Cypress Semiconductor Corp CY7C1513KV18-200BZXI
- Part No.:
- CY7C1513KV18-200BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1513KV18-200BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1513KV18-200BZXI from Cypress Semiconductor is a 4M × 18 (72-Mbit) QDR® II SRAM with synchronous pipelined architecture, separate read/write ports, 200 MHz maximum clock frequency, 1.8 V core supply, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers concurrent read/write transactions at 400 MT/s effective data rate using DDR interfaces on both ports and supports four-word burst transfers for high-bandwidth networking buffer applications.
For engineers reviewing the CY7C1513KV18-200BZXI datasheet, CY7C1513KV18-200BZXI pinout, CY7C1513KV18-200BZXI application, or CY7C1513KV18-200BZXI equivalent, key selection criteria include its 200 MHz K-clock timing, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, BWS[1:0]-enabled byte write granularity, echo clock (CQ/CQ) support for source-synchronous capture, and compatibility with HSTL-15/18 I/O standards.
Technical Context
This QDR II SRAM implements dual independent clock domains: K/K for address/data input synchronization and C/C for output data timing, enabling precise deskewing across multi-device memory subsystems. Its internal PLL ensures accurate data placement relative to echo clocks, and all writes are self-timed with synchronous control logic.
The device uses a single multiplexed address bus latched on alternating rising edges of K, supports depth expansion via RPS/WPS, and maintains full data coherency by guaranteeing most-current-data delivery even during overlapping read/write operations to the same address.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization) |
| Maximum Clock Frequency | 200 MHz K-clock - sets upper limit for address strobe and command rate |
| Data Rate | 400 MT/s - double-data-rate transfer on both read and write ports |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines pipeline depth in controller design |
| Core Supply Voltage | 1.8 V ±0.1 V - defines power rail tolerance and noise margin for internal logic |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with both HSTL-15 and HSTL-18 systems |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count, high-speed memory |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edge of K/K; enables 18-bit parallel write per cycle |
| Q[17:0] | Synchronous read data output | Driven on rising edges of C/C; supports source-synchronous capture with echo clocks |
| RPS | Read port select (active LOW) | Enables read burst initiation; tristates Q[17:0] when deasserted |
| WPS | Write port select (active LOW) | Enables write operation; ignores D[17:0] when deasserted |
| BWS[1:0] | Byte write select (active LOW) | Controls write enable per 9-bit byte: BWS0 → D[8:0], BWS1 → D[17:9] |
| K, K | Positive/negative input clocks | Capture all synchronous inputs (address, data, control); K only used for edge-triggering |
| C, C | Positive/negative output clocks | Drive Q[17:0]; used with CQ/CQ for flight-time deskew in multi-SRAM systems |
| CQ, CQ | Echo clocks (output) | Replicate C/C timing at receiver; simplify high-speed data capture without board-level delay matching |
| DOFF | Read latency mode control | HIGH → 1.5-cycle latency; LOW → 1-cycle latency - selects trade-off between throughput and latency |
| VDD, VDDQ, VSS | Power and ground terminals | VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per bank reduce switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates bus turnaround overhead - enables true concurrent access without arbitration delay |
| Four-word burst architecture | Reduces address bus toggling by 75% per transaction - lowers system EMI and routing complexity |
| Source-synchronous echo clocks (CQ/CQ) | Removes need for precise PCB trace length matching - simplifies layout for >400 MT/s signaling |
| Programmable read latency (DOFF) | Allows runtime optimization between latency-critical (1-cycle) and bandwidth-optimized (1.5-cycle) modes |
| HSTL-compatible I/O with variable drive | Ensures signal integrity across 1.5 V and 1.8 V host interfaces while supporting impedance calibration (ZQ) |
Applications
| High-Speed Network Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in 10G/25G switch ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port buffer providing zero-wait-state concurrent ingress/egress packet storage with deterministic 1-cycle read latency. Use Value: Enables line-rate packet processing by eliminating read/write contention and reducing address bus frequency via four-word burst addressing. |
Use Scenario: Serving as shared memory between DSPs and FPGA-based framer/mapper units in OTN/SONET line cards. IC Role / Device Role / Timing Role: High-throughput, low-latency scratchpad memory synchronized to multiple clock domains (K/C for control, CQ for capture). Use Value: Supports simultaneous frame assembly and disassembly without software-managed arbitration, improving channel density per card. |
| Baseband Processing in 5G RU | Test Equipment Pattern Memory |
|
Use Scenario: Holding IQ sample buffers for real-time FFT and channel estimation in massive MIMO radio units operating at 200+ MHz sampling rates. IC Role / Device Role / Timing Role: Burst-mode memory interfacing directly to high-speed ADC/DAC controllers with echo-clock–based data capture. Use Value: Delivers sustained 400 MT/s bandwidth with sub-5 ns read-to-write turnaround - critical for closed-loop beamforming loops. |
