Cypress Semiconductor Corp CY7C1512V18-167BZXI
- Part No.:
- CY7C1512V18-167BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512V18-167BZXI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:212
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Product details
Overview
CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 167 MHz maximum operating frequency, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent read/write transactions for high-bandwidth packet buffering in network line cards.
For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, key selection criteria include burst depth (2-word), I/O voltage range (VDDQ = 1.4V to 1.8V), DLL-enabled timing accuracy, HSTL-compatible output drive, and JTAG 1149.1 test access support.
Technical Context
The CY7C1512V18 implements QDR-II architecture with fully independent read and write ports sharing a multiplexed 21-bit address bus. Address latching occurs on alternate rising edges of K/K clocks, enabling pipelined access without bus turnaround.
It uses dual output clocks (C/C̄) with echo clocks (CQ/CQ̄) to deskew data capture across high-speed PCB traces, and integrates a Delay Lock Loop (DLL) to align internal data paths with external clock edges-critical for maintaining setup/hold margins at 500 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 2-word burst transfers per access cycle |
| Max Clock Frequency | 167 MHz; enables 334 million transfers per second (MT/s) on each port |
| Data Rate | 500 MT/s effective (DDR on both read/write ports); eliminates bus turnaround overhead |
| VDD / VDDQ | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4 V to 1.8 V; enables low-power, high-speed HSTL signaling |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm); RoHS-compliant, thermal and electrical performance optimized for dense routing |
| Timing Control | Integrated DLL synchronizes internal data paths to C/C̄ clocks; ensures sub-ns timing alignment at 2 ns cycle time |
| JTAG Support | IEEE 1149.1-compliant TAP controller for boundary-scan testing and debug in production systems |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, 0.8 mm ball pitch, Pb-free and leaded options available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edge of K/K̄; supports full 18-bit parallel writes per burst |
| Q[17:0] | Synchronous read data outputs | Driven on rising edge of C/C̄; tri-stated when RPS is deasserted |
| A[20:0] | Multiplexed address bus | 21-bit shared address input for both read and write ports; reduces pin count vs. dual-bus architecture |
| RPS / WPS | Read/Write Port Select | Active-low synchronous controls; enables independent port activation and depth expansion |
| BWS[1:0] | Byte Write Select | Two active-low signals controlling D[8:0] and D[17:9]; enables partial-word writes without read-modify-write |
| C / C̄, CQ / CQ̄ | Output clocks & echo clocks | C/C̄ drive Q[17:0]; CQ/CQ̄ replicate C/C̄ phase for receiver-side deskew in point-to-point links |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune output driver impedance to match 50 Ω system trace impedance |
| DOFF | DLL disable control | Pulling low disables DLL; used for power-down or compatibility with legacy timing models |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates data bus turnaround delay and contention; enables true simultaneous access for real-time packet processing |
| 2-Word Burst Architecture | Delivers two 18-bit words per clock cycle-reducing address strobe overhead and maximizing bandwidth efficiency |
| HSTL-Compatible I/O | Variable-drive output buffers meet JEDEC HSTL Class I specifications; ensures signal integrity at 500 MT/s on controlled-impedance PCBs |
| On-Chip DLL | Compensates for process/voltage/temperature variation to maintain <0.3 ns jitter on Q[17:0] output timing relative to C/C̄ |
| Byte-Level Write Enable | BWS[1:0] allows selective updating of upper/lower 9-bit bytes-critical for header modification in networking ASIC interfaces |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: High-speed ingress/egress buffering in 10G/40G Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: Dedicated QDR-II SRAM providing concurrent read (forwarding decision) and write (packet arrival) operations at line rate. Use Value: 500 MT/s DDR throughput sustains full-duplex 40Gbps traffic with zero bus turnaround latency, reducing ASIC pipeline stalls. | Use Scenario: Frame assembly/disassembly in OC-192 SONET/SDH line interface units. IC Role / Device Role / Timing Role: Dual-port memory staging payload data between framer and processor, synchronized to line clock domain. Use Value: C/C̄ and CQ/CQ̄ pairing enables precise source-synchronous capture at 167 MHz, meeting SONET jitter tolerance requirements. |
| Baseband Processing Buffer | High-Performance Test Equipment |
