Cypress Semiconductor Corp CY7C1480BV33-167BZI
- Part No.:
- CY7C1480BV33-167BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1480BV33-167BZI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:102
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Product details
Overview
CY7C1480BV33 from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM configured as 2M × 36, operating at up to 167 MHz with 3.4 ns clock-to-output delay, 3.3V core supply, and 2.5V/3.3V I/O compatibility - deployed in high-speed CPU cache subsystems requiring deterministic burst access timing.
For engineers reviewing the CY7C1480BV33 datasheet, CY7C1480BV33 pinout, CY7C1480BV33 application, or CY7C1480BV33 equivalent, key selection criteria include synchronous burst mode support (Intel Pentium®-compatible or linear), registered address/data paths, byte-write granularity via BWA–BWD + BWE, and JEDEC-standard 100-pin TQFP packaging with JTAG boundary scan.
Technical Context
This SRAM implements a fully synchronous, pipelined architecture with positive-edge-triggered CLK gating all synchronous inputs (ADSP/ADSC, CE1–CE3, ADV, BWX, BWE, GW) and registered outputs. A 2-bit internal binary counter enables wraparound burst addressing, selectable via MODE pin for Intel interleaved or linear sequences.
It supports self-timed synchronous writes with byte-select control (four independent 9-bit data groups), asynchronous OE for output tri-state control, and ZZ sleep mode with data retention. All I/Os comply with JESD8-5, and core logic operates from 3.3V while I/Os tolerate 2.5V or 3.3V VDDQ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling single-chip L2 cache for 32-bit processors with 64-byte line size |
| Max Clock Frequency | 167 MHz - defines maximum sustained burst throughput of 600 MB/s (36-bit bus) |
| Access Time (tCO) | 3.4 ns - guaranteed clock-to-output delay for timing-critical synchronous read pipelines |
| Core Supply Voltage | 3.3V ± 0.3V - powers internal logic and registers; requires dedicated low-noise regulation |
| I/O Supply Range | 2.5V or 3.3V - supports mixed-voltage system interfacing without level shifters |
| Burst Mode Support | Intel Pentium®-interleaved or linear - selected by MODE pin; ensures compatibility with x86 cache controllers |
| Byte Write Capability | Four independent 9-bit write groups (BWA–BWD) qualified by BWE - enables precise partial-word updates without read-modify-write |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, 14 × 14 mm body, 0.5 mm pitch. Pin 1 marked with dot; thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Synchronous Address Inputs | Captured on rising CLK edge when ADSP or ADSC active; A1:A0 load 2-bit burst counter |
| BWA–BWD, BWE | Synchronous Byte Write Controls | Active-low signals qualifying 9-bit data groups; BWE must be LOW to enable any byte write |
| GW | Synchronous Global Write Enable | Overrides BWX signals when LOW - writes all 36 bits regardless of byte select state |
| ADSP / ADSC | Address Strobe (Processor / Controller) | Edge-triggered strobes selecting address capture source; ADSP takes priority if both asserted |
| ADV | Synchronous Burst Advance | Drives internal counter increment on rising CLK - enables automatic sequential address generation |
| OE | Asynchronous Output Enable | Tri-states DQ/DQP pins immediately when HIGH; masked only during first cycle after chip select assertion |
| ZZ | Asynchronous Sleep Control | Places device in low-power retention mode (ISB ≤ 120 mA) when HIGH; internal pull-down ensures safe default |
| VDDQ | I/O Power Supply | Separate 2.5V/3.3V rail for output drivers and input receivers - decoupling critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Registered Pipelined Interface | Full address/data/register synchronization eliminates external latch requirements and simplifies PCB layout |
| User-Selectable Burst Sequence | MODE pin configures Intel interleaved (A0 toggles LSB) or linear (A0 increments) addressing - matches host processor protocol |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse generation and guarantees setup/hold compliance |
| JTAG Boundary Scan (IEEE 1149.1) | Enables in-system testability and interconnect verification without physical probe access |
| Dual-Voltage I/O Compatibility | VDDQ supports 2.5V or 3.3V operation - allows direct interface to legacy or next-gen ASIC/FPGA I/O banks |
Applications
| High-Performance CPU Cache | Network Packet Buffering |
|---|---|
|
Use Scenario: Secondary cache for x86-compatible embedded processors running real-time OS with strict latency budgets. IC Role / Device Role / Timing Role: Synchronous burst-access memory serving as 2MB L2 cache with deterministic 3.4 ns tCO and 167 MHz clock alignment. Use Value: Eliminates wait states in cache fill operations due to pipelined address registration and zero-latency burst counter advancement. |
Use Scenario: Line-rate packet buffering in 10G Ethernet switch fabric ASICs requiring concurrent read/write access. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as FIFO buffer with separate ADSP (write) and ADSC (read) strobes for independent control paths. Use Value: Enables simultaneous ingress/egress traffic handling via asynchronous OE control and synchronous burst reads at 600 MB/s throughput. |
