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Cypress Semiconductor Corp CY7C1513AV18-250BZC

Part No.:
CY7C1513AV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513AV18-250BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,663

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Product details

Overview

CY7C1513AV18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 300 MHz clock support, DDR interfaces on both ports (600 Mbps effective data rate), and 165-ball FBGA package. It delivers concurrent read/write operations for high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C1513AV18 datasheet, CY7C1513AV18 pinout, CY7C1513AV18 application, or CY7C1513AV18 equivalent, key selection criteria include burst depth (4-word), DLL-enabled 1.5-cycle read latency, HSTL-18 I/O compatibility, and dual-clock timing control (K/K and C/C) for skew management in multi-device memory subsystems.

Technical Context

The CY7C1513AV18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated input clocks (K/K for address/control, C/C for output timing). Its 4-word burst transfers 72-bit words per access, reducing address bus toggling frequency by 75% versus single-word devices.

Internal Delay Lock Loop (DLL) aligns echo clocks (CQ/CQ) to output clocks (C/C) for precise data capture at 600 MHz; when disabled via DOFF pin, it reverts to QDR-I mode with 1-cycle latency and max 167 MHz operation. Address inputs (A[19:0]) are multiplexed for both ports, latched on alternating K-clock edges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4M × 18-bit = 72 Mbit - supports full-line-rate buffering for 10 GbE packet processing with minimal device count.
Max Clock Frequency 250 MHz - enables sustained 500 MT/s throughput per port (1 Gb/s aggregate bandwidth).
Read Latency 1.5 cycles (DLL enabled) - ensures deterministic timing for pipeline-synchronized systems like SerDes framers.
I/O Voltage VDDQ = 1.4 V to 1.8 V - compatible with HSTL-18 Class I/II drivers for low-noise, high-speed signaling.
Burst Length 4-word - reduces address bus activity and controller overhead while maintaining sequential data coherence.
Core Supply VDD = 1.8 V ±0.1 V - matches modern ASIC/FPGA core rails, minimizing level-shifting complexity.
Package 165-ball FBGA (15 × 17 × 1.4 mm) - provides thermal and signal integrity advantages over TSOP for >200 MHz operation.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Latched on rising edge of K clock; supports full 18-bit parallel writes without turnaround delay.
Q[17:0] Synchronous read data outputs Driven on rising edges of C/C clocks; echo clocks CQ/CQ enable source-synchronous capture at 600 MHz.
A[19:0] Multiplexed address inputs Shared by read/write ports; 20 bits address 4M locations, reducing pin count vs. non-multiplexed designs.
RPS / WPS Active-low port select controls Enable independent read/write arbitration; allows depth expansion using multiple devices with staggered selects.
BWS[1:0] Byte write select (active low) Selects which 9-bit byte (D[8:0] or D[17:9]) is written; preserves unselected bytes during partial writes.
K / K, C / C Differential clock inputs K/K drive internal logic and write path; C/C clock read outputs and enable deskew across memory banks.
CQ / CQ Output echo clocks Free-running, phase-aligned copies of C/C; simplify FPGA/ASIC capture logic by eliminating board trace matching.
ZQ Impedance calibration reference Connects to external resistor to ground to calibrate output driver impedance to 0.2 × RQ for signal integrity.

Key Features

Feature Design Value
Separate read/write data paths Eliminates bus turnaround overhead - enables true concurrent access for full-duplex traffic shaping in telecom line cards.
Variable-drive HSTL-18 outputs Configurable drive strength via ZQ calibration - maintains signal integrity across varying PCB trace lengths and loads.
JTAG 1149.1 test access port Enables boundary-scan testing of memory interconnects without requiring functional test patterns or system boot.
DLL-controlled timing alignment Compensates for process/voltage/temperature drift - guarantees setup/hold margins at 250 MHz across industrial temperature range.
Single-clock mode fallback Supports K-only operation (C/C tied to K/K) - simplifies bring-up and debugging when echo clock routing is constrained.

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with zero-latency read-after-write requirements.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress and egress ASIC pipelines, synchronized via K/C clocks.

Use Value: 4-word burst and concurrent ports eliminate arbitration stalls, enabling wire-speed 10GbE switching with <10 ns read-to-write turnaround.

Use Scenario: Capturing high-fidelity digital waveforms at 500+ MS/s in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: High-bandwidth acquisition memory interfacing directly to FPGA-based sequencers using source-synchronous CQ-clocked reads.

