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Cypress Semiconductor Corp CY7C1513KV18-333BZC

Part No.:
CY7C1513KV18-333BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513KV18-333BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,281

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Product details

Overview

CY7C1513KV18-333BZC from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with separate read/write ports, 333 MHz clock frequency, double data rate (666 MHz effective) interfaces on both ports, and 1.8 V core / 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for network line cards and switch fabric controllers.

For engineers reviewing the CY7C1513KV18-333BZC datasheet, CY7C1513KV18-333BZC pinout, CY7C1513KV18-333BZC application, or CY7C1513KV18-333BZC equivalent, key selection criteria include concurrent read/write capability, four-word burst timing, echo clock (CQ/CQ) support for high-speed data capture, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, and FBGA-165 package compatibility with DDR memory subsystem layouts.

Technical Context

The CY7C1513KV18-333BZC implements QDR II architecture with fully independent synchronous read and write ports sharing a multiplexed 20-bit address bus (A[19:0]), enabling true concurrent transactions without bus turnaround. Its internal pipelined structure uses rising-edge-triggered K/K clocks for address/data capture and C/C clocks for output timing.

It integrates a phase-locked loop (PLL) for precise data placement, supports programmable impedance via ZQ pin, and provides byte write select (BWS[1:0]) for granular 18-bit word updates. Read latency is configurable via DOFF pin: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW), matching system timing budgets across different controller generations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 organization)
Maximum Clock Frequency 333 MHz - enables 666 MT/s effective data rate per port
Read Latency Configurable: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW)
Core Supply Voltage 1.8 V ±0.1 V - defines minimum power rail stability requirement
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V logic families
Burst Length Four-word burst - reduces address bus toggling frequency by 4× vs. single-word access
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory devices

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
A[19:0] Multiplexed address input Latched on rising edge of K clock for both read and write operations; 20 bits address 4M locations
D[17:0] Write data input 18-bit parallel data sampled on rising edge of K/K; supports byte-level writes via BWS[1:0]
Q[17:0] Read data output 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS is deasserted
RPS Read port select Active-low synchronous control; initiates read burst and enables Q[17:0] drivers
WPS Write port select Active-low synchronous control; enables D[17:0] sampling and write to memory array
BWS[1:0] Byte write select Two active-low signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes
C, C Output data clocks Differential pair used to clock Q[17:0]; minimizes skew between devices in multi-chip systems
K, K Input clocks Differential pair for latching A[19:0], D[17:0], RPS, WPS, BWS[1:0]; only rising edges used
CQ, CQ Echo clocks Output-referenced clocks synchronized to Q[17:0] edges; simplify source-synchronous capture at controller
DOFF Read latency mode Static configuration pin: HIGH → 1.5-cycle latency; LOW → 1-cycle latency
ZQ Impedance calibration Connects to external 240 Ω resistor to ground for HSTL output driver calibration
VDD, VDDQ, VSS Power/ground VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; VSS = common ground reference for all domains

Key Features

Feature Design Value
Separate read/write ports Enables simultaneous read and write to different addresses - eliminates bus turnaround overhead in streaming applications
Four-word burst architecture Reduces required address bus toggle rate by 75%, lowering EMI and simplifying PCB routing
Echo clocks (CQ/CQ) Provide source-synchronous timing references aligned to Q[17:0] edges - relaxes setup/hold timing at controller
Programmable read latency (DOFF) Allows runtime adaptation to controller timing margins: 1-cycle for low-latency systems, 1.5-cycle for higher-frequency synchronization
JTAG 1149.1 test access port Enables boundary scan testing and in-system programming without dedicated test pads or probes

Applications

Network Packet Buffering Switch Fabric Controller Memory

Use Scenario: Storing ingress/egress packet headers and metadata in 10/40/100 Gbps Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput, low-latency dual-port buffer interfacing directly with SerDes MAC controllers.

Use Value: Concurrent read/write allows header lookup during payload write - sustaining full line-rate throughput without stalls.

