Cypress Semiconductor Corp CY7C1474V25-200BGC

Overview

CY7C1474V25-200BGC from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 1M × 72, 2M × 36, or 4M × 18. It operates at 200 MHz with zero wait states, delivers 3.0 ns clock-to-output time, and uses single 2.5 V core and I/O supplies. It is deployed in high-throughput network packet buffering and FPGA co-processor data staging.

For engineers reviewing the CY7C1474V25-200BGC datasheet, CY7C1474V25-200BGC pinout, CY7C1474V25-200BGC application, or CY7C1474V25-200BGC equivalent, key selection criteria include burst mode support (linear/interleaved), 8-byte write enable (BWa–BWh), JTAG boundary scan compliance, ZZ sleep mode control, and 209-ball FBGA package compatibility with high-density PCB layouts.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK; all outputs are driven from output registers synchronized to CLK. Internal self-timed output buffer control eliminates asynchronous OE timing constraints.

The device supports burst reads/writes with ADV/LD-controlled linear or interleaved addressing, synchronous self-timed writes, and three chip enables (CE1–CE3) for bank isolation. The ZZ pin enables low-power sleep mode, and CEN suspends clocked operation without resetting internal state.

Key Specifications

Pinout & Package

Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), JEDEC-compliant, Pb-free and non-Pb-free options available. Dimensions: 15 mm × 17 mm × 1.4 mm, ball pitch 1.0 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102418B, CY7C1474V25-200BGC uniquely delivers 72-bit width, 200 MHz zero-wait-state operation, and hardware-supported burst addressing-making it irreplaceable in high-speed packet processing where throughput and deterministic latency are non-negotiable.

Availability

CY7C1474V25-200BGC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor staging, and telecom line card memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1474V25-200BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for industrial, automotive, and communications markets.

CY7C1474V25 belongs to the NoBL™ Pipelined SRAM product line, engineered specifically for zero-latency, burst-capable data buffering in ASIC/FPGA-based infrastructure equipment where deterministic timing and high bandwidth are critical.

FAQ

What is the function of the ADV/LD pin on CY7C1474V25-200BGC?

The ADV/LD pin controls burst address generation mode: when asserted, it loads the initial address and advances to the next location on each clock cycle for linear bursts; when deasserted, it enables interleaved addressing. It also serves as the primary strobe for initiating burst sequences in both read and write operations, directly synchronizing with CLK edges.

Does CY7C1474V25-200BGC support parity checking?

Yes. The device provides eight dedicated parity output pins (DQPa–DQPh), one per 9-bit data byte (DQa–DQh), enabling per-byte even parity generation and checking. Parity is active during reads and can be used with external logic to detect single-bit errors in safety-critical applications such as avionics and telecom control planes.

How is the ZZ pin used, and what is the errata requirement?

The ZZ pin places the device in deep sleep mode, reducing standby current to <10 µA. Per Errata on page 36 of datasheet 38-05290 Rev. *V, the ZZ ball (H11 in 209-ball FBGA) must be externally connected to ground to ensure reliable sleep entry and avoid undefined behavior during power transitions.

Can CY7C1474V25-200BGC operate at 167 MHz, and how does timing differ?

Yes, the same part number is offered in both 200 MHz and 167 MHz speed grades. At 167 MHz, maximum access time increases to 3.4 ns, and operating current drops to 400 mA (vs. 450 mA at 200 MHz). All functional features-including burst modes, byte write, and JTAG-remain identical; only AC timing parameters scale accordingly.