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Cypress Semiconductor Corp CY7C1512V18-250BZI

Part No.:
CY7C1512V18-250BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512V18-250BZI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:611

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Product details

Overview

CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 250 MHz QDR-II SRAM with separate read/write ports, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It operates at core VDD = 1.8 V ±0.1 V and I/O VDDQ = 1.4–1.8 V, supporting concurrent high-bandwidth memory access in network packet buffers and FPGA co-processor caches.

For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, this device is selected for systems requiring deterministic low-latency dual-port burst transfers, echo-clock–assisted timing closure at 500 MT/s, and synchronous self-timed writes without bus turnaround overhead.

Technical Context

The CY7C1512V18 implements QDR-II architecture with physically independent read and write data paths, eliminating bus contention and enabling true simultaneous access. Its 2-word burst transfers occur on every rising edge of K/K (write) and C/C (read) clocks, with address latching on alternating K edges to support 21-bit addressing for the 4M × 18 organization.

It integrates a Delay Lock Loop (DLL) for precise output data alignment, HSTL-class variable-drive output buffers, and JTAG 1149.1 test access. Echo clocks CQ/CQ are free-running and synchronized to C/C, enabling receiver-side deskew in multi-device memory subsystems without external delay compensation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4M × 18-bit (72 Mbit); supports 2M-depth × 36-bit expansion via port selects
Max Clock Frequency 250 MHz K/K input clock; enables 500 MT/s DDR throughput per port
Burst Length Fixed 2-word burst per access; delivers 36 bits per clock cycle on read/write ports
Supply Voltages VDD = 1.8 V ±0.1 V (core), VDDQ = 1.4–1.8 V (I/O); decoupling critical for HSTL signal integrity
Package 165-ball FBGA (15 × 17 × 1.4 mm); ball pitch 0.8 mm; RoHS-compliant Pb-free option available
Timing Architecture Synchronous pipelined with DLL; CQ/CQ echo clocks referenced to C/C for flight-time matching
Write Control Synchronous self-timed writes; WPS active-low sampled on K rising edge; BWS[1:0] byte-select enables partial 18-bit writes

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-270AC compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs 18-bit parallel data sampled on rising edge of K clock; ignored when WPS deasserted
Q[17:0] Synchronous read data outputs 18-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS deasserted
WPS Write port select Active-low control sampled on K rising edge; initiates write if asserted during valid address/data window
RPS Read port select Active-low control sampled on K rising edge; initiates read burst if asserted; output drivers tri-state on next C edge after deassertion
BWS[1:0] Byte write select Two active-low signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enable partial 18-bit writes without read-modify-write
K, K Positive/negative input clocks Used for address, control, and write-data capture; only rising edges are functional; K/K pair reduces skew sensitivity
C, C Positive/negative output clocks Drive Q[17:0] and CQ/CQ; used for deskewing read data across PCB traces in high-speed systems
CQ, CQ Echo clocks Free-running, DLL-synchronized copies of C/C; routed alongside Q[17:0] to simplify controller data capture timing
ZQ Output impedance calibration Connect to resistor-to-ground (RQ) to tune Q[17:0]/CQ/CQ drive strength to 0.2×RQ; direct VDDQ connection enables minimum impedance mode
DOFF DLL disable Active-low pin; grounding disables DLL, altering output timing-requires revalidation per Switching Characteristics table
TCK/TMS/TDI/TDO JTAG boundary-scan interface Fully compliant with IEEE 1149.1; enables production testing and in-system debug of memory interconnects

Key Features

Feature Design Value
Separate read/write ports Eliminates bus turnaround delay and arbitration logic; enables full-duplex 500 MT/s operation without contention
2-word DDR burst architecture Delivers 36 bits per clock cycle on each port-doubles bandwidth versus single-data-rate SRAMs at same clock frequency
Integrated DLL with echo clocks Enables sub-300 ps output data placement accuracy; CQ/CQ allow source-synchronous capture without board-level delay tuning
HSTL-compatible variable-drive outputs Adjustable drive strength via ZQ calibration ensures signal integrity on long, stubbed memory buses up to 500 MT/s
Synchronous self-timed writes On-chip write sequencing eliminates external write-enable timing constraints; guarantees atomic 2-word write completion

Applications

Network Packet Buffer FPGA Co-Processor Cache

Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet headers and metadata in switch ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero-turnaround latency between parser and scheduler engines.

