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Cypress Semiconductor Corp CY7C1512KV18-350BZC

Part No.:
CY7C1512KV18-350BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-350BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:296

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Product details

Overview

CY7C1512KV18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 350 MHz QDR® II SRAM with independent read/write DDR ports, 1.8V core supply, and 1.4–1.8V I/O supply, used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1512KV18 datasheet, CY7C1512KV18 pinout, CY7C1512KV18 application, or CY7C1512KV18 equivalent, key selection criteria include burst timing compliance, echo clock (CQ/CQ) capture support, DOFF-configurable read latency (1.5-cycle vs. 1-cycle), and FBGA-165 package thermal/mechanical constraints.

Technical Context

This QDR II SRAM implements fully synchronous pipelined operation with separate K/K clocks for write/read address latching and C/C clocks for output data registration. It uses rising-edge-only clocking on all inputs and supports concurrent read/write transactions without bus turnaround.

The device integrates a PLL for precise data placement, JTAG 1149.1 boundary scan for testability, and programmable impedance control via ZQ pin. Read latency is configurable via DOFF: HIGH enables 1.5-cycle latency; LOW reverts to 1-cycle latency compatible with QDR I systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 18-bit (72 Mbit) - provides 72 million bits of fast, low-latency buffer storage per device
Max Clock Frequency350 MHz - enables 700 MT/s effective data rate per port using DDR interfaces
Read LatencyConfigurable: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - determines minimum read-to-read interval in system timing budget
Supply VoltagesVDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - supports mixed-signal SoC interfacing with 1.5V or 1.8V I/O domains
Burst Length2-word burst on all accesses - delivers two consecutive 18-bit words per address cycle, optimizing throughput for packet-aligned data
Package165-ball FBGA (13 × 15 × 1.4 mm) - surface-mount package with controlled impedance routing and thermal dissipation suitable for dense PCB layouts
Interface StandardHSTL Class I compatible outputs - ensures signal integrity at 700 MT/s with matched termination and low noise margin

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data input18-bit parallel data sampled on rising edge of K clock; defines memory content written per address
A[20:0]Shared address bus21-bit address latched alternately on K (read) and K (write) rising edges for depth expansion
WPSWrite port selectActive-low signal enabling write transaction; deassertion blocks D[17:0] acceptance
BWS[1:0]Byte write selectTwo active-low signals controlling 9-bit byte writes: BWS0 → D[8:0], BWS1 → D[17:9]
CQ / CQEcho clocksSource-synchronous output clocks aligned with Q[17:0] data edges to simplify high-speed capture in FPGA/ASIC receivers
DOFFRead latency mode controlHigh = 1.5-cycle latency (QDR II native); Low = 1-cycle latency (QDR I backward compatibility)
ZQImpedance calibration referenceConnects to external 240 Ω resistor to ground for HSTL output driver calibration
TCK/TMS/TDI/TDOJTAG test access portIEEE 1149.1 compliant boundary scan interface for production testing and debug

Key Features

FeatureDesign Value
Independent read/write DDR portsEnables full-duplex 700 MT/s bandwidth without bus turnaround delays or arbitration logic
Configurable 1.5-cycle or 1-cycle read latencyAllows system-level timing optimization: higher throughput (1.5-cycle) or legacy compatibility (1-cycle)
Echo clocks (CQ/CQ)Eliminates clock-data skew at receiver, reducing setup/hold margin requirements in >500 MHz designs
Programmable HSTL drive strengthSupports impedance matching across varying trace lengths and loads without external resistors
On-chip PLL for data alignmentCompensates for internal clock path mismatches to ensure accurate DDR data placement relative to C/C clocks

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer with concurrent read/write access for traffic shaping and queue management.

Use Value: 700 MT/s per port sustains line-rate 10G/40G switching with zero bus turnaround overhead.

Use Scenario: Frame buffering in 3G/4G base station remote radio units requiring deterministic latency.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM providing jitter-free data staging between RF front-end and baseband processor.

