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Cypress Semiconductor Corp CY7C1513AV18-167BZC

Part No.:
CY7C1513AV18-167BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513AV18-167BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,755

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Product details

Overview

CY7C1513AV18-167BZC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 167 MHz maximum operating frequency, 1.5-cycle read latency (DLL enabled), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent high-bandwidth data access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1513AV18-167BZC datasheet, CY7C1513AV18-167BZC pinout, CY7C1513AV18-167BZC application, or CY7C1513AV18-167BZC equivalent, key selection criteria include DDR read/write timing at 167 MHz, 18-bit data width support, DLL-enabled latency mode, and HSTL-compatible I/O voltage (VDDQ = 1.4–1.8 V).

Technical Context

The device implements QDR-II architecture with fully independent synchronous read and write ports sharing a multiplexed address bus. Address latching occurs on alternating rising edges of K/K clocks, enabling 4-word burst transfers per access without bus turnaround.

It uses dual clock domains: K/K for input synchronization and C/C for output timing, with echo clocks CQ/CQ referenced to C/C to compensate for flight-time skew. The Delay Lock Loop (DLL) enables precise 1.5-cycle read latency; disabling DLL via DOFF reduces latency to 1 cycle but limits max frequency to 167 MHz in QDR-I mode.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4M × 18-bit (72 Mbit); supports 1M-depth × 18-bit burst-aligned data storage
Max Clock Frequency 167 MHz (K/K and C/C); defines system bandwidth ceiling in DLL-off QDR-I mode
Read Latency 1.5 cycles (DLL enabled) or 1 cycle (DLL disabled); directly impacts pipeline depth in packet-forwarding engines
VDD / VDDQ Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; enables HSTL Class I compatibility and low-power operation
Burst Length 4-word fixed burst; reduces address bus toggling by 75% vs. single-word access, lowering EMI and controller overhead
Package 165-ball FBGA (15 × 17 × 1.4 mm); RoHS-compliant footprint compatible with high-density PCB routing
JTAG Support IEEE 1149.1 compliant TAP (TCK/TMS/TDI/TDO); enables boundary-scan testing and production diagnostics

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free and non-Pb-free options available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Latched on rising edge of K/K; supports full 18-bit parallel writes per burst
Q[17:0] Synchronous read data outputs Driven on rising edge of C/C; provides 18-bit burst-read data with echo-clock alignment
WPS, RPS Active-low port select controls Enable independent read/write port activation; critical for depth expansion and interleaved access
BWS[1:0] Byte write select (active low) Selects which 9-bit half-word (D[8:0] or D[17:9]) is written; preserves unselected bytes during partial writes
K, K, C, C Differential clock inputs K/K drive internal logic and write path; C/C clock read outputs and enable deskew via CQ/CQ echo clocks
CQ, CQ Output echo clocks Free-running, phase-aligned copies of C/C; simplify high-speed data capture at controller by matching flight time
ZQ Impedance calibration reference Connects to external resistor to ground to tune Q[17:0] and CQ/CQ output impedance to 0.2 × RQ
DOFF DLL disable control Pull low to disable DLL and operate in QDR-I mode (1-cycle latency, ≤167 MHz)

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent read and write operations without bus contention or turnaround delay
4-word burst architecture Reduces required address transitions by 75%, minimizing controller logic complexity and board-level signal count
Double Data Rate (DDR) interfaces Delivers effective 334 MT/s data rate per port at 167 MHz clock, doubling throughput vs. SDR
Delay Lock Loop (DLL) Ensures sub-cycle timing accuracy for read data placement; enables 1.5-cycle latency at full speed
HSTL Class I compatible I/O Supports 1.4–1.8 V VDDQ with programmable drive strength; matches FPGA/ASIC memory controllers without level shifters
JTAG 1149.1 test access Provides standardized boundary-scan capability for automated optical inspection and functional test in volume manufacturing

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO buffer; reads packet headers while writing payload fragments concurrently.

Use Value: 167 MHz QDR-II operation sustains ≥6 Gbps aggregate bandwidth across 18-bit bus, meeting 10G Ethernet line-rate requirements.

Use Scenario: Capturing high-resolution waveform samples from multi-GHz ADCs in automated test systems.

