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Cypress Semiconductor Corp CY7C1484BV33-250BZXC

Part No.:
CY7C1484BV33-250BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1484BV33-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:369

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Product details

Overview

CY7C1484BV33-250BZXC from Cypress Semiconductor is a 72-Mbit (2 M × 36) pipelined, double-cycle-deselect synchronous SRAM with registered inputs/outputs, 250 MHz bus operation, 3.0 ns clock-to-output time, and support for Intel Pentium®-compatible interleaved or linear burst sequences. It operates with 3.3 V core (VDD) and 2.5/3.3 V I/O (VDDQ), features IEEE 1149.1 JTAG boundary scan, and is used in high-performance secondary cache subsystems for x86-compatible processors.

For engineers reviewing the CY7C1484BV33-250BZXC datasheet, CY7C1484BV33-250BZXC pinout, CY7C1484BV33-250BZXC application, or CY7C1484BV33-250BZXC equivalent, key selection criteria include synchronous burst timing compliance, depth-expansion capability without wait states, byte-write granularity control via BWx/BWE/GW, ZZ sleep mode behavior, and FBGA-165 package thermal and routing constraints.

Technical Context

The device implements a 2-bit synchronous wraparound burst counter, with address strobes ADSP (processor) and ADSC (controller) enabling dual-source address capture on CLK rising edge. Burst sequencing-interleaved (MODE = VDD/floating) or linear (MODE = GND)-is statically selected and maintained during operation.

All synchronous inputs (A[1:0], CE1–CE3, ADSP/ADSC, ADV, BWA–BWD, BWE, GW, CLK) are registered on CLK rising edge; OE and ZZ are asynchronous. Output enable masking during first read cycle after deselect and pipelined output buffer disable (double-cycle deselect) ensure deterministic timing in depth-expanded memory banks.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2 M × 36 bits), enabling 9 MB of burst-accessible cache storage per device
Max Clock Frequency250 MHz - supports full-speed interface to Pentium-class processors without clock division
Access Time (tCO)3.0 ns - defines minimum CLK-to-valid-DQ delay for synchronous read outputs
Core Supply3.3 V (VDD) - powers internal logic and memory array; requires dedicated low-noise regulation
I/O Supply Range2.5 V or 3.3 V (VDDQ) - allows interoperability with mixed-voltage system buses
Burst ControlUser-selectable MODE pin - selects Intel Pentium®-compatible interleaved or linear address sequence
Write GranularityByte-selectable (4 × 9-bit bytes) via BWA–BWD + BWE; global write via GW overrides all byte enables

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, Pb-free.

Pin/TerminalCircuit RoleDesign Meaning
A0, A1Synchronous Address InputsSampled on CLK rising edge when ADSP/ADSC active; feed 2-bit burst counter for address incrementing
ADSP / ADSCAddress Strobe InputsProcessor- or controller-initiated address capture; ADSP takes priority if both asserted
ADVBurst Advance ControlAsserted LOW on CLK rising edge to auto-increment burst address; enables pipelined sequential reads/writes
BWA–BWD, BWE, GWByte Write ControlsBWX selects 9-bit byte; BWE enables byte write; GW forces full 36-bit write regardless of BWx state
OEAsynchronous Output EnableActive LOW enables DQ/DQP outputs; tri-states on HIGH; masked during first cycle after deselect
ZZAsynchronous Sleep InputActive HIGH places device in low-power sleep with data retention; internal pull-down ensures safe default
MODEBurst Sequence SelectorStatic strap pin: GND = linear burst, VDD/floating = interleaved (Pentium® compatible)
TCK/TDI/TDO/TMSJTAG Boundary ScanIEEE 1149.1 compliant test interface; TDO output active only when JTAG enabled

Key Features

FeatureDesign Value
Double-Cycle DeselectOutput buffers tri-state precisely two clocks after chip deselect, enabling zero-wait-state depth expansion across multiple SRAMs
Pipelined Enable RegisterDelays output buffer disable by one additional clock cycle, eliminating timing penalties during bank switching
Synchronous Self-Timed WritesOn-chip write timing control eliminates external write pulse generation; supports 1–4 byte writes per cycle
JEDEC JESD8-5 I/O CompatibilityEnsures interoperability with 2.5 V and 3.3 V LVTTL/LVCMOS bus drivers without level shifters
Configurable Burst ModeHardware-strapped MODE pin allows static selection of processor-matched burst order without firmware overhead

Applications

Intel Pentium® Secondary CacheHigh-Speed Network Buffer Memory

Use Scenario: Implements L2 cache for legacy x86 systems requiring burst-mode compatibility with Pentium® processors.

IC Role / Device Role / Timing Role: Synchronous SRAM providing pipelined, interleaved-burst reads/writes synchronized to CPU clock domain.

Use Value: 250 MHz operation and 3.0 ns tCO meet Pentium® P54C/P55C timing budgets; double-cycle deselect prevents pipeline stalls during cache line fills.