| Industrial Motion Controller Memory | Radar Signal Processing Buffer |
|
Use Scenario: Real-time trajectory calculation engine in CNC systems requiring deterministic memory access for servo loop updates. IC Role / Device Role / Timing Role: Deterministic-latency SRAM storing motion profile tables and interpolated position data accessed via linear burst mode. Use Value: Guarantees sub-4 ns output timing stability across temperature (-40°C to +85°C), preventing jitter in closed-loop timing. |
Use Scenario: Pre-FFT buffering in automotive radar ECU for chirp-based FMCW signal processing. IC Role / Device Role / Timing Role: High-bandwidth memory staging raw ADC samples (36-bit parallel interface) before DSP pipeline ingestion. Use Value: Supports 167 MHz burst reads aligned to DSP clock domain, minimizing DMA overhead and enabling zero-copy transfers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1482BV33-167BZI | Same package and speed grade, but 4M × 18 organization (72 Mbit); different address/data pin mapping and burst counter depth | Requires PCB redesign for 18-bit data bus and revised address decoding; suited for systems with narrower bus width | Select when board layout supports 18-bit interface and memory controller expects half-width data path |
| IS61WV102436BLL-167TQLI | 1024K × 36, 167 MHz, 3.3V core, but no JTAG, no ZZ sleep, and no MODE-selectable burst order | Lacks Intel interleaved burst support and low-power sleep mode - limits use in x86-compatible or power-constrained designs | Choose only for cost-sensitive applications where burst flexibility and debug features are non-critical |
Compared with CY7C1482BV33-167BZI, this part offers identical timing and package but differs in data width and burst counter behavior; versus IS61WV102436BLL-167TQLI, it adds JTAG testability, programmable burst sequencing, and active sleep control - critical for complex cache and radar subsystems.
Availability
CY7C1480BV33-167BZI is available at Aetrix Electronics and suitable for high-speed CPU cache, network packet buffering, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for CY7C1480BV33-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing signal integrity, timing predictability, and industrial reliability.
This device belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic-burst cache and buffering applications in computing, networking, and real-time control systems.
FAQ
What is the function of the MODE pin on CY7C1480BV33?
The MODE pin selects the burst addressing sequence: when LOW, it configures Intel Pentium®-interleaved burst (A0 toggles on each ADV pulse); when HIGH, it enables linear burst (A0 increments). This signal is sampled synchronously on the rising edge of CLK during the first cycle of a burst access and determines how the internal 2-bit counter advances addresses.
Can CY7C1480BV33 operate with 2.5V I/O while using 3.3V core supply?
Yes - VDDQ may be independently supplied at 2.5V or 3.3V while VDD remains at 3.3V. This dual-voltage capability allows direct interfacing with 2.5V FPGA I/O banks or ASIC cores without external level shifters, provided VDDQ and VSSQ are properly decoupled per the layout guidelines in AN1064.
How does the ZZ pin affect power consumption and data retention?
When ZZ is driven HIGH, the device enters a non-time-critical sleep mode with standby current ≤120 mA and full data retention. The internal pull-down ensures safe LOW default if left unconnected. Exit from sleep requires ZZ return to LOW followed by one valid clock cycle before normal operation resumes.
Is JTAG boundary scan supported on CY7C1480BV33-167BZI in the TQFP package?
Yes - IEEE 1149.1 JTAG boundary scan is fully implemented and functional in the 100-pin TQFP package. Pins TCK, TMS, TDI, and TDO are assigned to dedicated package pins (see page 7 of datasheet 001-15145 Rev. *A), enabling in-system test and interconnect validation without requiring additional test fixtures.
CY7C1480BV33-167BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1480BV33-167BZI FAQ
1.How can I place an order for CY7C1480BV33-167BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1480BV33-167BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1480BV33-167BZI reliable?
The price and inventory of CY7C1480BV33-167BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480BV33-167BZI is usually 5 days.
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Once your CY7C1480BV33-167BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1480BV33-167BZI?
For technical support, including CY7C1480BV33-167BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480BV33-167BZI requirements.
6.How does Aetrix verify that CY7C1480BV33-167BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1480BV33-167BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480BV33-167BZI meets industry standards.
7.What is the process for return or replacement of CY7C1480BV33-167BZI?
All CY7C1480BV33-167BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480BV33-167BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1480BV33-167BZI part is unused and in its original packaging.
Return procedure for CY7C1480BV33-167BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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