IC Role / Device Role / Timing Role: High-throughput memory buffer interfacing with FPGA-based acquisition logic; decouples sampling clock from analysis clock domain.

Use Value: 4-word burst + DDR read/write eliminates bus turnaround delays, enabling continuous streaming at >300 MB/s sustained transfer rate.

Telecom Line Card Control Plane Real-Time Video Frame Buffering

Use Scenario: Storing configuration tables, routing entries, and status registers in carrier-grade optical transport equipment.

IC Role / Device Role / Timing Role: Dedicated SRAM for control-plane microcontroller co-processor; accessed asynchronously by multiple masters via port selects.

Use Value: Independent WPS/RPS signals allow simultaneous CPU read of status and DSP write of updated LUT entries without arbitration overhead.

Use Scenario: Holding uncompressed 1080p60 YUV422 frames in broadcast video processing pipelines.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced to video encoder/decoder ASICs; reads display lines while writing incoming sensor frames.

Use Value: 18-bit bus width aligns with standard video data paths; DLL-enabled 1.5-cycle latency ensures deterministic frame sync timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1513AV18-200BZC Higher max frequency (200 MHz), same 4M×18 density and FBGA package; requires tighter timing closure Supports 200 MHz system clocks; suitable where bandwidth >7.2 Gbps is required Select when design targets >167 MHz operation and controller supports faster setup/hold margins
AS7C35128PFS-167BIN 4M×18 QDR-II SRAM from Alliance Memory; pin-compatible FBGA, identical timing specs, lower cost No functional difference; validated drop-in replacement with same DLL behavior and HSTL I/O Choose for cost-sensitive industrial designs requiring second-source availability and long-term supply assurance

Compared with CY7C1513AV18-200BZC, this part trades peak bandwidth for relaxed timing margins; compared with AS7C35128PFS-167BIN, it offers Cypress's legacy design support and known qualification history in telecom infrastructure.

Availability

CY7C1513AV18-167BZC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom line card control plane, and real-time video frame buffering requiring stable component supply and long-lifecycle support.

Supply support for CY7C1513AV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.

This device belongs to Cypress's QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, test, and video infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1513AV18-167BZC?

The DOFF pin disables the internal Delay Lock Loop when pulled low. In this state, the device operates in QDR-I mode with 1-cycle read latency and a maximum frequency of 167 MHz. This simplifies timing closure in cost-sensitive or lower-bandwidth designs while retaining pin and functional compatibility.

How does the ZQ pin affect output drive strength?

The ZQ pin connects to an external resistor to ground to calibrate the output impedance of Q[17:0] and echo clocks CQ/CQ. With RQ = 50 Ω, outputs are tuned to 10 Ω (0.2 × RQ); connecting ZQ directly to VDDQ enables minimum impedance mode (~7 Ω). Leaving ZQ floating or grounded violates specification and risks signal integrity failure.

Can CY7C1513AV18-167BZC be used with a single-ended clock source?

No - the device requires differential K/K and C/C clock pairs for proper operation. Single-ended driving violates AC timing specifications and causes metastability in input registers. External clock buffers (e.g., LVDS or HSTL differential drivers) must be used to generate complementary clock signals from a master oscillator.

What is the purpose of BWS[1:0] in a 4M×18 configuration?

BWS[1:0] are active-low byte write select signals that control which 9-bit half-word (D[8:0] or D[17:9]) is written during a burst. When BWS0 = LOW and BWS1 = HIGH, only the lower 9 bits are updated; both HIGH disables all writes. This enables partial-word updates without read-modify-write cycles.

CY7C1513AV18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1513AV18-167BZC FAQ

1.How can I place an order for CY7C1513AV18-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513AV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513AV18-167BZC reliable?

The price and inventory of CY7C1513AV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513AV18-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1513AV18-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513AV18-167BZC transactions.

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CY7C1513AV18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513AV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513AV18-167BZC?

For technical support, including CY7C1513AV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513AV18-167BZC requirements.

6.How does Aetrix verify that CY7C1513AV18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1513AV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513AV18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1513AV18-167BZC?

All CY7C1513AV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513AV18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513AV18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1513AV18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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