Cypress Semiconductor Corp CY7C1513JV18-300BZXC

Overview

CY7C1513JV18-300BZXC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 300 MHz clock operation, DDR interfaces on both ports (600 Mbps effective data rate), and 1.5-cycle read latency with DLL enabled. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1513JV18-300BZXC datasheet, CY7C1513JV18-300BZXC pinout, CY7C1513JV18-300BZXC application, or CY7C1513JV18-300BZXC equivalent, key selection criteria include burst depth (4-word), x18 data width, FBGA-165 package compatibility, DLL-enabled timing mode, and HSTL-18 I/O compliance.

Technical Context

The CY7C1513JV18 implements QDR-II architecture with fully independent read and write ports sharing a multiplexed 20-bit address bus. Read and write operations are synchronized to separate K/K clocks, while output data is clocked by C/C with echo clocks CQ/CQ for precise capture timing.

It uses synchronous self-timed writes and supports dual-clock domain operation with DLL for 1.5-cycle read latency or DLL-off QDR-I mode at up to 167 MHz. Core VDD = 1.8 V ±0.1 V and I/O VDDQ = 1.4–1.8 V enable low-power, high-speed interface compatibility with FPGA and ASIC memory controllers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with AS7C36256P-15TIN and IS61WV102418BLL-10BLI, CY7C1513JV18-300BZXC uniquely delivers 72-Mbit density with true concurrent dual-port DDR operation, echo-clock–assisted timing closure, and DLL-adjustable latency - essential for modern packet-processing and test instrumentation architectures.

Availability

CY7C1513JV18-300BZXC is available at Aetrix Electronics and suitable for network infrastructure, automated test equipment, wireless baseband processing, and FPGA-based protocol acceleration requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1513JV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

CY7C1513JV18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-throughput memory interfacing in packet-switched networks and real-time test instrumentation where concurrent read/write bandwidth and sub-cycle timing control are mandatory.

FAQ

What is the minimum supported VDDQ voltage for CY7C1513JV18-300BZXC?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed per datasheet specifications; 1.5 V is commonly used to balance power efficiency and noise margin in HSTL-18 interfaces. Core VDD remains fixed at 1.8 V ±0.1 V regardless of VDDQ setting.

Can CY7C1513JV18-300BZXC operate without connecting the ZQ pin?

No - ZQ must be connected either to an external resistor to ground (for impedance calibration) or directly to VDDQ (to enable minimum drive strength). Leaving ZQ unconnected or tied to GND violates absolute maximum ratings and may cause output driver malfunction or excessive current draw.

How does DOFF affect read latency and maximum operating frequency?

Asserting DOFF (low) disables the DLL, forcing QDR-I timing mode: read latency drops to 1 cycle but maximum clock frequency is limited to 167 MHz. In DLL-on mode, latency is 1.5 cycles at full 300 MHz operation - this trade-off is hardware-selectable per system timing budget.

Is the 165-ball FBGA package of CY7C1513JV18-300BZXC compatible with CY7C1511JV18-300BZXC layout?

Yes - all QDR-II parts in the CY7C15xxJV18 family share identical 165-ball FBGA mechanical dimensions and ball pitch (0.8 mm). Pin functions differ (e.g., D[17:0] vs D[7:0], BWS vs NWS), but PCB footprint and thermal pad design are fully interchangeable across x8/x9/x18/x36 variants.