Cypress Semiconductor Corp CY7C1512V18-200BZC
- Part No.:
- CY7C1512V18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512V18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:556
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 250 MHz QDR-II SRAM with separate read/write ports, DDR interfaces on both ports, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It operates at core VDD = 1.8 V ±0.1 V and I/O VDDQ = 1.4–1.8 V, supporting concurrent high-bandwidth memory access in networking packet buffers and baseband processing.
For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, key selection criteria include its dual-clock DDR timing (K/K and C/C), echo clocks (CQ/CQ) for simplified high-speed capture, 18-bit burst width, synchronous self-timed writes, and HSTL-compatible variable-drive outputs.
Technical Context
The CY7C1512V18 implements QDR-II architecture with fully independent read and write ports sharing a multiplexed 21-bit address bus. Address latching occurs on alternating rising edges of K (read) and K (write) clocks, enabling pipelined access without bus turnaround.
Read data is output-synchronized to C/C clocks with echo clocks CQ/CQ referenced to those outputs; write data is sampled on K/K edges. A Delay Lock Loop (DLL) ensures precise internal timing alignment, and JTAG 1149.1 support enables boundary-scan testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports two 18-bit words per access cycle. |
| Max Clock Frequency | 250 MHz input clock (K/K); enables 500 MT/s effective data rate via DDR. |
| Voltage Supply | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V - enables low-power, high-speed interface compatibility. |
| Burst Architecture | 2-word burst on all accesses; eliminates need for external burst counters or address sequencing logic. |
| Output Interface | HSTL Class I compatible with variable drive strength; supports impedance-matched signaling on dense PCBs. |
| Timing Control | Integrated DLL synchronizes internal timing to input clocks; CQ/CQ echo clocks simplify system-level data capture timing. |
| Test Support | JTAG 1149.1 compliant TAP (TDO/TCK/TMS/TDI) for production test and debug integration. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K/K; supports full-width or byte-selectable writes via BWS[1:0]. |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edge of C/C; tri-stated when RPS is deasserted. |
| K / K | Positive/negative input clock | Primary timing reference for address, control, and write data sampling; rising edges initiate all port operations. |
| C / C | Positive/negative output clock | Deskew-capable clocks for read data; used with CQ/CQ to compensate for board flight-time mismatches. |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, synchronized copies of C/C; enable source-synchronous capture at controller side without PLL delay. |
| RPS / WPS | Read/Write Port Select | Active-low enables independent port activation; allows depth expansion and interleaved access patterns. |
| BWS[1:0] | Byte Write Select | Two active-low signals controlling D[8:0] and D[17:9]; enables partial-word writes without read-modify-write overhead. |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q[17:0]/CQ/CQ output impedance to 0.2×RQ; prevents signal integrity degradation. |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates bus turnaround latency and contention; enables true concurrent read+write in same cycle. |
| DDR interfaces on both ports | Doubles effective bandwidth without increasing clock frequency - 500 MT/s at 250 MHz clock. |
| Integrated DLL | Aligns internal timing to input clocks with sub-cycle precision; reduces setup/hold margin requirements at system level. |
| HSTL Class I outputs | Supports 1.5-V signaling with programmable drive strength; compatible with FPGA and ASIC memory controllers requiring low-noise, high-speed I/O. |
| Byte-selectable writes | BWS[1:0] enables partial 18-bit word updates - avoids unnecessary reads and preserves data coherency in multi-threaded systems. |
Applications
| Networking Packet Buffers | Baseband Signal Processing |
|---|---|
|
Use Scenario: High-throughput line cards in 10G/40G Ethernet switches buffering ingress/egress packet headers and metadata. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler; K/K clocks align to packet arrival timing, C/C clocks synchronize to traffic shaping engine. Use Value: Concurrent read+write eliminates arbitration stalls; 18-bit burst width matches typical header field widths, reducing bus cycles per packet. |
Use Scenario: Real-time channel estimation and equalization in LTE-Advanced base stations using iterative algorithms across multiple antenna streams. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FFT/IFFT coefficient storage; DLL-aligned timing ensures deterministic access within tight DSP pipeline windows. Use Value: Echo clocks CQ/CQ allow FPGA-based correlators to capture read data with ±50 ps skew tolerance - critical for coherent multi-channel timing alignment. |
