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Cypress Semiconductor Corp CY7C1512KV18-250BZXC

Part No.:
CY7C1512KV18-250BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:265

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Product details

Overview

CY7C1512KV18-250BZXC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent DDR read/write ports, 250 MHz clock operation (500 MT/s per port), 1.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1512KV18-250BZXC datasheet, CY7C1512KV18-250BZXC pinout, CY7C1512KV18-250BZXC application, or CY7C1512KV18-250BZXC equivalent, key selection criteria include burst depth (2-word), I/O voltage compatibility (VDDQ = 1.4–1.8 V), echo clock support (CQ/CQ), PLL-based data placement, and JTAG 1149.1 testability.

Technical Context

The CY7C1512KV18 implements true QDR II architecture with physically separate read and write data paths-no bus turnaround required. Its synchronous pipelined design uses rising edges of K/K clocks for address/data latching and C/C clocks for output timing control, enabling deterministic 1.5-cycle read latency when DOFF is asserted HIGH.

Internal self-timed writes, programmable impedance (ZQ calibration), and echo clocks (CQ/CQ) ensure signal integrity at 500 MT/s. The device supports depth expansion via RPS/WPS and byte write masking (BWS[1:0]) for selective 18-bit word updates without read-modify-write cycles.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 18-bit (72 Mbit); enables compact high-throughput buffer storage for 10G+ packet processing.
Max Clock Frequency250 MHz; supports 500 MT/s effective data rate on both read and write DDR ports.
Read Latency1.5 cycles (DOFF = HIGH); reduces pipeline stalls in burst-oriented traffic shaping logic.
VDD / VDDQCore VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; allows interoperability with 1.5V or 1.8V FPGA I/O banks.
Burst Length2-word fixed burst; guarantees predictable access timing and simplifies controller FIFO management.
Package165-ball FBGA (13 × 15 × 1.4 mm); industry-standard footprint compatible with automated PCB assembly.
JTAG SupportIEEE 1149.1 compliant TAP; enables boundary-scan testing and in-system programming verification.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix).

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data input18-bit parallel data sampled on rising edge of K clock; supports full-word or byte-masked writes via BWS[1:0].
Q[17:0]Synchronous read data output18-bit DDR output registered to C/C clocks; echoes CQ/CQ for source-synchronous capture in FPGA receivers.
K / KInput clock pairRising-edge-triggered master clocks for address and data latching; K used for read, K for write in dual-clock mode.
C / COutput clock pairSource-synchronous clocks for Q[17:0] outputs; minimize skew between data and clock at receiver inputs.
CQ / CQEcho clock outputsDelayed copies of C/C; simplify timing closure by providing reference for data capture in high-speed SerDes or FPGA logic.
RPS / WPSPort select controlsActive-low enables for independent read/write port activation; essential for depth expansion across multiple devices.
BWS[1:0]Byte write selectTwo active-low signals controlling 9-bit subwords (D[8:0], D[17:9]); enable partial-word updates without read-modify-write overhead.
DOFFRead latency mode selectHigh = 1.5-cycle latency (optimized for throughput); Low = 1-cycle latency (compatible with legacy QDR I controllers).
ZQImpedance calibration referenceConnects to external 240 Ω resistor to ground; enables on-die termination calibration for consistent HSTL drive strength.

Key Features

FeatureDesign Value
Separate read/write data portsEliminates bus turnaround delay-enables back-to-back read and write operations at full bandwidth.
DDR interfaces on both portsDoubles effective data rate without increasing clock frequency; reduces routing congestion vs. SDR interfaces.
Programmable ZQ impedance calibrationMaintains consistent HSTL output drive strength across voltage/temperature variation-critical for signal integrity at 500 MT/s.
PLL-based data placementAligns output data edges precisely with C/C clock transitions-reduces setup/hold margin requirements at receiver.
Concurrent transaction supportIndependent RPS/WPS and address latching allow simultaneous read and write to different addresses-ideal for ping-pong buffering.

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet switch ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed shared memory buffer interfacing directly to MAC-layer controllers via DDR buses.

