Cypress Semiconductor Corp CY7C1512KV18-333BZXC
- Part No.:
- CY7C1512KV18-333BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-333BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:326
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Product details
Overview
CY7C1512KV18-333BZXC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 333 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (700 Mbps effective data rate), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1.5-cycle read latency (DOFF = HIGH) in high-bandwidth networking and packet buffering applications.
For engineers reviewing the CY7C1512KV18-333BZXC datasheet, CY7C1512KV18-333BZXC pinout, CY7C1512KV18-333BZXC application, or CY7C1512KV18-333BZXC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing accuracy, and FBGA-165 package compatibility for high-speed PCB layout.
Technical Context
This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed address bus, with address latching on alternate rising edges of K/K clocks. Internal self-timed writes and pipelined access eliminate bus turnaround delays.
The device uses dual input clocks (K/K for address/control, C/C for output timing) plus echo clocks (CQ/CQ) to align data capture at the receiver. A built-in PLL ensures precise data placement relative to output clocks, supporting stable operation at 333 MHz with 1.5-cycle read latency when DOFF is asserted HIGH.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit) - supports 18-bit parallel data paths in packet buffer and switch fabric designs |
| Max Clock Frequency | 333 MHz - enables 666 MT/s effective throughput per port with DDR interface |
| Data Bus Width | 18-bit bidirectional I/O - matches standard 18-bit memory subsystems without glue logic |
| Read Latency | 1.5 cycles (DOFF = HIGH) - reduces pipeline stalls in real-time traffic processing |
| Core Supply Voltage | 1.8 V ±0.1 V - compatible with low-voltage ASIC/FPGA I/O domains |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with both 1.5V and 1.8V HSTL systems |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - optimized for controlled impedance routing and thermal dissipation |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | 18-bit parallel data sampled on rising edge of K clock; enables full-width burst writes |
| Q[17:0] | Synchronous read data outputs | 18-bit parallel data registered to C/C clocks; supports echo-clock–based capture |
| K / K | Input clocks (read/write) | Separate rising-edge–triggered clocks for address/control latching; eliminates skew between ports |
| C / C | Output clocks | Source-synchronous clocks for Q[17:0]; minimize flight time mismatch in high-speed routing |
| CQ / CQ | Echo clocks | Delayed copies of C/C; simplify timing closure by matching data path delay |
| WPS | Write port select | Active-low signal enabling write operations; deassertion blocks D[17:0] sampling |
| BWS[1:0] | Byte write selects | Two active-low signals controlling 9-bit byte groups (D[8:0], D[17:9]); enable partial writes without read-modify-write |
| DOFF | Read latency mode control | High = 1.5-cycle latency; Low = 1-cycle latency (QDR I compatibility mode) |
| VDDQ | I/O power supply | 1.4–1.8 V supply for all D/Q pins; decoupling required per HSTL-18 spec |
| VDD | Core power supply | 1.8 V ±0.1 V supply for internal logic and memory array; separate from VDDQ |
| ZQ | Impedance calibration reference | Connects to 240 Ω ±1% external resistor to ground for programmable output driver termination |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables true concurrent access-no arbitration or bus turnaround needed in full-duplex packet buffers |
| 2-word burst architecture | Guarantees minimum 36-bit data transfer per access cycle, optimizing bandwidth utilization in streaming protocols |
| PLL-based output timing | Ensures sub-cycle jitter control for reliable 700 Mbps DDR data capture at 333 MHz clock frequency |
| HSTL Class I-compatible I/O | Supports 1.5V/1.8V signaling with programmable drive strength and on-die termination via ZQ calibration |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system debug without additional test fixtures or probes |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packets in Layer 2/3 Ethernet switches with line-rate forwarding. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized to switch ASIC clocks. Use Value: Concurrent read/write eliminates serialization bottlenecks, enabling 10 Gbps+ throughput with deterministic latency. | Use Scenario: Interconnecting multiple switching planes in modular chassis-based routers. IC Role / Device Role / Timing Role: High-bandwidth memory node in crossbar interconnect, accessed by distributed control processors. Use Value: 72-Mbit density and 333 MHz operation support multi-gigabit cell-based switching with sub-10 ns access granularity. |
| Telecom Line Card Memory | High-Speed Test Equipment Buffer |
