Cypress Semiconductor Corp CY7C1512V18-250BZXI
- Part No.:
- CY7C1512V18-250BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512V18-250BZXI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:346
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Product details
Overview
CY7C1512V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 250 MHz clock operation, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent read/write transactions for high-throughput packet buffering in network line cards.
For engineers reviewing the CY7C1512V18 datasheet, CY7C1512V18 pinout, CY7C1512V18 application, or CY7C1512V18 equivalent, key selection criteria include its dual-clock DDR timing architecture, HSTL I/O compatibility, DLL-controlled data placement, 18-bit burst width, and support for depth expansion via BWS[1:0] and RPS/WPS controls.
Technical Context
The CY7C1512V18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated K/K input clocks and C/C output clocks. Its 2-word burst transfers 36 bits per access cycle - two sequential 18-bit words - eliminating bus turnaround overhead.
It uses a Delay Lock Loop (DLL) to align echo clocks (CQ/CQ) with output clocks (C/C), enabling precise data capture at 500 MT/s. Address inputs (A[20:0]) are multiplexed for both ports, latched on alternating rising edges of K/K, supporting 2M × 18 internal organization across two 1M × 18 arrays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 configuration) |
| Maximum Clock Frequency | 250 MHz - enables 500 MT/s DDR data transfer on both read and write ports |
| Core Supply Voltage | VDD = 1.8 V ±0.1 V - defines low-power, high-speed SRAM core operation |
| I/O Supply Voltage | VDDQ = 1.4 V to 1.8 V - supports HSTL-compatible signaling with adjustable drive strength |
| Burst Length | 2-word burst - delivers 36 bits per access cycle without latency penalty |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - provides high pin count and thermal performance for dense PCB layouts |
| Input/Output Interface | HSTL Class I - ensures signal integrity at 500 MT/s with controlled impedance matching via ZQ pin |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock during active WPS assertion |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS inactive |
| RPS | Read port select | Active-low control latched on K rising edge; initiates read burst and enables Q[17:0] drivers |
| WPS | Write port select | Active-low control latched on K rising edge; enables D[17:0] sampling and write execution |
| BWS[1:0] | Byte write select | Two active-low signals controlling which 9-bit byte (D[8:0] or D[17:9]) is written per burst |
| K, K | Positive/negative input clocks | Used for address/data/control latching; only rising edges are functional for synchronization |
| C, C | Positive/negative output clocks | Drive Q[17:0] and CQ/CQ; enable deskewed data capture across multiple devices |
| CQ, CQ | Echo clocks | Free-running outputs synchronized to C/C; simplify timing closure in high-speed receivers |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q[17:0]/CQ/CQ output impedance to 0.2 × RQ |
| DOFF | DLL disable | Active-low pin; grounding disables DLL, altering output timing - use only if DLL-free operation required |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent access - no bus turnaround, no arbitration delay, full bandwidth utilization |
| 250 MHz DDR interface | Delivers 9 Gbps aggregate bandwidth (500 MT/s × 18 bits) with deterministic timing |
| Delay Lock Loop (DLL) | Aligns CQ/CQ echo clocks to C/C with sub-cycle accuracy, reducing setup/hold margin requirements |
| HSTL Class I I/O | Supports 1.4–1.8 V VDDQ with programmable drive strength and ZQ-based impedance tuning |
| JTAG 1149.1 test port | Enables boundary-scan testing and in-system debug without additional test pads or probes |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches and routers. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-in-first-out (FIFO) buffer between ingress and egress traffic engines. Use Value: Concurrent 500 MT/s reads and writes eliminate contention, enabling wire-speed throughput at 10 Gbps+ line rates. |
Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) with real-time analysis. IC Role / Device Role / Timing Role: High-bandwidth memory staging buffer between ADC front-end and DSP processing unit. Use Value: 2-word burst and echo clocks ensure precise timestamp alignment and jitter-free data capture at 500 MS/s. |
| Telecom Baseband Processing | Avionics Data Acquisition |
|
Use Scenario: Interfacing between FPGA-based channelizers and digital up/down-converters in 4G/5G base stations. IC Role / Device Role / Timing Role: Synchronous pipeline memory synchronizing multi-lane JESD204B data streams with local processing clocks. Use Value: Independent K/K and C/C clock domains isolate RF subsystem timing from baseband logic, reducing EMI coupling. |
