no 2.5 V support) | Missing IEEE 1149.1 testability and dual-voltage I/O flexibility for mixed-signal SoC interfaces | Choose when JTAG is unnecessary and I/O voltage is fixed at 3.3 V; verify thermal derating at full speed |
Compared with IDT72V2123L15PF and IS61WV102472BLL-200B, the CY7C1474BV33-200BGC uniquely combines 72-Mbit density, 200 MHz performance, 2.5 V/3.3 V I/O adaptability, JTAG testability, and ZZ sleep - making it the only option meeting full telecom line card qualification requirements.
Availability
CY7C1474BV33-200BGC is available at Aetrix Electronics and suitable for packet buffering in switch ASIC interfaces, high-speed protocol accelerator memory, and telecom line card data buffers requiring stable component supply across multi-year production cycles.
Supply support for CY7C1474BV33-200BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions for industrial and communications infrastructure.
The CY7C147x BV33 family was developed specifically for next-generation networking equipment demanding deterministic, zero-latency memory access - targeting switch fabric buffers, packet classification engines, and real-time traffic shapers.
FAQ
What is the function of the ADV/LD pin in CY7C1474BV33-200BGC?
The ADV/LD pin controls the internal burst counter: when HIGH (with CEN active), it advances the counter for sequential burst access; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both continuous streaming and random-access bursts without external address generation logic.
Does CY7C1474BV33-200BGC support 2.5 V I/O operation with 3.3 V core supply?
Yes - VDDQ is independently powered and accepts either 2.5 V or 3.3 V, while VDD remains at 3.3 V. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ and VDD supplies are properly decoupled and sequenced during power-up.
How does the ZZ (Sleep) mode affect data retention and wake-up time?
In ZZ mode, the device enters ultra-low-power state with ≤120 mA current draw while retaining all stored data. Wake-up is synchronous: exiting ZZ requires deasserting ZZ and applying two valid CLK edges with CEN active; data becomes valid after tHZ (max 10 ns) from first post-ZZ CLK edge.
Can CY7C1474BV33-200BGC be used in linear burst mode with non-sequential addresses?
No - linear burst mode requires strictly sequential address increments (e.g., 0x000000, 0x000001, …). Non-sequential addresses must use single-access mode or interleaved burst (which follows a defined XOR-based pattern). Attempting linear burst with gaps causes undefined data output per the datasheet truth table.
CY7C1474BV33-200BGC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474BV33-200BGC FAQ
1.How can I place an order for CY7C1474BV33-200BGC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474BV33-200BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1474BV33-200BGC reliable?
The price and inventory of CY7C1474BV33-200BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV33-200BGC is usually 5 days.
3.What payment methods are accepted for CY7C1474BV33-200BGC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV33-200BGC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1474BV33-200BGC?
CY7C1474BV33-200BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1474BV33-200BGC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1474BV33-200BGC?
For technical support, including CY7C1474BV33-200BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV33-200BGC requirements.
6.How does Aetrix verify that CY7C1474BV33-200BGC is sourced from the original manufacturer or authorized distributors?
All CY7C1474BV33-200BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV33-200BGC meets industry standards.
7.What is the process for return or replacement of CY7C1474BV33-200BGC?
All CY7C1474BV33-200BGC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV33-200BGC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474BV33-200BGC part is unused and in its original packaging.
Return procedure for CY7C1474BV33-200BGC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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