Use Scenario: Real-time symbol buffering in LTE-Advanced baseband processors handling multi-carrier aggregation. IC Role / Device Role / Timing Role: Low-latency memory for FFT/IFFT result exchange between DSP cores and channel encoders. Use Value: 2-word burst mode matches typical OFDM symbol size; DLL ensures deterministic 1.2 ns read access time across temperature. | Use Scenario: Pattern generation and acquisition in 10+ Gbps bit error rate testers (BERTs). IC Role / Device Role / Timing Role: High-fidelity waveform storage with sub-cycle timing control for stimulus/response correlation. Use Value: ZQ-calibrated HSTL outputs maintain <5% overshoot on 50 Ω loads, preserving signal fidelity up to 500 MHz fundamental. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-167BIN | Single-ended SSTL-18 I/O; no echo clocks or DLL; 167 MHz max, 4M × 18-bit | Lacks source-synchronous deskew capability; requires tighter board layout control for timing closure | Select when cost sensitivity outweighs need for CQ/CQ̄-based timing margin and system-level skew compensation |
| IS61WV102418B-167TQLI | Asynchronous interface; no DDR; 167 MHz max, 1M × 18-bit (smaller density) | No pipelined burst or concurrent port operation; higher latency per access | Select only for legacy designs requiring simple address/data/control timing without QDR-II complexity |
Compared with AS7C361024B-167BIN and IS61WV102418B-167TQLI, the CY7C1512V18 uniquely provides DLL-aligned echo clocks and true concurrent read/write-enabling deterministic sub-2 ns access in high-speed serial link subsystems where timing margin is constrained.
Availability
CY7C1512V18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffer, and high-performance test equipment requiring stable component supply across extended product lifecycles.
Supply support for CY7C1512V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking and telecom infrastructure-specifically engineered to replace asynchronous SRAMs and simplify DDR-based memory controllers.
FAQ
What is the minimum VDDQ voltage supported by CY7C1512V18?
The device specifies VDDQ = 1.4 V to 1.8 V. Operation below 1.4 V is not characterized or guaranteed; HSTL output drive strength and timing parameters degrade outside this range. System designs must regulate VDDQ within this window using dedicated LDOs or PMIC rails.
Can CY7C1512V18 operate without the DLL enabled?
Yes-asserting DOFF low disables the DLL. However, AC timing parameters change significantly: tAC increases from 1.2 ns to 1.8 ns, and output jitter rises above 0.5 ns. This mode is intended only for power-sensitive standby states or compatibility validation-not for active high-speed operation.
How many address bits are required for CY7C1512V18's 4M × 18 configuration?
21 address bits (A[20:0]) are required. The internal array is organized as two 2M × 18 banks; address bits A[20:0] fully decode the 4M-word space. No additional bank select lines are needed-the architecture uses address multiplexing instead of explicit bank control.
Is ZQ pin mandatory for functional operation?
No-ZQ is optional for impedance tuning. If unused, connect ZQ directly to VDDQ to enable minimum output drive strength (≈25 Ω). Leaving ZQ floating or tied to GND violates absolute maximum ratings and may cause output driver malfunction or excessive current draw.
CY7C1512V18-167BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512V18-167BZXI FAQ
1.How can I place an order for CY7C1512V18-167BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512V18-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512V18-167BZXI reliable?
The price and inventory of CY7C1512V18-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-167BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1512V18-167BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-167BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512V18-167BZXI?
CY7C1512V18-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512V18-167BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512V18-167BZXI?
For technical support, including CY7C1512V18-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-167BZXI requirements.
6.How does Aetrix verify that CY7C1512V18-167BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1512V18-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-167BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1512V18-167BZXI?
All CY7C1512V18-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-167BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512V18-167BZXI part is unused and in its original packaging.
Return procedure for CY7C1512V18-167BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1512V18-167BZXI Tags

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STMicroelectronics
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STMicroelectronics

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