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Cypress Semiconductor Corp CY7C1480BV33-200BZXI
- Part No.:
- CY7C1480BV33-200BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1480BV33-200BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:348
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Product details
Overview
CY7C1480BV33-200BZXI from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM configured as 2M × 36, operating at 200 MHz with 3.3V core supply and 2.5V/3.3V I/O compatibility. It features registered inputs/outputs, synchronous self-timed writes, and Intel Pentium®-compatible burst addressing - deployed in high-speed CPU cache subsystems and network packet buffering.
For engineers reviewing the CY7C1480BV33-200BZXI datasheet, CY7C1480BV33-200BZXI pinout, CY7C1480BV33-200BZXI application, or CY7C1480BV33-200BZXI equivalent, key selection criteria include clock-to-output timing (≤3.0 ns), JEDEC-standard 100-pin TQFP packaging, byte-write granularity (BWA–BWD + BWE), ZZ sleep mode support, and dual address strobe (ADSP/ADSC) interface for processor/controller coexistence.
Technical Context
This SRAM implements a synchronous, pipelined architecture with a 2-bit wraparound burst counter, clocked on the rising edge of CLK. All address, data, and control inputs (except OE and ZZ) are registered, enabling deterministic 3-1-1-1 access rates and eliminating external latch requirements.
Burst sequencing is user-selectable via the MODE pin, supporting both linear and Intel® Pentium®-interleaved patterns. Address advancement is controlled by ADV, while ADSP and ADSC provide independent processor- and controller-initiated access paths - critical for multi-master bus arbitration in embedded controllers and telecom line cards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 200 MHz - enables 5 ns cycle time for sustained burst reads/writes |
| Access Time (tCO) | 3.0 ns - guaranteed clock-to-output delay for timing-critical cache interfaces |
| Core Supply Voltage | 3.3 V ± 0.3 V - compatible with legacy 3.3V logic domains and LDO regulation |
| I/O Supply Range | 2.5 V or 3.3 V - supports mixed-voltage system integration without level shifters |
| Burst Mode Control | User-selectable via MODE pin - selects Intel interleaved or linear sequence per Pentium/i486™ or PowerPC™ requirements |
| Sleep Current | 120 mA CMOS standby - low-power retention during idle cycles without data loss |
Pinout & Package
Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch), Pb-free compliant, JEDEC standard. Pinout validated per Cypress Document #001-15145 Rev. *A, Figure 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all registered inputs/outputs and burst counter increment |
| ADSP / ADSC | Address strobe (processor / controller) | Independent enable signals to capture address into register; ADSP takes priority when both asserted |
| ADV | Burst advance control | Active-low signal that increments internal 2-bit counter to generate next burst address |
| BWA–BWD, BWE | Byte write select/enable | Four independent byte masks + global enable - allows partial-word writes without read-modify-write overhead |
| GW | Global write enable | Overrides BWX/BWE to force full 36-bit write - essential for cache line fills and initialization |
| OE | Asynchronous output enable | Tri-states DQ/DQP pins immediately on deassertion - enables bus sharing without clock synchronization |
| ZZ | Asynchronous sleep mode | High-level assertion places device in low-power retention state; internal pull-down ensures safe default |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined synchronous interface | Eliminates external address/data latches and reduces board-level timing margining effort |
| 3-1-1-1 access rate | Delivers sustained 200 MHz throughput with single-cycle latency after initial access - optimal for L2 cache pipelines |
| Dual address strobes (ADSP/ADSC) | Enables concurrent CPU and DMA controller access without external arbitration logic |
| Self-timed synchronous writes | On-chip write timing control removes need for external write pulse generation or wait-state insertion |
| JTAG boundary scan (IEEE 1149.1) | Supports in-system test and debug of high-density PCBs with minimal test point overhead |
Applications
| High-Performance CPU Cache | Network Packet Buffering |
|---|---|
|
Use Scenario: Secondary (L2) cache memory in x86-compatible embedded processors running at ≥133 MHz bus speeds. IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state burst reads aligned to Pentium® interleaved addressing. Use Value: 3.0 ns tCO and 200 MHz clocking meet strict setup/hold timing for 2.5 ns CPU bus cycles without glue logic. |
