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Cypress Semiconductor Corp CY7C1512V18-167BZC

Part No.:
CY7C1512V18-167BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512V18-167BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,271

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Product details

Overview

CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 167 MHz QDR-II SRAM with separate read/write ports, DDR interfaces on both ports, and 1.8V core / 1.4V–1.8V I/O supply. It delivers 500 MT/s data transfer rate per port using K/K and C/C differential clock pairs, and supports synchronous self-timed writes in a 165-ball FBGA (15 × 17 × 1.4 mm). It is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, key selection criteria include burst depth (2-word), HSTL-18 I/O compatibility, DLL-enabled timing accuracy, echo clock (CQ/CQ) support for source-synchronous capture, and 18-bit data width for efficient 32-bit-aligned bus interfacing.

Technical Context

The CY7C1512V18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated rising-edge-triggered clocks (K/K for inputs, C/C for outputs). Its 2M × 18 internal organization uses 21 address bits and supports depth expansion via RPS/WPS and BWS[1:0] signals.

It integrates a Delay Lock Loop (DLL) for precise output data alignment relative to C/C, echo clocks CQ/CQ referenced to C/C for PCB flight-time deskew, and variable-strength HSTL-18 output drivers calibrated via ZQ pin. All control inputs are registered, and writes are internally self-timed without external latency handshaking.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 configuration)
Maximum Clock Frequency 167 MHz - defines maximum sustained 500 MT/s DDR throughput per port
Data Bus Width 18-bit bidirectional I/O - enables efficient 32-bit system bus utilization with minimal padding
Core Supply Voltage 1.8 V ±0.1 V - powers logic and memory array; requires tight regulation for timing stability
I/O Supply Range 1.4 V to 1.8 V - supports HSTL-18 interface compliance and board-level voltage margining
Package 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count, high-speed memory placement
Burst Length 2-word - fixed burst delivers two 18-bit words per access, optimizing bandwidth vs. latency trade-off

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data latched on rising edge of K clock; ignored when WPS deasserted
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS deasserted
RPS Read port select Active-low signal enabling read access; sampled on rising edge of K clock
WPS Write port select Active-low signal enabling write access; sampled on rising edge of K clock
BWS[1:0] Byte write select Two active-low signals controlling which 9-bit byte (D[8:0] or D[17:9]) is written during burst
K, K Positive/negative input clocks DDR clock pair for all synchronous inputs; only rising edges used for register sampling
C, C Positive/negative output clocks DDR clock pair for Q[17:0] and echo clocks; enables source-synchronous data capture
CQ, CQ Echo clocks Free-running copies of C/C, aligned to output data edges-used for receiver deskew
ZQ Output impedance calibration Connects to external resistor to ground to tune Q[17:0]/CQ/CQ driver strength to 0.2×RQ
DOFF DLL disable Active-low pin disabling internal DLL; alters output timing-use only if system-level skew compensation is handled externally
VDD, VDDQ, VSS Power and ground VDD = 1.8 V core supply; VDDQ = 1.4–1.8 V I/O supply; VSS = common ground reference
VREF HSTL reference voltage Static bias point for HSTL input thresholds and AC measurement; must be stable at 0.75×VDDQ

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround overhead and contention-enables concurrent read+write in same cycle
2-word DDR burst Delivers 36 bits per clock cycle per port at 167 MHz → 6 Gbps aggregate bandwidth (read+write)
Integrated DLL + echo clocks Enables sub-300 ps output data-to-clock alignment and board-level flight-time deskew without external delay lines
HSTL-18 compatible I/O Supports 1.4–1.8 V VDDQ with programmable drive strength via ZQ calibration-matches FPGA/ASIC memory controllers
JTAG 1149.1 test port Enables boundary-scan testing and in-system debug without requiring additional test pads or probes

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet headers and payloads in switch fabric ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level packet buffer with zero-turnaround read/write arbitration between ingress and egress engines.

Use Value: 18-bit width matches typical header word size; 2-word burst aligns with common packet descriptor formats; echo clocks simplify timing closure at 500 MT/s.

Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE) systems.

IC Role / Device Role / Timing Role: High-throughput memory staging buffer between high-speed ADC/DAC and FPGA-based sequencer logic.

Use Value: Concurrent read/write allows simultaneous acquisition and playback; DLL-calibrated outputs ensure deterministic setup/hold at 167 MHz system clock.

