Cypress Semiconductor Corp CY7C1513KV18-300BZC

Overview

CY7C1513KV18-300BZC from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with synchronous pipelined architecture, separate read/write ports, 300 MHz clock operation (600 MHz DDR data rate), 1.8 V core supply, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers concurrent read/write transactions for high-throughput packet buffering in network line cards.

For engineers reviewing the CY7C1513KV18-300BZC datasheet, CY7C1513KV18-300BZC pinout, CY7C1513KV18-300BZC application, or CY7C1513KV18-300BZC equivalent, key selection criteria include burst depth (four-word), DOFF-controlled read latency (1.5 or 1 cycle), echo clock support (CQ/CQ), and HSTL-compatible 1.4–1.8 V I/O voltage range.

Technical Context

The device implements true dual-port QDR II architecture: independent K/K clocks latch address and write data on rising edges, while C/C clocks drive read data outputs with echo-clock alignment. Internal self-timed writes eliminate external write pulse timing constraints.

It supports depth expansion via RPS/WPS port selects and byte-level write masking via BWS[1:0], enabling 18-bit word granularity without bus turnaround. The integrated PLL ensures precise data placement relative to output clocks, critical for >600 Mbps interface timing closure.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L5PF and IS61WV102418BLL-15BLI, CY7C1513KV18-300BZC uniquely delivers 300 MHz DDR dual-port performance with echo-clock timing support and flexible 1.4–1.8 V I/O, making it optimal for high-throughput, low-latency packet processing.

Availability

CY7C1513KV18-300BZC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and baseband processing units requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1513KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1513KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-switched infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-300BZC?

The DOFF pin selects read latency mode: when asserted HIGH, the device operates with 1.5-cycle read latency; when LOW, it uses 1-cycle latency. This setting is sampled synchronously on the rising edge of the K clock and remains effective until changed. It directly impacts timing budget allocation for read data capture at the controller.

Can CY7C1513KV18-300BZC operate with only a single clock (K) instead of differential K/K?

Yes - the device supports single-ended clocking on K only, with K tied to VSS or VDD per datasheet guidance. In this mode, C/C clocks remain required for read data output timing, and echo clocks (CQ/CQ) retain full functionality. Write operations use only K; read data is still aligned to C/C edges.

How does byte write select (BWS[1:0]) work for 18-bit words?

BWS[0] controls write enable for D[8:0] (lower 9 bits), and BWS[1] controls D[17:9] (upper 9 bits). Both are active-low and sampled on the same K clock edge as data. When a BWS bit is deasserted (HIGH), its corresponding 9-bit segment is ignored during the write, preserving prior contents in those bits.

Is the 165-ball FBGA package of CY7C1513KV18-300BZC compatible with standard reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤260°C). Thermal pad under the die is not electrically connected; board layout must follow Cypress's recommended solder mask and stencil design rules for void minimization.