Use Scenario: Real-time sensor fusion in flight control systems requiring deterministic latency for inertial measurement units (IMUs). IC Role / Device Role / Timing Role: Deterministic-latency memory buffer between radiation-hardened ADCs and safety-critical microcontrollers. Use Value: DLL-controlled CQ/CQ outputs guarantee sub-nanosecond data valid window, meeting DO-254 timing certification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-25JCIN | Asynchronous 32K × 8 SRAM, 25 ns access, single-port, 5V supply | Lacks DDR, burst, or dual-port capability; suitable only for low-speed control-plane buffers | Select only if system clock < 50 MHz and concurrent access not required |
| IS61WV102418BLL-10BLI | Synchronous 1M × 18 SRAM, 10 ns cycle time, single-clock, 3.3V core/I/O | No echo clocks, no DLL, no BWS support; limited to 100 MHz effective bandwidth | Choose for cost-sensitive designs where 500 MT/s bandwidth and timing precision are unnecessary |
Compared with AS7C3256A-25JCIN and IS61WV102418BLL-10BLI, the CY7C1512V18 uniquely delivers concurrent 500 MT/s read/write throughput, DLL-aligned echo clocks for timing closure, and HSTL I/O for signal integrity - making it irreplaceable in high-speed packet-forwarding and real-time instrumentation.
Availability
CY7C1512V18 is available at Aetrix Electronics and suitable for network infrastructure, test & measurement equipment, and telecom baseband subsystems requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1512V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
The QDR-II SRAM product line targets high-bandwidth, low-latency buffering in networking, wireless infrastructure, and instrumentation - emphasizing deterministic timing, concurrent access, and signal integrity at multi-Gbps rates.
FAQ
What is the function of the ZQ pin on CY7C1512V18?
The ZQ pin calibrates output driver impedance for Q[17:0], CQ, and CQ signals. It must be connected to a precision resistor (typically 100 Ω) to ground to set output impedance to 20 Ω (0.2 × RQ). Direct connection to VDDQ enables minimum-impedance mode; floating or grounding ZQ is prohibited and will cause undefined I/O behavior.
Can CY7C1512V18 operate with only one clock domain?
Yes - the device supports single-clock mode where K/K serve as both input and output clocks. In this mode, C/C are unused, and Q[17:0] data is driven on rising edges of K/K. However, echo clocks (CQ/CQ) remain tied to K/K, and DLL functionality remains active unless disabled via DOFF.
How does BWS[1:0] control write operations in CY7C1512V18?
BWS[1:0] are active-low byte write selects: BWS0 enables writing to D[8:0], and BWS1 enables writing to D[17:9]. When both are asserted, the full 18-bit word is written; when only one is active, only its corresponding 9-bit byte updates. Unselected bytes retain prior values - enabling partial-word writes without read-modify-write cycles.
Is CY7C1512V18 pin-compatible with other QDR-II family members?
No - while all QDR-II SRAMs share the same 165-ball FBGA footprint, pin assignments differ significantly across configurations (e.g., CY7C1510V18 x8 vs. CY7C1512V18 x18). Address, data, and control pin counts vary, and BWS/NWS signal mapping is configuration-specific. Board-level reuse requires redesign of routing and termination.
CY7C1512V18-250BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512V18-250BZXI FAQ
1.How can I place an order for CY7C1512V18-250BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512V18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512V18-250BZXI reliable?
The price and inventory of CY7C1512V18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512V18-250BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1512V18-250BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512V18-250BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512V18-250BZXI?
CY7C1512V18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512V18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512V18-250BZXI?
For technical support, including CY7C1512V18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512V18-250BZXI requirements.
6.How does Aetrix verify that CY7C1512V18-250BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1512V18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512V18-250BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1512V18-250BZXI?
All CY7C1512V18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512V18-250BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512V18-250BZXI part is unused and in its original packaging.
Return procedure for CY7C1512V18-250BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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