Cypress Semiconductor Corp CY7C1512KV18-333BZXI

Overview

CY7C1512KV18-333BZXI from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 333 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (700 MT/s effective data rate), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1.5-cycle read latency (DOFF = HIGH) for high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C1512KV18-333BZXI datasheet, CY7C1512KV18-333BZXI pinout, CY7C1512KV18-333BZXI application, or CY7C1512KV18-333BZXI equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), JTAG 1149.1 compliance, PLL-based timing accuracy, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

The CY7C1512KV18-333BZXI implements true dual-port synchronous pipelined architecture: independent K/K clocks drive address/data latching on rising edges only, while C/C clocks control output registers to minimize skew. Its 2M × 18 memory array uses multiplexed address bus with port-select logic (WPS/RPS) enabling depth expansion without external arbitration.

Read operations execute with programmable latency (1-cycle when DOFF = LOW; 1.5-cycle when DOFF = HIGH), and writes are self-timed with synchronous byte write enables (BWS[1:0]) supporting partial-word updates. Echo clocks (CQ/CQ) align with output data edges to simplify capture in FPGA-based systems operating at 333 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant (BZXI suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1512KV18-300BZXI, the -333BZXI offers +33 MHz bandwidth headroom without changing layout or firmware; versus AS7C36256P-333BIN, it delivers deterministic DDR timing, full concurrency, and production-testability-critical for telecom infrastructure.

Availability

CY7C1512KV18-333BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1512KV18-333BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for networking, automotive, and industrial applications.

The QDR® II SRAM product line targets high-throughput, low-latency memory subsystems in packet-switched infrastructure-specifically engineered to replace asynchronous SRAMs in systems demanding concurrent access and precise DDR timing.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-333BZXI?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it enables 1-cycle latency for minimal read delay. This setting directly controls internal pipeline staging and must be held stable during operation.

Can CY7C1512KV18-333BZXI operate with only one clock domain (K = C)?

Yes-it supports single-clock-domain operation where K and C are tied together, but this sacrifices skew mitigation benefits. In that mode, echo clocks (CQ/CQ) still track C, and output registers remain clocked by C. Full performance (333 MHz) requires separate K and C routing per datasheet AC timing specifications.

How does byte write select (BWS) work for the 18-bit data width?

BWS[1:0] divides the 18-bit D[17:0] bus into two 9-bit bytes: BWS0 enables D[8:0], BWS1 enables D[17:9]. Both signals are sampled synchronously with K clock edges. Deasserting either BWS leaves corresponding 9-bit segment unchanged-enabling efficient partial-word updates without read-modify-write cycles.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes-the CY7C1512KV18-333BZXI in FBGA-165 (13 × 15 mm) follows IPC/JEDEC J-STD-020 moisture sensitivity level 3 and qualifies for standard lead-free reflow profiles (peak 260°C). Board layout must observe 0.8 mm ball pitch spacing, thermal pad under center, and controlled-impedance routing for K/C/CQ signals.