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Cypress Semiconductor Corp CY7C1512V18-250BZXI

Part No.:
CY7C1512V18-250BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512V18-250BZXI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:346

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Product details

Overview

CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 250 MHz clock operation, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent read/write transactions for high-throughput packet buffering in network line cards.

For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, key selection criteria include its dual-clock DDR timing architecture, HSTL I/O compatibility, DLL-controlled data placement, 18-bit burst width, and support for depth expansion via BWS[1:0] and RPS/WPS controls.

Technical Context

The CY7C1512V18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated K/K input clocks and C/C output clocks. Its 2-word burst transfers 36 bits per access cycle - two sequential 18-bit words - eliminating bus turnaround overhead.

It uses a Delay Lock Loop (DLL) to align echo clocks (CQ/CQ) with output clocks (C/C), enabling precise data capture at 500 MT/s. Address inputs (A[20:0]) are multiplexed for both ports, latched on alternating rising edges of K/K, supporting 2M × 18 internal organization across two 1M × 18 arrays.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 configuration)
Maximum Clock Frequency 250 MHz - enables 500 MT/s DDR data transfer on both read and write ports
Core Supply Voltage VDD = 1.8 V ±0.1 V - defines low-power, high-speed SRAM core operation
I/O Supply Voltage VDDQ = 1.4 V to 1.8 V - supports HSTL-compatible signaling with adjustable drive strength
Burst Length 2-word burst - delivers 36 bits per access cycle without latency penalty
Package 165-ball FBGA (15 × 17 × 1.4 mm) - provides high pin count and thermal performance for dense PCB layouts
Input/Output Interface HSTL Class I - ensures signal integrity at 500 MT/s with controlled impedance matching via ZQ pin

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock during active WPS assertion
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS inactive
RPS Read port select Active-low control latched on K rising edge; initiates read burst and enables Q[17:0] drivers
WPS Write port select Active-low control latched on K rising edge; enables D[17:0] sampling and write execution
BWS[1:0] Byte write select Two active-low signals controlling which 9-bit byte (D[8:0] or D[17:9]) is written per burst
K, K Positive/negative input clocks Used for address/data/control latching; only rising edges are functional for synchronization
C, C Positive/negative output clocks Drive Q[17:0] and CQ/CQ; enable deskewed data capture across multiple devices
CQ, CQ Echo clocks Free-running outputs synchronized to C/C; simplify timing closure in high-speed receivers
ZQ Impedance calibration input Connects to external resistor to ground to tune Q[17:0]/CQ/CQ output impedance to 0.2 × RQ
DOFF DLL disable Active-low pin; grounding disables DLL, altering output timing - use only if DLL-free operation required

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent access - no bus turnaround, no arbitration delay, full bandwidth utilization
250 MHz DDR interface Delivers 9 Gbps aggregate bandwidth (500 MT/s × 18 bits) with deterministic timing
Delay Lock Loop (DLL) Aligns CQ/CQ echo clocks to C/C with sub-cycle accuracy, reducing setup/hold margin requirements
HSTL Class I I/O Supports 1.4–1.8 V VDDQ with programmable drive strength and ZQ-based impedance tuning
JTAG 1149.1 test port Enables boundary-scan testing and in-system debug without additional test pads or probes

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches and routers.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-in-first-out (FIFO) buffer between ingress and egress traffic engines.

Use Value: Concurrent 500 MT/s reads and writes eliminate contention, enabling wire-speed throughput at 10 Gbps+ line rates.

Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) with real-time analysis.

IC Role / Device Role / Timing Role: High-bandwidth memory staging buffer between ADC front-end and DSP processing unit.

Use Value: 2-word burst and echo clocks ensure precise timestamp alignment and jitter-free data capture at 500 MS/s.

Telecom Baseband Processing Avionics Data Acquisition

Use Scenario: Interfacing between FPGA-based channelizers and digital up/down-converters in 4G/5G base stations.

IC Role / Device Role / Timing Role: Synchronous pipeline memory synchronizing multi-lane JESD204B data streams with local processing clocks.

