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Cypress Semiconductor Corp CY7C1513KV18-333BZI

Part No.:
CY7C1513KV18-333BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513KV18-333BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:897

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Product details

Overview

CY7C1513KV18-333BZI from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with separate read/write ports, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst architecture and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and baseband memory subsystems.

For engineers reviewing the CY7C1513KV18-333BZI datasheet, CY7C1513KV18-333BZI pinout, CY7C1513KV18-333BZI application, or CY7C1513KV18-333BZI equivalent, key selection criteria include 1.8 V core/1.4 V I/O compatibility, FBGA-165 package footprint, DOFF-controlled read latency (1 or 1.5 cycles), BWS[1:0]-based byte write granularity, and PLL-synchronized timing for deterministic DDR capture.

Technical Context

The CY7C1513KV18-333BZI implements QDR II architecture with fully independent synchronous read and write ports sharing a multiplexed 20-bit address bus. Read and write operations are latched on alternate rising edges of the K clock, enabling true concurrency without bus turnaround.

It uses dual output clocks (C and C) plus echo clocks (CQ and CQ) to compensate for PCB flight-time skew, and integrates a PLL for precise data placement relative to clock edges. The device supports programmable drive strength and JTAG 1149.1 boundary scan for production testability.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (4M × 18 organization)
Max Clock Frequency333 MHz - enables 666 MT/s DDR throughput per port
Core Supply Voltage1.8 V ±0.1 V - defines minimum power rail stability requirement
I/O Supply Range1.4 V to 1.8 V - supports HSTL-compatible signaling at 1.5 V or 1.8 V
Read Latency1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines pipeline depth in controller design
Burst LengthFour-word - reduces effective address bus toggling frequency by 4×
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data input18-bit parallel data sampled on rising edge of K/K; enables full-word or byte-selectable writes via BWS[1:0]
Q[17:0]Synchronous read data output18-bit parallel data driven on rising edge of C/C; tristated when RPS is deasserted
K / KInput clock pairRising edges latch all synchronous inputs (address, control, data); K only used for timing in single-clock mode
C / COutput clock pairControl timing of Q[17:0] output; used with CQ/CQ for deskewed capture at controller
CQ / CQEcho clock outputsReplicate C/C timing at device output pins to simplify controller's source-synchronous capture
RPS / WPSPort select controlsActive-low signals enabling independent read/write port activation; support depth expansion
BWS[1:0]Byte write selectsTwo active-low signals controlling D[8:0] and D[17:9] respectively; allow partial-word writes without read-modify-write
DOFFRead latency modeHigh = 1.5-cycle latency (pipelined), Low = 1-cycle latency (QDR I–compatible behavior)

Key Features

FeatureDesign Value
Separate read/write data pathsEliminates bus turnaround overhead, enabling sustained 666 MT/s bidirectional bandwidth
Four-word burst architectureReduces required address transition rate by 75%, easing timing closure on address bus
Programmable DOFF latency modeAllows system-level trade-off between latency (1 cycle) and throughput (1.5-cycle pipelined)
HSTL Class I–compatible I/OSupports 1.5 V or 1.8 V VDDQ with variable drive strength for signal integrity tuning
JTAG 1149.1 boundary scanEnables automated test and interconnect verification in assembled systems

Applications

Packet Buffer MemoryBaseband Processing Memory

Use Scenario: High-throughput line cards in 10G/40G Ethernet switches buffering ingress/egress packets with strict latency constraints.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as zero-turnaround packet buffer with concurrent read (transmit path) and write (receive path) access.

Use Value: 666 MT/s DDR bandwidth per port sustains full line-rate traffic without backpressure; echo clocks ensure reliable capture at FPGA PHY interfaces.

Use Scenario: LTE/5G remote radio units requiring low-latency, deterministic memory access for FFT/IFFT and channel estimation pipelines.

IC Role / Device Role / Timing Role: Synchronous memory co-processor interfacing with DSP/FPGA, providing pipelined read data with configurable 1- or 1.5-cycle latency.

