Cypress Semiconductor Corp CY7C1513KV18-300BZI

Overview

CY7C1513KV18-300BZI from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with separate read/write ports, 300 MHz clock operation (600 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst architecture and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers.

For engineers reviewing the CY7C1513KV18-300BZI datasheet, CY7C1513KV18-300BZI pinout, CY7C1513KV18-300BZI application, or CY7C1513KV18-300BZI equivalent, key selection criteria include its 20-bit address bus, dual-clock DDR timing (K/K and C/C), DOFF-controlled 1.5-cycle vs. 1-cycle read latency, and FBGA-165 package compatibility with depth expansion via RPS/WPS and BWS[1:0].

Technical Context

This QDR II SRAM implements fully independent synchronous read and write pipelines with pipelined address latching on alternating K-clock edges. Its dual DDR interfaces operate at 600 MHz effective data rate using edge-aligned K/K for writes and C/C for reads - enabling true concurrent access without bus turnaround.

The device integrates a PLL for precise output data placement, supports programmable impedance via ZQ pin, and uses JTAG 1149.1 for boundary scan testing. Read latency is configurable (1 or 1.5 cycles) via DOFF, and byte write select (BWS[1:0]) enables partial 18-bit word updates without read-modify-write overhead.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with AS7C361024B-300BIN and IS42S16160F-3BL, CY7C1513KV18-300BZI uniquely delivers true concurrent access, echo-clock–assisted timing closure, and configurable latency - making it irreplaceable in high-performance packet processing where deterministic dual-port bandwidth is mandatory.

Availability

CY7C1513KV18-300BZI is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom line card buffering requiring stable component supply across extended product lifecycles.

Supply support for CY7C1513KV18-300BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1513KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, dual-port memory access in networking infrastructure - targeting packet switches, routers, and baseband units demanding >4 GB/s sustained bandwidth.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-300BZI?

The DOFF (Data Output OFF) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting is sampled at power-up and remains static during operation - no dynamic switching is supported.

Can CY7C1513KV18-300BZI operate with only a single clock source?

Yes - the device supports single-clock-domain operation by tying K to C and K to C. In this mode, all data transfers (read and write) are synchronized to the K clock, eliminating need for separate C/C generation. However, echo clocks (CQ/CQ) remain functional and must be terminated properly to avoid noise coupling.

How does the BWS[1:0] signal enable partial writes in CY7C1513KV18-300BZI?

BWS[1:0] are active-low byte write selects: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted (HIGH), the corresponding 9-bit portion of the 18-bit write word is ignored, preserving existing memory contents. This enables efficient 9-bit or 18-bit updates without requiring read-modify-write sequences.

Is the 165-ball FBGA package of CY7C1513KV18-300BZI compatible with standard reflow profiles?

Yes - the CY7C1513KV18-300BZI in 165-ball FBGA (13 × 15 × 1.4 mm) adheres to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and qualifies for standard lead-free reflow profiles (peak 260°C, 60-second duration). Board layout must observe 0.5 mm ball pitch spacing and recommended thermal pad under the die area.