Use Value: DOFF-selectable latency allows tuning to match PHY layer timing constraints without redesigning clock tree.

Test Equipment Data CaptureHigh-Speed Protocol Analyzer

Use Scenario: Real-time acquisition of serial protocol streams (PCIe, SATA) at multi-GHz sampling rates.

IC Role / Device Role / Timing Role: Burst-mode memory buffer capturing interleaved data bursts from parallelized ADC channels.

Use Value: 2-word burst architecture matches common protocol payload sizes, minimizing address overhead per transfer.

Use Scenario: Deep packet inspection in inline network security appliances processing encrypted TLS flows.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as inspection pipeline stage between decryption engine and pattern-matching accelerator.

Use Value: Independent ports enable simultaneous write (decrypted payload) and read (signature scan) operations at full bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C36256P-20TINAsynchronous 256K × 18-bit SRAM; no DDR, no echo clocks, max 20 ns access timeLacks concurrent read/write; unsuitable for >200 MHz sustained throughput or source-synchronous captureSelect only for cost-sensitive, non-pipelined control-plane buffers where latency tolerance >20 ns
IS61WV102418BLL-10BLISynchronous 1M × 18-bit, 10 ns cycle time, single-port, no burst, no echo clocksNo independent ports or DDR; requires external arbitration for full-duplex useUse only when system bandwidth demand <350 MB/s and board space permits discrete arbitration logic

Compared with AS7C36256P-20TIN and IS61WV102418BLL-10BLI, CY7C1512KV18 uniquely delivers true concurrent 700 MT/s read+write bandwidth with source-synchronous echo clocks-critical for deterministic real-time packet processing where bus turnaround or external arbitration would violate timing budgets.

Availability

CY7C1512KV18 is available at Aetrix Electronics and suitable for network switch fabric design, telecom line card development, and high-speed test equipment requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1512KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1512KV18 belongs to the QDR II SRAM product line, designed specifically for ultra-low-latency, high-bandwidth buffering in packet-switched infrastructure where deterministic timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1512KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency (native QDR II operation); when LOW, it selects 1-cycle latency for backward compatibility with QDR I systems. This setting directly impacts minimum read-to-read timing and must be fixed at power-up based on system clocking architecture.

How does the CQ/CQ echo clock improve system timing margin?

CQ and CQ are source-synchronous output clocks driven with the same delay as Q[17:0] data signals. They allow the receiving device (e.g., FPGA) to latch data using a clock edge aligned to data valid window, eliminating flight-time skew between clock and data nets. This reduces required setup/hold margins by up to 300 ps compared to system-synchronous clocking.

Can CY7C1512KV18 operate with only one clock domain (K = C)?

Yes - the device supports single-clock-domain operation where K and C are tied together. In this mode, all inputs and outputs are referenced to the same clock, simplifying clock distribution but sacrificing the skew-reduction benefit of separate read/write clocks and echo clocks. Timing parameters shift to reflect unified clock constraints per datasheet Table 10.

What is the role of the ZQ pin and how must it be connected?

ZQ is the impedance calibration reference terminal. It must be connected to a precision 240 Ω resistor to ground to enable on-die termination calibration of HSTL Class I output drivers. Without this connection, output drive strength varies with process/voltage/temperature, risking signal integrity violations above 400 MT/s.

CY7C1512KV18-350BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
350 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-350BZC FAQ

1.How can I place an order for CY7C1512KV18-350BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512KV18-350BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512KV18-350BZC reliable?

The price and inventory of CY7C1512KV18-350BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-350BZC is usually 5 days.

3.What payment methods are accepted for CY7C1512KV18-350BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-350BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512KV18-350BZC?

CY7C1512KV18-350BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512KV18-350BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-350BZC?

For technical support, including CY7C1512KV18-350BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-350BZC requirements.

6.How does Aetrix verify that CY7C1512KV18-350BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-350BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-350BZC meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-350BZC?

All CY7C1512KV18-350BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-350BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-350BZC part is unused and in its original packaging.

Return procedure for CY7C1512KV18-350BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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