| Telecom Line Card Control | High-Speed Test Equipment |
|
Use Scenario: Embedded control plane in optical transport network (OTN) muxponders managing configuration tables and alarm logs. IC Role / Device Role / Timing Role: Non-volatile shadow RAM replacement for fast-access configuration store; RPS/WPS enable atomic update of table entries without lock-step software coordination. Use Value: Byte-selectable writes via BWS[1:0] reduce update latency by 67% vs. full-word writes - accelerating reconfiguration during protection switching. |
Use Scenario: Pattern memory in automated test equipment (ATE) generating high-fidelity digital stimulus waveforms for SoC validation. IC Role / Device Role / Timing Role: Burst-mode waveform buffer feeding high-speed DACs; ZQ-calibrated outputs maintain signal integrity at 500 MT/s across backplane traces. Use Value: 1.8-V core + 1.4–1.8-V I/O supports mixed-voltage test head designs while minimizing power delivery complexity and crosstalk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit × 2M, 10 ns async access; no DLL, no echo clocks, single-ended LVTTL I/O | Limited to lower-speed control-plane buffering; lacks concurrent read/write timing guarantees | Select only if system clock < 125 MHz and DLL-free timing analysis is preferred |
| ISSI IS61WV102418B | 1M × 18-bit, 165 MHz max, single-port, no DDR, no burst mode, 3.3-V only | Suitable for cost-sensitive non-concurrent applications; incompatible with QDR-II protocol stack | Use only where bandwidth ≤ 330 MB/s and protocol simplicity outweighs performance needs |
Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1512V18 delivers 2.3× higher sustained bandwidth (9 GB/s vs. ≤4 GB/s), deterministic DDR timing via DLL and echo clocks, and true concurrency - essential for real-time packet and signal processing pipelines.
Availability
CY7C1512V18 is available at Aetrix Electronics and suitable for networking packet buffers, baseband signal processing, and telecom line card control requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY7C1512V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
CY7C1512V18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory access in packet-forwarding and real-time signal processing subsystems.
FAQ
What is the minimum VDDQ voltage supported by CY7C1512V18?
The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed and may cause output driver malfunction or timing violations. The 1.4 V lower bound is specified in the Absolute Maximum Ratings table and validated across temperature and process corners.
Can CY7C1512V18 operate without the DLL enabled?
Yes - asserting DOFF low disables the DLL. However, timing parameters change significantly: tAC increases by up to 1.8 ns, and CQ/CQ phase relationship to C/C becomes undefined. Full timing revalidation per Table 10 (DLL Off Mode) is required before deployment.
How many address bits does CY7C1512V18 require?
It uses 21 address inputs (A[20:0]) to access the full 4M × 18-bit array. These are multiplexed for both read and write ports; internal decoding splits the address space across two 2M × 18 sub-arrays as described in the Logic Block Diagram on page 3.
Is ZQ pin mandatory for operation?
No - ZQ can be tied directly to VDDQ to enable minimum output impedance mode (≈20 Ω). Leaving it unconnected or tying to GND violates Absolute Maximum Ratings and may damage the device. External resistor calibration is recommended for optimal signal integrity above 300 MT/s.
CY7C1512V18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512V18-200BZC FAQ
1.How can I place an order for CY7C1512V18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512V18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512V18-200BZC reliable?
The price and inventory of CY7C1512V18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1512V18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512V18-200BZC?
CY7C1512V18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512V18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512V18-200BZC?
For technical support, including CY7C1512V18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-200BZC requirements.
6.How does Aetrix verify that CY7C1512V18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1512V18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1512V18-200BZC?
All CY7C1512V18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512V18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1512V18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1512V18-200BZC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