Use Scenario: Line-rate packet buffering in Gigabit Ethernet switch fabric ASICs requiring burst-aligned FIFO depth. IC Role / Device Role / Timing Role: Synchronous buffer with ADSP/ADSC arbitration supporting concurrent ingress/egress DMA channels. Use Value: Dual strobe interface and 36-bit width enable parallel 4-byte packet header processing per clock cycle. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time trajectory interpolation buffer in CNC motion controllers with deterministic interrupt response. IC Role / Device Role / Timing Role: Low-latency SRAM storing interpolated position tables accessed via burst reads synchronized to servo loop clock. Use Value: ZZ sleep mode reduces power during idle servo phases while preserving table integrity - critical for battery-backed systems. |
Use Scenario: High-reliability sensor data capture in flight data recorders requiring radiation-tolerant, nonvolatile-retentive memory. IC Role / Device Role / Timing Role: Synchronous buffer capturing 16-bit ADC samples at 10 MS/s with burst-aligned storage to minimize CPU overhead. Use Value: 2.5V/3.3V I/O flexibility allows direct interface to mixed-voltage avionics SoCs without level translation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-10BLI | 10 ns access time, 166 MHz max clock, 3.3V-only I/O, no ZZ sleep mode | Lacks burst counter and dual ADSP/ADSC - requires external address generation logic | Preferred where lower cost and simpler timing analysis outweigh burst efficiency needs |
| MT48LC32M32B2-6A:J | SDRAM architecture, 143 MHz clock, 3.3V only, asynchronous refresh required | Higher density but introduces refresh overhead and variable latency - unsuitable for deterministic cache use | Only viable if system already uses SDRAM controller and can tolerate non-deterministic access timing |
Compared with IS61WV102436BLL-10BLI and MT48LC32M32B2-6A:J, the CY7C1480BV33-200BZXI delivers deterministic 3.0 ns tCO, integrated burst logic, and dual-strobe support - making it uniquely suited for CPU cache and real-time buffer applications where latency predictability and interface simplicity are mandatory.
Availability
CY7C1480BV33-200BZXI is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, industrial motion control, and avionics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for CY7C1480BV33-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets.
The CY7C1480BV33 series belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in CPU cache, networking, and real-time control applications.
FAQ
What is the function of the MODE pin on CY7C1480BV33-200BZXI?
The MODE pin selects burst addressing sequence: logic LOW configures Intel® Pentium®-interleaved order (0,2,4,6), HIGH selects linear order (0,1,2,3). It is sampled at power-up and latched; changing MODE mid-burst has no effect. This enables hardware compatibility with multiple processor families without firmware modification.
Can CY7C1480BV33-200BZXI operate with 2.5V I/O while using 3.3V core supply?
Yes - VDDQ is independently supplied at 2.5V or 3.3V, while VDD remains at 3.3V. The I/O buffers comply with JESD8-5 standards, ensuring correct voltage translation and signal integrity. No external level shifters are needed, simplifying mixed-voltage board design.
How does the ZZ (sleep) pin affect data retention and power consumption?
When ZZ is driven HIGH, the device enters non-time-critical sleep mode with data fully retained and core current reduced to ≤120 mA (CMOS standby). The pin has an internal pull-down, so floating ZZ defaults to active operation. Sleep mode does not require clock suspension and resumes instantly on ZZ LOW.
Is CY7C1480BV33-200BZXI pin-compatible with CY7C1482BV33-200BZXI?
No - although both use 100-pin TQFP, CY7C1480BV33 (2M × 36) and CY7C1482BV33 (4M × 18) differ in data bus width, byte write pin mapping (BWA–BWD vs. BWA–BWC), and internal address decoding. Pinouts are not interchangeable; PCB layout must match the specific density variant.
CY7C1480BV33-200BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1480BV33-200BZXI FAQ
1.How can I place an order for CY7C1480BV33-200BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1480BV33-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1480BV33-200BZXI reliable?
The price and inventory of CY7C1480BV33-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480BV33-200BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1480BV33-200BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480BV33-200BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1480BV33-200BZXI?
CY7C1480BV33-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1480BV33-200BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1480BV33-200BZXI?
For technical support, including CY7C1480BV33-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480BV33-200BZXI requirements.
6.How does Aetrix verify that CY7C1480BV33-200BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1480BV33-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480BV33-200BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1480BV33-200BZXI?
All CY7C1480BV33-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480BV33-200BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1480BV33-200BZXI part is unused and in its original packaging.
Return procedure for CY7C1480BV33-200BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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