Use Scenario: Storing stimulus/response patterns in automated test equipment requiring deterministic, jitter-free memory access at 200 MHz. IC Role / Device Role / Timing Role: Deterministic-access pattern generator memory with JTAG 1149.1 boundary scan for production test coverage. Use Value: Guarantees bit-accurate pattern replay under varying temperature/voltage, validated via IEEE 1149.1 scan diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1513KV18-250BZXI | 250 MHz max K-clock; higher current draw (500 mA typical @ 250 MHz vs. 440 mA @ 200 MHz) | Requires tighter timing closure and higher-power PDN; suitable only where 25% bandwidth uplift justifies cost/power increase | Select only if system clock tree supports 250 MHz with <15 ps skew and thermal budget allows +12% power dissipation |
| AS7C3256A-20JC | Asynchronous 32K × 8 SRAM; no DDR, no echo clocks, no separate ports; 20 ns access time | Cannot support concurrent read/write or source-synchronous capture; limited to low-bandwidth control-plane buffering | Use only for non-real-time configuration storage where QDR II features provide no benefit and cost sensitivity is high |
Compared with CY7C1513KV18-250BZXI, the -200BZXI trades 25% peak bandwidth for lower power, relaxed timing margins, and broader voltage/temperature stability; versus AS7C3256A-20JC, it delivers 20× higher effective throughput and deterministic latency but requires clock domain management and higher PCB complexity.
Availability
CY7C1513KV18-200BZXI is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom line card memory, 5G baseband processing, and automated test equipment pattern storage requiring stable component supply across extended product lifecycles.
Supply support for CY7C1513KV18-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, communications, and industrial systems, with headquarters in San Jose, CA.
CY7C1513KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth, low-latency buffer applications in packet-switched infrastructure where concurrent read/write and source-synchronous timing are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1513KV18-200BZXI?
The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal access delay. This setting is sampled synchronously on the rising edge of the K clock and affects all subsequent read operations until changed.
Can CY7C1513KV18-200BZXI operate with only a single clock (K) instead of differential K/K?
Yes - the device supports single-ended clocking on K only; K may be tied to VDD or VSS. In this mode, both read and write data are synchronized to K, and C/C must also be driven from the same source. However, echo clock (CQ/CQ) functionality and optimal deskew capability are lost, limiting reliable operation to ≤300 MT/s in most layouts.
How does byte write select (BWS) work for the 4M × 18 configuration?
BWS[1:0] provides two active-LOW signals controlling 9-bit byte lanes: BWS0 enables writing to D[8:0], and BWS1 enables D[17:9]. When either is deasserted, the corresponding 9-bit segment retains its prior value. This allows partial-word updates without read-modify-write cycles - essential for protocol header manipulation in packet processing.
Is JTAG boundary scan supported on CY7C1513KV18-200BZXI, and what pins are used?
Yes - the device implements IEEE 1149.1 JTAG test access port using TDI, TDO, TCK, and TMS pins located on balls R14, R13, R12, and R11 respectively. Boundary scan supports full pin interconnect testing and is enabled by default at power-up; it can be disabled via instruction register programming if unused in production.
CY7C1513KV18-200BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1513KV18-200BZXI FAQ
1.How can I place an order for CY7C1513KV18-200BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1513KV18-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1513KV18-200BZXI reliable?
The price and inventory of CY7C1513KV18-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-200BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1513KV18-200BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-200BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1513KV18-200BZXI?
CY7C1513KV18-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1513KV18-200BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1513KV18-200BZXI?
For technical support, including CY7C1513KV18-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-200BZXI requirements.
6.How does Aetrix verify that CY7C1513KV18-200BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1513KV18-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-200BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1513KV18-200BZXI?
All CY7C1513KV18-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-200BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1513KV18-200BZXI part is unused and in its original packaging.
Return procedure for CY7C1513KV18-200BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1513KV18-200BZXI Tags

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STMicroelectronics
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Microchip Technology

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Microchip Technology

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Microchip Technology
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STMicroelectronics

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Microchip Technology

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Microchip Technology
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