Use Value: 250 MHz clock + 2-word burst delivers 9 Gbps sustained bandwidth per port-sufficient for full-duplex 10GbE line-rate buffering.

Use Scenario: Frame reassembly and traffic shaping in carrier-grade optical transport equipment (OTN/DWDM).

IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store between framer and scheduler logic with deterministic 1.5-cycle latency.

Use Value: Echo clocks (CQ/CQ) and PLL alignment reduce timing closure effort in FPGA-based scheduler designs operating at >200 MHz.

Baseband Processing BufferTest Equipment Pattern Memory

Use Scenario: Temporary storage of IQ samples between ADC/DAC and DSP cores in 5G massive MIMO radio units.

IC Role / Device Role / Timing Role: Low-latency, high-throughput memory co-located with FPGA fabric for real-time sample buffering.

Use Value: Independent RPS/WPS enables simultaneous sample ingestion (write) and FFT preprocessing (read)-maximizing DSP utilization.

Use Scenario: Storing stimulus/response vectors in high-speed ATE systems requiring precise timing alignment.

IC Role / Device Role / Timing Role: Deterministic-access memory referenced by pattern generator state machines with cycle-accurate control.

Use Value: JTAG 1149.1 support enables in-system verification of memory contents and pin-level fault coverage during production test.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C361024B-250BIN2M × 36-bit QDR II, same 250 MHz speed but wider bus; no ZQ calibration or echo clocks.Higher density per device but requires fewer chips for wide-data applications; lacks CQ/CQ for source-synchronous capture.Select when system needs 36-bit interface width and can manage timing without echo clocks.
IS61QW25636A-250TQLI256K × 36-bit QDR II+, higher speed grade (250 MHz) but smaller capacity; supports 1-cycle latency only.Lower density suits smaller buffers; lacks DOFF-selectable latency mode-limits flexibility in mixed-controller environments.Select for space-constrained designs where 72-Mbit is excessive and 1-cycle latency suffices.

Compared with AS7C361024B-250BIN and IS61QW25636A-250TQLI, CY7C1512KV18-250BZXC uniquely balances 4M×18 density, DOFF-configurable latency, ZQ calibration, and echo clocks-making it optimal for FPGA-based telecom buffers requiring both bandwidth and timing robustness.

Availability

CY7C1512KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and test equipment pattern memory requiring stable component supply across multi-year production cycles.

Supply support for CY7C1512KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR II SRAM product line was designed specifically for high-throughput, low-latency networking and telecommunications infrastructure-emphasizing deterministic timing, concurrent access, and signal integrity at multi-Gbps data rates.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-250BZXC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for maximum throughput; when LOW, it enables 1-cycle latency for backward compatibility with QDR I controllers. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

How does the ZQ pin operate during initialization?

The ZQ pin connects to an external 240 Ω resistor to ground and initiates on-die impedance calibration during power-up or upon command via the JTAG interface. This calibrates HSTL output drivers to maintain consistent 25 Ω or 50 Ω termination across process, voltage, and temperature variations-ensuring signal integrity at 500 MT/s.

Can CY7C1512KV18-250BZXC operate with only one clock domain?

Yes-it supports single-clock mode where K and C are tied together (and K and C likewise), eliminating need for separate clock nets. In this configuration, all inputs and outputs are synchronized to the same clock edge, simplifying board layout at the cost of reduced timing margin versus dual-clock operation.

What is the purpose of BWS[1:0] in CY7C1512KV18-250BZXC?

BWS[1:0] (Byte Write Select) enables selective 9-bit subword writes to the 18-bit data bus: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either signal is deasserted (HIGH), its corresponding 9-bit segment is masked-preserving existing data without requiring a read-modify-write sequence.

CY7C1512KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-250BZXC FAQ

1.How can I place an order for CY7C1512KV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512KV18-250BZXC reliable?

The price and inventory of CY7C1512KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1512KV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512KV18-250BZXC?

CY7C1512KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-250BZXC?

For technical support, including CY7C1512KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1512KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-250BZXC?

All CY7C1512KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1512KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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