Use Scenario: Holding forwarding tables and queue state in modular chassis-based routers.

IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by multiple ASICs via time-multiplexed ports.

Use Value: Four-word burst and echo clocks reduce controller logic complexity while maintaining sub-10 ns read latency.

Telecom Baseband Processing High-Speed Test Equipment Memory

Use Scenario: Real-time buffering of IQ samples between FPGA-based channelizers and DSP cores in 5G NR base stations.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as a deterministic latency bridge between processing stages.

Use Value: Configurable DOFF latency ensures alignment with FPGA register stages across varying clock domain crossings.

Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Dual-port memory staging stimulus and response data for real-time comparison engines.

Use Value: Independent RPS/WPS controls enable precise interleaving of test vector load and result capture within one clock cycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1513KV18-250BZC 250 MHz max clock (vs. 333 MHz); lower power consumption (500 mA typical vs. 620 mA) Suitable for cost-sensitive or thermally constrained systems where 5.3 GB/s bandwidth is sufficient Select when system clock budget permits relaxed timing and thermal headroom is limited
AS7C35128PFS-333BIN Same 4M × 18 density and 333 MHz rating but uses standard QDR-II+ interface without echo clocks or DOFF latency control Requires external timing compensation; lacks CQ/CQ and ZQ calibration - increases controller design effort Choose only if legacy controller IP lacks echo clock support and board layout cannot accommodate ZQ resistor

Compared with CY7C1513KV18-250BZC, the -333BZC delivers +33% bandwidth at higher power; versus AS7C35128PFS-333BIN, it provides superior signal integrity via echo clocks and flexible latency tuning - critical for next-generation networking silicon integration.

Availability

CY7C1513KV18-333BZC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric controllers, telecom baseband processing, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1513KV18-333BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking and telecommunications infrastructure - emphasizing concurrent access, deterministic timing, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-333BZC?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin with high-frequency controllers; when LOW, it selects 1-cycle latency for minimal delay. This setting is sampled at power-up and remains static during operation - no dynamic reconfiguration is supported.

Can CY7C1513KV18-333BZC operate with only a single clock domain?

Yes - the device supports single-clock-mode operation where K and C are tied together (and K and C likewise), eliminating need for separate clock pairs. In this mode, data is latched and driven using the same clock edges, simplifying system design at the cost of reduced skew tolerance compared to differential clocking.

What is the purpose of the ZQ pin and how must it be connected?

The ZQ pin enables on-die impedance calibration for HSTL-compatible output drivers. It must be connected to a precision 240 Ω resistor to ground; deviation beyond ±1% affects output drive strength and signal integrity. Calibration occurs automatically at power-up and can be retriggered via JTAG instruction.

How does byte write select (BWS) work for the 18-bit data width?

BWS[1:0] are two independent active-low signals: BWS0 controls write enable for D[8:0], and BWS1 controls D[17:9]. When either is deasserted, the corresponding 9-bit nibble retains its prior value - enabling partial-word updates without read-modify-write cycles. Both signals are sampled synchronously with D[17:0] on the K clock edge.

CY7C1513KV18-333BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1513KV18-333BZC FAQ

1.How can I place an order for CY7C1513KV18-333BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513KV18-333BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513KV18-333BZC reliable?

The price and inventory of CY7C1513KV18-333BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-333BZC is usually 5 days.

3.What payment methods are accepted for CY7C1513KV18-333BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-333BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1513KV18-333BZC?

CY7C1513KV18-333BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513KV18-333BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513KV18-333BZC?

For technical support, including CY7C1513KV18-333BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-333BZC requirements.

6.How does Aetrix verify that CY7C1513KV18-333BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1513KV18-333BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-333BZC meets industry standards.

7.What is the process for return or replacement of CY7C1513KV18-333BZC?

All CY7C1513KV18-333BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-333BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513KV18-333BZC part is unused and in its original packaging.

Return procedure for CY7C1513KV18-333BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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