Use Value: 250 MHz clock + 2-word burst delivers 9 Gbps sustained bandwidth per port-sufficient for 10G wire-rate header storage with margin.

Use Scenario: High-speed scratchpad memory between Xilinx Ultrascale+ FPGA fabric and embedded soft-core processors.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access buffer for instruction/data exchange with no arbitration stalls.

Use Value: Separate R/W ports and echo clocks enable FPGA I/O timing closure at 500 MT/s without custom PCB length matching.

Telecom Baseband Processing High-Frequency Trading Engine

Use Scenario: Real-time FFT coefficient storage and ping-pong buffering in LTE/5G massive MIMO baseband units.

IC Role / Device Role / Timing Role: Synchronous pipelined memory interfacing directly with TI C66x DSPs via EMIF with DDR timing.

Use Value: 1.8 V core + 1.4 V I/O reduces dynamic power by 35% vs. 2.5 V QDR-I parts while maintaining 250 MHz operation.

Use Scenario: Ultra-low-latency order book update cache in FPGA-accelerated trading platforms.

IC Role / Device Role / Timing Role: Deterministic-access memory for market data ingestion and order execution pipelines.

Use Value: DLL-aligned CQ/CQ clocks reduce setup/hold uncertainty to <120 ps-critical for sub-100 ns round-trip latency targets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit × 2M QDR-II+, 100 MHz max; uses differential LVDS I/O, not HSTL; no ZQ calibration Lower bandwidth (3.6 Gbps vs. 9 Gbps); suited for cost-sensitive telecom control planes, not line-rate data paths Select when system uses LVDS signaling and requires lower power at reduced throughput; verify DLL-free timing margins
ISSI IS61WV102418B Asynchronous 1M × 18 SRAM; 15 ns access time; single-port; 3.3 V only; no DDR or echo clocks No concurrent R/W; no burst; no timing deskew capability-requires external arbitration and wider data bus for equivalent bandwidth Only viable for non-real-time buffering where latency >50 ns is acceptable and FPGA resources limit DDR controller complexity

Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1512V18 uniquely delivers 9 Gbps dual-port bandwidth with echo-clock–assisted timing closure at 250 MHz, making it irreplaceable in line-rate packet processing and FPGA co-processor cache roles where deterministic sub-200 ps timing is mandatory.

Availability

CY7C1512V18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1512V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1512V18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in packet-switched infrastructure and FPGA-based acceleration platforms.

FAQ

What is the maximum sustained data throughput per port?

The CY7C1512V18 achieves 500 MT/s effective throughput per port using DDR signaling: 250 MHz clock × 2 transfers/cycle × 18 bits = 9 Gbps per port. This is sustained across all 4M addresses with no wait states, confirmed by the 250 MHz maximum operating frequency specification and 2-word burst architecture.

How does the ZQ pin affect signal integrity?

ZQ connects to an external resistor to ground (RQ) to calibrate output driver impedance to 0.2×RQ for Q[17:0], CQ, and CQ pins. This matches typical 50 Ω transmission lines, reducing reflections and jitter. Direct connection to VDDQ sets minimum impedance (~25 Ω), useful for short, heavily loaded nets.

Can CY7C1512V18 operate without the DLL enabled?

Yes-asserting DOFF (low) disables the DLL, but output timing parameters change significantly: tAC increases by ~1.2 ns and tQH tightens by ~0.3 ns. The device remains functional, but system-level timing closure must be revalidated using the "DLL Off" switching characteristics table in Rev. *F datasheet page 23.

What is the role of BWS[1:0] in partial writes?

BWS[1:0] are active-low byte write selects: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted, its corresponding 9-bit segment is ignored during write cycles, preserving existing data in those bits-enabling efficient 9-bit or 18-bit updates without read-modify-write overhead.

CY7C1512V18-250BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1512V18-250BZI FAQ

1.How can I place an order for CY7C1512V18-250BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512V18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512V18-250BZI reliable?

The price and inventory of CY7C1512V18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-250BZI is usually 5 days.

3.What payment methods are accepted for CY7C1512V18-250BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-250BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512V18-250BZI?

CY7C1512V18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512V18-250BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512V18-250BZI?

For technical support, including CY7C1512V18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-250BZI requirements.

6.How does Aetrix verify that CY7C1512V18-250BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1512V18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-250BZI meets industry standards.

7.What is the process for return or replacement of CY7C1512V18-250BZI?

All CY7C1512V18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-250BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512V18-250BZI part is unused and in its original packaging.

Return procedure for CY7C1512V18-250BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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