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Cypress Semiconductor Corp CY7C1480V33-200AXC

Part No.:
CY7C1480V33-200AXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1480V33-200AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:121

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Product details

Overview

CY7C1480V33-200AXC from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM configured as 2M × 36, operating at 200 MHz with 3.3 V core supply and 2.5/3.3 V I/O compatibility. It features registered inputs/outputs, synchronous self-timed writes, and user-selectable Intel Pentium®-compatible interleaved or linear burst sequences. Used in high-speed secondary cache subsystems for embedded processors requiring deterministic 3.0 ns clock-to-output timing.

For engineers reviewing the CY7C1480V33-200AXC datasheet, CY7C1480V33-200AXC pinout, CY7C1480V33-200AXC application, or CY7C1480V33-200AXC equivalent, this page delivers verified specifications, JEDEC-compliant TQFP package details, burst control logic behavior, byte-write architecture, and validated alternatives for cache memory design.

Technical Context

This SRAM implements a dual-strobe address capture architecture using ADSP (processor) and ADSC (controller) inputs, with ADV-triggered internal 2-bit wraparound burst counter. All synchronous signals-including address, data, CE1–CE3, BWA–BWD, BWE, GW, and OE-are registered on the rising edge of CLK.

It supports four-byte-wide synchronous writes with per-byte write enable (BWX) and global write override (GW), while maintaining asynchronous OE and ZZ sleep control. Output drivers are registered, delivering guaranteed 3.0 ns tCO at 200 MHz operation with 3.3 V VDD and 2.5 V VDDQ.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 200 MHz - defines maximum sustained burst throughput in cache line fills
Clock-to-Output Delay (tCO) 3.0 ns - ensures predictable read latency for pipelined processor interfaces
Core Supply Voltage 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated low-noise regulation
I/O Supply Range 2.5 V or 3.3 V - enables direct interfacing with both LVTTL and SSTL-2 I/O standards
Burst Mode Control User-selectable via MODE pin - configures interleaved (Pentium®) or linear addressing sequence
Write Architecture Synchronous self-timed with BWE + BWX qualification - eliminates external write pulse timing constraints

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin thin quad flat pack (TQFP), 14 × 20 × 1.4 mm body, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs/outputs and burst counter increment
ADSP / ADSC Address strobe inputs Edge-sensitive controls for loading external address into register; ADSP takes priority when both asserted
ADV Burst advance signal Active-low synchronous input that increments internal 2-bit burst counter during burst cycles
BWA–BWD, BWE, GW Byte write control inputs Enable selective 1–4 byte writes (BWX + BWE) or full-word write (GW low), all sampled on CLK rise
OE Asynchronous output enable Tri-states DQ/DQP pins immediately when high; masked only during first clock after chip deselect
ZZ Asynchronous sleep control High-active entry to low-power sleep mode with data retention; internal pull-down ensures safe default LOW state
VDD / VSS / VDDQ / VSSQ Power and ground terminals VDD/VSS power core logic; VDDQ/VSSQ isolate I/O drivers-critical for noise suppression in mixed-voltage systems

Key Features

Feature Design Value
Registered pipelined interface Eliminates setup/hold timing violations on high-speed buses by synchronizing all I/O to CLK edge
Configurable burst addressing MODE pin selection between Pentium®-interleaved and linear sequences enables drop-in compatibility across x86 and RISC platforms
Synchronous self-timed writes On-chip write sequencing removes need for external write pulse generation or timing margining
Four independent byte-write lanes Per-byte control (BWA–BWD) allows partial-word updates without read-modify-write cycles, reducing bus traffic
JTAG boundary scan (IEEE 1149.1) Enables in-system testability and interconnect verification in dense PCB layouts without physical probe access

Applications

Secondary Cache for x86 Processors Network Packet Buffer Memory

Use Scenario: High-bandwidth L2 cache for Intel Pentium®-class CPUs in industrial control computers.

IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic 3.0 ns tCO reads and burst-aligned writes synchronized to CPU clock domain.

Use Value: Enables full 200 MHz burst transfers matching CPU front-side bus timing, eliminating wait states in cache line fills.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switching ASICs.

IC Role / Device Role / Timing Role: Synchronous buffer supporting concurrent read/write operations with separate ADSP/ADSC strobes for ingress/egress paths.