Use Value: Independent K/K and C/C clock domains isolate RF subsystem timing from baseband logic, reducing EMI coupling.

Use Scenario: Real-time sensor fusion in flight control systems requiring deterministic latency for inertial measurement units (IMUs).

IC Role / Device Role / Timing Role: Deterministic-latency memory buffer between radiation-hardened ADCs and safety-critical microcontrollers.

Use Value: DLL-controlled CQ/CQ outputs guarantee sub-nanosecond data valid window, meeting DO-254 timing certification requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C3256A-25JCIN Asynchronous 32K × 8 SRAM, 25 ns access, single-port, 5V supply Lacks DDR, burst, or dual-port capability; suitable only for low-speed control-plane buffers Select only if system clock < 50 MHz and concurrent access not required
IS61WV102418BLL-10BLI Synchronous 1M × 18 SRAM, 10 ns cycle time, single-clock, 3.3V core/I/O No echo clocks, no DLL, no BWS support; limited to 100 MHz effective bandwidth Choose for cost-sensitive designs where 500 MT/s bandwidth and timing precision are unnecessary

Compared with AS7C3256A-25JCIN and IS61WV102418BLL-10BLI, the CY7C1512V18 uniquely delivers concurrent 500 MT/s read/write throughput, DLL-aligned echo clocks for timing closure, and HSTL I/O for signal integrity - making it irreplaceable in high-speed packet-forwarding and real-time instrumentation.

Availability

CY7C1512V18 is available at Aetrix Electronics and suitable for network infrastructure, test & measurement equipment, and telecom baseband subsystems requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1512V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

The QDR-II SRAM product line targets high-bandwidth, low-latency buffering in networking, wireless infrastructure, and instrumentation - emphasizing deterministic timing, concurrent access, and signal integrity at multi-Gbps rates.

FAQ

What is the function of the ZQ pin on CY7C1512V18?

The ZQ pin calibrates output driver impedance for Q[17:0], CQ, and CQ signals. It must be connected to a precision resistor (typically 100 Ω) to ground to set output impedance to 20 Ω (0.2 × RQ). Direct connection to VDDQ enables minimum-impedance mode; floating or grounding ZQ is prohibited and will cause undefined I/O behavior.

Can CY7C1512V18 operate with only one clock domain?

Yes - the device supports single-clock mode where K/K serve as both input and output clocks. In this mode, C/C are unused, and Q[17:0] data is driven on rising edges of K/K. However, echo clocks (CQ/CQ) remain tied to K/K, and DLL functionality remains active unless disabled via DOFF.

How does BWS[1:0] control write operations in CY7C1512V18?

BWS[1:0] are active-low byte write selects: BWS0 enables writing to D[8:0], and BWS1 enables writing to D[17:9]. When both are asserted, the full 18-bit word is written; when only one is active, only its corresponding 9-bit byte updates. Unselected bytes retain prior values - enabling partial-word writes without read-modify-write cycles.

Is CY7C1512V18 pin-compatible with other QDR-II family members?

No - while all QDR-II SRAMs share the same 165-ball FBGA footprint, pin assignments differ significantly across configurations (e.g., CY7C1510V18 x8 vs. CY7C1512V18 x18). Address, data, and control pin counts vary, and BWS/NWS signal mapping is configuration-specific. Board-level reuse requires redesign of routing and termination.

CY7C1512V18-250BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1512V18-250BZXI FAQ

1.How can I place an order for CY7C1512V18-250BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512V18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512V18-250BZXI reliable?

The price and inventory of CY7C1512V18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-250BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1512V18-250BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-250BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512V18-250BZXI?

CY7C1512V18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512V18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512V18-250BZXI?

For technical support, including CY7C1512V18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-250BZXI requirements.

6.How does Aetrix verify that CY7C1512V18-250BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1512V18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-250BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1512V18-250BZXI?

All CY7C1512V18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-250BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512V18-250BZXI part is unused and in its original packaging.

Return procedure for CY7C1512V18-250BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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