Use Scenario: Frame buffering in CPRI/OBSAI baseband units for 4G/LTE radio processing. IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly to FPGA-based digital front-end, using echo clocks for timing margin recovery. Use Value: 1.5-cycle latency and CQ alignment reduce setup/hold violations in 300+ MHz FPGA I/O interfaces. | Use Scenario: Capturing high-speed serial data streams during automated functional test of SerDes ICs. IC Role / Device Role / Timing Role: Real-time acquisition buffer synchronized to pattern generator clocks, feeding analysis logic in tester FPGA. Use Value: Separate read/write ports allow simultaneous capture and analysis without memory contention or FIFO overflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1512KV18-350BZXC | Higher max frequency (350 MHz vs. 333 MHz); identical pinout, timing, and feature set | Requires tighter PCB layout tolerances and higher-grade power delivery for stable 350 MHz operation | Select when system clock budget allows margin for future speed upgrades or derating |
| AS7C3256A-15JCIN | Asynchronous 32K × 16 SRAM; no DDR, no echo clocks, no PLL; 15 ns access, 3.3 V only | Limited to low-speed control-plane buffering; incompatible with QDR II timing or burst protocols | Only suitable for non-critical, low-bandwidth auxiliary storage where QDR features are unused |
Compared with CY7C1512KV18-350BZXC, this part trades 17 MHz speed headroom for relaxed signal integrity requirements; compared with AS7C3256A-15JCIN, it provides true concurrent access, DDR bandwidth, and advanced timing control essential for modern packet-processing systems.
Availability
CY7C1512KV18-333BZXC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom line card memory, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for CY7C1512KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, computing, and industrial applications.
This device belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-throughput memory access in packet-switched infrastructure where concurrent read/write and precise timing control are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-333BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimal QDR II performance; when LOW, it reverts to 1-cycle latency for backward compatibility with QDR I systems. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
How does the ZQ pin operate in CY7C1512KV18-333BZXC?
The ZQ pin connects to a 240 Ω ±1% external resistor to ground and enables on-die impedance calibration for HSTL I/O drivers. During initialization or periodic recalibration, the device measures ZQ resistance and adjusts output driver strength and termination to maintain consistent 240 Ω source impedance, ensuring signal integrity across voltage and temperature variations.
Can CY7C1512KV18-333BZXC operate with only one clock domain?
Yes - the device supports single-clock mode where K and C are tied together (and K and C likewise), simplifying timing design at the cost of reduced flexibility. In this mode, read data is registered to the same clock used for address latching, eliminating echo clock dependency but limiting maximum achievable frequency due to internal path delays.
What is the purpose of BWS[1:0] in CY7C1512KV18-333BZXC?
BWS[1:0] (Byte Write Select) controls 9-bit write masking: BWS0 enables writes to D[8:0], BWS1 to D[17:9]. Both signals are active-low and sampled on the K clock edge. This allows partial 18-bit word updates without read-modify-write cycles, preserving unselected bytes and reducing bus traffic in protocol header manipulation or metadata update scenarios.
CY7C1512KV18-333BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-333BZXC FAQ
1.How can I place an order for CY7C1512KV18-333BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-333BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-333BZXC reliable?
The price and inventory of CY7C1512KV18-333BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-333BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-333BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-333BZXC transactions.
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CY7C1512KV18-333BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-333BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-333BZXC?
For technical support, including CY7C1512KV18-333BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-333BZXC requirements.
6.How does Aetrix verify that CY7C1512KV18-333BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-333BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-333BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-333BZXC?
All CY7C1512KV18-333BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-333BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-333BZXC part is unused and in its original packaging.
Return procedure for CY7C1512KV18-333BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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