Use Value: DLL-aligned CQ/CQ echo clocks ensure ±5 ps jitter margin at 600 MHz, meeting IEEE 1149.4 AC test accuracy requirements.

Baseband Signal Processing Industrial Real-Time Control Buffer

Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE/5G baseband processors.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory co-located with DSP cores, operating in QDR-II mode with 1.5-cycle latency.

Use Value: 250 MHz operation sustains 9 Gb/s aggregate bandwidth needed for 4×4 MIMO symbol buffering without pipeline bubbles.

Use Scenario: Synchronizing motion control commands between PLC CPU and servo drive interface in CNC machines with <1 µs jitter tolerance.

IC Role / Device Role / Timing Role: Deterministic dual-port buffer isolating real-time I/O processing from non-real-time diagnostics tasks.

Use Value: Independent RPS/WPS enables lock-free producer-consumer handoff, guaranteeing sub-200 ns worst-case access time under full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102418B 1M × 18-bit QDR-I, 167 MHz max, no DLL, single-cycle latency Limited to lower bandwidth (<334 MT/s); lacks echo clocks and burst optimization for >200 MHz systems Choose for cost-sensitive, lower-speed control-plane buffers where DLL and 4-word burst are unnecessary.
Microchip 72T36125 2M × 36-bit QDR-II, 250 MHz, same architecture but wider data bus Higher density per device but requires 36-bit bus routing; less optimal for 18-bit aligned ASIC interfaces Prefer when system data path is 32–36 bit and board layout supports wider trace routing without signal integrity penalty.

Compared with IS61WV102418B and 72T36125, the CY7C1513AV18 uniquely balances 72-Mbit density, 18-bit bus alignment, and DLL-enhanced timing margin - making it optimal for 10GbE switch fabric buffers where pin count, latency determinism, and board-level skew control are jointly critical.

Availability

CY7C1513AV18 is available at Aetrix Electronics and suitable for network infrastructure, high-speed test instrumentation, baseband processing, and industrial real-time control applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1513AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, emphasizing signal integrity and timing precision.

The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in packet-switched networks and real-time signal processing, where deterministic dual-port access and source-synchronous timing are mandatory.

FAQ

What is the minimum supported clock frequency for CY7C1513AV18?

The CY7C1513AV18 has no specified minimum clock frequency; it operates down to DC for static timing analysis. Functional operation requires stable K and C clocks with valid setup/hold times per the datasheet's AC characteristics table. At very low frequencies (<10 MHz), DLL lock time becomes negligible, and DOFF can be asserted to bypass DLL if deterministic latency is not required.

Can CY7C1513AV18 operate with only K and C clocks (no K or C)?

Yes - the device supports single-clock domain operation where K is tied to K and C is tied to C. In this mode, all inputs are sampled on K, and outputs are driven on C. The DLL remains functional, and echo clocks CQ/CQ track C. This configuration simplifies PCB layout but forfeits differential clock skew cancellation benefits.

How does ZQ pin calibration affect signal integrity?

ZQ calibration adjusts output driver impedance to match the system data bus (typically 50 Ω), reducing reflections and improving eye diagram margins. With a 240 Ω resistor to ground, outputs are tuned to 48 Ω (0.2 × 240 Ω). Incorrect ZQ termination causes overshoot/undershoot and increases bit error rates above 400 Mbps; leaving ZQ floating or grounded violates specification and disables calibration.

Is JTAG accessible during normal memory operation?

Yes - the JTAG TAP controller operates independently of memory read/write functions. Boundary-scan testing can be performed while the device is idle or even during active memory access, provided TMS/TCK/TDI signals meet setup/hold timing relative to TCK. TDO is three-stated only when TMS is held high for five consecutive TCK cycles (exit from Test-Logic-Reset).

CY7C1513AV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1513AV18-250BZC FAQ

1.How can I place an order for CY7C1513AV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513AV18-250BZC reliable?

The price and inventory of CY7C1513AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513AV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1513AV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513AV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1513AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513AV18-250BZC?

For technical support, including CY7C1513AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513AV18-250BZC requirements.

6.How does Aetrix verify that CY7C1513AV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1513AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513AV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1513AV18-250BZC?

All CY7C1513AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513AV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513AV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1513AV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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