Baseband Signal Processing Industrial Vision Frame Buffer

Use Scenario: Intermediate storage for FFT bins and channel estimation results in LTE/5G baseband processors.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed by multiple DSP cores via shared address bus and independent data paths.

Use Value: 1.8 V core reduces dynamic power vs. 2.5 V QDR-I; BWS[1:0] enables selective 9-bit word updates without full 18-bit write cycles.

Use Scenario: Frame buffering between high-resolution CMOS image sensors (e.g., 4K@60fps) and real-time vision processing units.

IC Role / Device Role / Timing Role: Dual-port memory decoupling sensor write rate from processor read rate-absorbing jitter and enabling frame synchronization.

Use Value: 72-Mbit capacity holds >1 full 4K RGB frame at 12-bit depth; CQ/CQ clocks allow FPGA receiver to lock to data eye center across temperature/voltage variation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1512V18-200BZC Higher max frequency (200 MHz) → 600 MT/s DDR; identical pinout and 4M×18 configuration Requires tighter PCB layout and stricter VDD/VDDQ regulation; suitable for designs needing higher sustained bandwidth Select when system clock budget allows 200 MHz operation and timing margins support faster switching
AS7C3256A-15JCIN Asynchronous 32K×8 SRAM, no DDR/QDR architecture; 15 ns access, single-port, 3.3 V only Lacks concurrent read/write and echo clock support-requires external arbitration and limits max throughput to ~66 MHz Consider only for cost-sensitive, low-bandwidth legacy upgrades where QDR-II features are unnecessary

Compared with CY7C1512V18-200BZC, the -167BZC offers relaxed timing margins and lower power at 167 MHz, while AS7C3256A-15JCIN lacks QDR-II's concurrency and source-synchronous timing-making it unsuitable for new high-speed packet or video buffer designs.

Availability

CY7C1512V18-167BZC is available at Aetrix Electronics and suitable for network infrastructure, automated test equipment, baseband processing, and industrial vision systems requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1512V18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR-II SRAM product line targets high-bandwidth, low-latency buffering in packet-switched systems-optimized for deterministic timing, concurrent access, and seamless integration with FPGA and ASIC memory controllers.

FAQ

What is the function of the ZQ pin on CY7C1512V18-167BZC?

The ZQ pin calibrates the output driver impedance of Q[17:0], CQ, and CQ to match the system data bus. It must be connected to a precision resistor (typically 100 Ω) tied to ground; alternatively, connecting ZQ directly to VDDQ enables minimum output impedance mode. Leaving ZQ floating or tying it to ground violates specification and causes undefined drive strength.

Can CY7C1512V18-167BZC operate in single-clock mode?

Yes-it supports single-clock mode where K and C are tied together (and K and C are tied together), eliminating the need for separate input/output clock domains. In this mode, data is latched and driven on K/K edges, and CQ/CQ are generated relative to K/K. Setup/hold timing changes versus dual-clock mode, so refer to Table 12 in the datasheet for revised values.

How does the DOFF pin affect timing behavior?

Asserting DOFF (driving it LOW) disables the internal Delay Lock Loop, causing output data to be launched with uncalibrated delay relative to C/C. This increases output skew and reduces timing margin-only recommended when external deskew circuitry compensates. DLL-disabled timing parameters differ significantly from those in the standard datasheet tables and require re-characterization.

What is the purpose of BWS[1:0] in the 4M×18 configuration?

BWS[1:0] are active-low byte write select signals that enable partial writes to either the lower 9-bit byte (D[8:0], controlled by BWS0) or upper 9-bit byte (D[17:9], controlled by BWS1) of the 18-bit data bus. When one BWS is deasserted, its corresponding byte remains unchanged-allowing efficient updates without overwriting adjacent data in the same word.

CY7C1512V18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1512V18-167BZC FAQ

1.How can I place an order for CY7C1512V18-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512V18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512V18-167BZC reliable?

The price and inventory of CY7C1512V18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1512V18-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-167BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512V18-167BZC?

CY7C1512V18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512V18-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512V18-167BZC?

For technical support, including CY7C1512V18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-167BZC requirements.

6.How does Aetrix verify that CY7C1512V18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1512V18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1512V18-167BZC?

All CY7C1512V18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512V18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1512V18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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