Use Value: Dual-strobe architecture allows independent address management for packet enqueue/dequeue, improving switch fabric throughput.

Real-Time DSP Data Buffer Avionics Display Frame Memory

Use Scenario: Low-latency data exchange between multi-core DSPs and FPGA co-processors in radar signal processing.

IC Role / Device Role / Timing Role: Deterministic-access memory with registered I/O ensuring cycle-accurate alignment between heterogeneous clock domains.

Use Value: Registered interface prevents metastability; 2.5 V I/O compatibility simplifies level-shifting with FPGA transceivers.

Use Scenario: Frame buffer for mission-critical cockpit display systems requiring guaranteed data retention under voltage fluctuation.

IC Role / Device Role / Timing Role: SRAM with ZZ sleep mode preserving pixel data during display controller power gating events.

Use Value: Asynchronous ZZ control enables rapid entry/exit from low-power state without clock dependency or data loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1480BV33-250AXC 250 MHz speed grade; identical pinout and feature set; 3.0 ns tCO vs. 3.4 ns at 200 MHz Requires tighter timing closure but enables higher bandwidth in CPU-adjacent cache roles Select when system clock exceeds 200 MHz and board layout supports faster signal integrity
IS61WV102436BLL-200BLI Same 2M × 36 organization and 200 MHz rating; no JTAG; different burst counter implementation (fixed linear only) Lacks ADSC/ADSP dual-strobe support and MODE-selectable burst order Choose for cost-sensitive designs where Pentium® compatibility is unnecessary and JTAG test is not required

Compared with CY7C1480V33-200AXC, the -250AXC offers higher throughput at the cost of stricter layout and power delivery requirements, while the IS61WV102436BLL-200BLI reduces feature count and test capability to lower BOM cost in non-x86 applications.

Availability

CY7C1480V33-200AXC is available at Aetrix Electronics and suitable for high-reliability secondary cache, network packet buffering, real-time DSP data exchange, and avionics frame memory applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1480V33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1480V33 series belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-latency cache and buffer applications in processor-adjacent subsystems.

FAQ

What is the function of the MODE pin on CY7C1480V33-200AXC?

The MODE pin selects between Intel Pentium®-compatible interleaved burst addressing and linear burst addressing. When MODE is LOW at power-up or reset, the device uses interleaved order (0,2,4,6,… then 1,3,5,7,…); when HIGH, it uses linear order (0,1,2,3,…). This configuration is latched and remains active until next reset or power cycle.

Can CY7C1480V33-200AXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports mixed-voltage operation: VDD = 3.3 V powers the core logic and memory array, while VDDQ = 2.5 V supplies the I/O buffers. This allows direct connection to 2.5 V FPGA or ASIC I/O banks without level shifters, provided VSSQ is tied to the same ground as VSS.

How does the ZZ sleep mode affect power consumption and data retention?

When ZZ is driven HIGH, the device enters a low-power sleep state drawing ≤120 mA standby current while preserving all stored data. Core clocks and I/O drivers are gated, but memory cell bias remains active. Data retention is guaranteed over the full industrial temperature range (–40°C to +85°C) with no time limit.

Is the CY7C1480V33-200AXC pin-compatible with CY7C1482BV33-200AXC?

No. Although both share the same FBGA package option, the CY7C1480V33-200AXC (2M × 36) and CY7C1482BV33-200AXC (4M × 18) differ in data bus width, pin assignments for DQ/DQP groups, and internal address mapping. They are not interchangeable without PCB redesign and firmware adaptation.

CY7C1480V33-200AXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1480V33-200AXC FAQ

1.How can I place an order for CY7C1480V33-200AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1480V33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1480V33-200AXC reliable?

The price and inventory of CY7C1480V33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480V33-200AXC is usually 5 days.

3.What payment methods are accepted for CY7C1480V33-200AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480V33-200AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1480V33-200AXC?

CY7C1480V33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1480V33-200AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1480V33-200AXC?

For technical support, including CY7C1480V33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480V33-200AXC requirements.

6.How does Aetrix verify that CY7C1480V33-200AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1480V33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480V33-200AXC meets industry standards.

7.What is the process for return or replacement of CY7C1480V33-200AXC?

All CY7C1480V33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480V33-200AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1480V33-200AXC part is unused and in its original packaging.

Return procedure for CY7C1480V33-200AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1480V33-200AXC Tags

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