Use Value: DOFF-selectable latency allows alignment with algorithm pipeline stages; BWS[1:0] enables efficient coefficient updates without full-word overwrites.

Network Processor CacheTest Equipment Pattern Memory

Use Scenario: Embedded network processors performing deep packet inspection where metadata and payload must be accessed concurrently.

IC Role / Device Role / Timing Role: On-chip cache extension with independent read (rule lookup) and write (payload store) ports operating at same clock domain.

Use Value: Full data coherency guarantees most recent payload is available during rule-match evaluation; no software-managed coherence required.

Use Scenario: Automated test equipment generating high-speed stimulus patterns and capturing response waveforms simultaneously.

IC Role / Device Role / Timing Role: Deterministic pattern storage with synchronized read (output waveform) and write (input capture) under shared clocking.

Use Value: PLL-synchronized timing ensures sub-nanosecond jitter between stimulus generation and response sampling clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1513KV18-300BZILower max clock (300 MHz → 600 MT/s DDR), reduced IDD (570 mA vs. 620 mA @ 333 MHz)Acceptable where 666 MT/s not required; lower power and thermal loadSelect when system timing margin permits 300 MHz operation and power budget is constrained
AS7C3256A-15JCINAsynchronous 256K × 16 SRAM; no DDR, no echo clocks, no DOFF latency controlOnly suitable for non-concurrent, lower-bandwidth applications with relaxed timingNot a functional replacement; consider only if QDR II features are unnecessary and cost is primary driver

Compared with CY7C1513KV18-333BZI, the -300BZI variant trades 66 MT/s bandwidth for lower power and improved timing margin, while the AS7C3256A lacks QDR II's concurrency, DDR, and echo clocking-making it unsuitable for high-speed networking or baseband use cases.

Availability

CY7C1513KV18-333BZI is available at Aetrix Electronics and suitable for packet buffer memory, baseband processing memory, and network processor cache applications requiring stable component supply across multi-year production cycles.

Supply support for CY7C1513KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in communications infrastructure-specifically engineered to eliminate bus turnaround and support deterministic DDR capture in FPGA- and ASIC-based datapaths.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-333BZI?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle pipelined read latency for maximum throughput; when LOW, it reverts to 1-cycle latency matching QDR I behavior. This setting directly affects controller pipeline depth and must be fixed at power-up; it is not dynamically switchable during operation.

Can CY7C1513KV18-333BZI operate with 1.5 V I/O supply?

Yes, the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V nominal. Its HSTL Class I–compatible output drivers are designed for this range, and DC/AC electrical characteristics-including setup/hold times and output swing-are fully specified at 1.5 V. No configuration register or external resistor is needed to enable 1.5 V operation.

How does the CY7C1513KV18-333BZI handle concurrent read and write to the same address?

The device guarantees full data coherency: a read access returns the most recently written data, even if the write is still in progress within the same burst cycle. Internally, the write path is pipelined and self-timed, and the read path samples the memory array after write completion-ensuring reads always reflect the latest valid write without software intervention.

What is the purpose of the CQ and CQ echo clocks?

CQ and CQ are output-replica clocks synchronized to C and C, respectively, and routed alongside Q[17:0] signals. They allow the receiving controller to perform source-synchronous capture using the same clock edge that launched the data, eliminating need for board-level clock-data skew compensation. This is critical for reliable 666 MT/s DDR operation across temperature and voltage variations.

CY7C1513KV18-333BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1513KV18-333BZI FAQ

1.How can I place an order for CY7C1513KV18-333BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513KV18-333BZI reliable?

The price and inventory of CY7C1513KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-333BZI is usually 5 days.

3.What payment methods are accepted for CY7C1513KV18-333BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-333BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1513KV18-333BZI?

CY7C1513KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513KV18-333BZI?

For technical support, including CY7C1513KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-333BZI requirements.

6.How does Aetrix verify that CY7C1513KV18-333BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1513KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-333BZI meets industry standards.

7.What is the process for return or replacement of CY7C1513KV18-333BZI?

All CY7C1513KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-333BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513KV18-333BZI part is unused and in its original packaging.

Return procedure for CY7C1513KV18-333BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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