Use Scenario: Buffers packet headers and metadata in 10/100 Mbps Ethernet switch ASIC interfaces.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency FIFO/cache for ingress/egress traffic shaping and header parsing pipelines.

Use Value: Byte-write capability (BWA–BWD) enables efficient partial writes of variable-length packet fields; ZZ sleep reduces idle power in low-traffic periods.

Industrial Motion Controller Look-Up TablesAvionics Data Acquisition Buffer

Use Scenario: Stores real-time trajectory interpolation tables and servo tuning parameters in CNC and robotics controllers.

IC Role / Device Role / Timing Role: Deterministic-access SRAM holding critical motion profile data accessed synchronously by FPGA-based sequencers.

Use Value: Linear burst mode (MODE = GND) delivers predictable, monotonic address progression for smooth position interpolation; VDDQ = 2.5 V matches FPGA I/O voltage.

Use Scenario: Captures high-fidelity sensor samples (e.g., inertial measurement units) prior to ARINC-429 or MIL-STD-1553 framing.

IC Role / Device Role / Timing Role: Radiation-tolerant-adjacent buffer storing time-stamped analog-to-digital conversion results before serial transmission.

Use Value: JTAG boundary scan (IEEE 1149.1) enables in-system test and fault isolation in safety-critical avionics BOMs; 3.3 V core simplifies power architecture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISSI IS61WV102436BLL-250TQLISame density (2 M × 36), 250 MHz, but uses 165-ball FBGA with different pinout; no ZZ sleep mode; JEDEC JESD8-15 (2.5 V only) I/OLacks low-power sleep mode; requires 2.5 V I/O only - unsuitable where 3.3 V bus compatibility is neededSelect only if system uses fixed 2.5 V I/O and sleep mode is unused; verify pin mapping and timing margins against CY7C1484BV33-250BZXC
Winbond W9825G6JH-25SDRAM, not SRAM; 256 Mbit (8 M × 32), 250 MHz clock, but asynchronous command interface and refresh requirementsNot pin- or functionally compatible; requires DRAM controller, refresh management, and latency toleranceNot a drop-in replacement; consider only for cost-sensitive, non-real-time buffering where deterministic access is not required

Compared with IS61WV102436BLL-250TQLI and W9825G6JH-25, CY7C1484BV33-250BZXC uniquely combines 3.3 V core + dual-voltage I/O, hardware-configurable burst mode, ZZ sleep, and double-cycle deselect - essential for deterministic cache and real-time buffer designs where timing predictability and power control are mandatory.

Availability

CY7C1484BV33-250BZXC is available at Aetrix Electronics and suitable for Intel Pentium®-based embedded computing, industrial motion control systems, and avionics data acquisition requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1484BV33-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions.

The CY7C1484BV33 belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for deterministic, low-latency cache and buffer applications in x86-compatible and real-time embedded systems.

FAQ

What is the function of the MODE pin, and how must it be connected?

The MODE pin statically selects burst address sequence: tied to GND for linear burst (monotonic addressing), or to VDD/floating for interleaved burst (Pentium®-compatible). It is a strap pin - must remain static during operation and cannot be toggled dynamically. Internal pull-up ensures safe default to interleaved mode if left floating.

Does CY7C1484BV33-250BZXC support true 250 MHz operation with zero wait states?

Yes - the device guarantees 250 MHz bus operation with 3.0 ns clock-to-output (tCO) and supports depth expansion without wait states due to its double-cycle deselect architecture and pipelined enable register. This enables concurrent access across multiple devices in a bank without timing penalty.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters a non-time-critical sleep mode with full data retention. Core power (VDD) remains active; only I/O and peripheral circuitry are gated. Wake-up is immediate upon ZZ return to LOW - no stabilization delay is required, and the next valid access proceeds normally on the subsequent CLK edge.

Can BWA–BWD and BWE be used to perform partial writes without asserting GW?

Yes - BWE must be asserted LOW along with exactly one of BWA–BWD to write only the corresponding 9-bit byte. If BWE is HIGH, no byte writes occur regardless of BWx state. GW overrides all byte controls: when GW is LOW, all four bytes (36 bits) are written simultaneously, ignoring BWx and BWE values.

CY7C1484BV33-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1484BV33-250BZXC FAQ

1.How can I place an order for CY7C1484BV33-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1484BV33-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1484BV33-250BZXC reliable?

The price and inventory of CY7C1484BV33-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1484BV33-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1484BV33-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1484BV33-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1484BV33-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1484BV33-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1484BV33-250BZXC?

For technical support, including CY7C1484BV33-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1484BV33-250BZXC requirements.

6.How does Aetrix verify that CY7C1484BV33-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1484BV33-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1484BV33-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1484BV33-250BZXC?

All CY7C1484BV33-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1484BV33-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1484BV33-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1484BV33-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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