Cypress Semiconductor Corp CY7C1513KV18-333BZI
- Part No.:
- CY7C1513KV18-333BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1513KV18-333BZI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:897
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Product details
Overview
CY7C1513KV18-333BZI from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with separate read/write ports, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst architecture and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and baseband memory subsystems.
For engineers reviewing the CY7C1513KV18-333BZI datasheet, CY7C1513KV18-333BZI pinout, CY7C1513KV18-333BZI application, or CY7C1513KV18-333BZI equivalent, key selection criteria include 1.8 V core/1.4 V I/O compatibility, FBGA-165 package footprint, DOFF-controlled read latency (1 or 1.5 cycles), BWS[1:0]-based byte write granularity, and PLL-synchronized timing for deterministic DDR capture.
Technical Context
The CY7C1513KV18-333BZI implements QDR II architecture with fully independent synchronous read and write ports sharing a multiplexed 20-bit address bus. Read and write operations are latched on alternate rising edges of the K clock, enabling true concurrency without bus turnaround.
It uses dual output clocks (C and C) plus echo clocks (CQ and CQ) to compensate for PCB flight-time skew, and integrates a PLL for precise data placement relative to clock edges. The device supports programmable drive strength and JTAG 1149.1 boundary scan for production testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization) |
| Max Clock Frequency | 333 MHz - enables 666 MT/s DDR throughput per port |
| Core Supply Voltage | 1.8 V ±0.1 V - defines minimum power rail stability requirement |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-compatible signaling at 1.5 V or 1.8 V |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines pipeline depth in controller design |
| Burst Length | Four-word - reduces effective address bus toggling frequency by 4× |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K/K; enables full-word or byte-selectable writes via BWS[1:0] |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edge of C/C; tristated when RPS is deasserted |
| K / K | Input clock pair | Rising edges latch all synchronous inputs (address, control, data); K only used for timing in single-clock mode |
| C / C | Output clock pair | Control timing of Q[17:0] output; used with CQ/CQ for deskewed capture at controller |
| CQ / CQ | Echo clock outputs | Replicate C/C timing at device output pins to simplify controller's source-synchronous capture |
| RPS / WPS | Port select controls | Active-low signals enabling independent read/write port activation; support depth expansion |
| BWS[1:0] | Byte write selects | Two active-low signals controlling D[8:0] and D[17:9] respectively; allow partial-word writes without read-modify-write |
| DOFF | Read latency mode | High = 1.5-cycle latency (pipelined), Low = 1-cycle latency (QDR I–compatible behavior) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead, enabling sustained 666 MT/s bidirectional bandwidth |
| Four-word burst architecture | Reduces required address transition rate by 75%, easing timing closure on address bus |
| Programmable DOFF latency mode | Allows system-level trade-off between latency (1 cycle) and throughput (1.5-cycle pipelined) |
| HSTL Class I–compatible I/O | Supports 1.5 V or 1.8 V VDDQ with variable drive strength for signal integrity tuning |
| JTAG 1149.1 boundary scan | Enables automated test and interconnect verification in assembled systems |
Applications
| Packet Buffer Memory | Baseband Processing Memory |
|---|---|
Use Scenario: High-throughput line cards in 10G/40G Ethernet switches buffering ingress/egress packets with strict latency constraints. IC Role / Device Role / Timing Role: Dual-port SRAM serving as zero-turnaround packet buffer with concurrent read (transmit path) and write (receive path) access. Use Value: 666 MT/s DDR bandwidth per port sustains full line-rate traffic without backpressure; echo clocks ensure reliable capture at FPGA PHY interfaces. | Use Scenario: LTE/5G remote radio units requiring low-latency, deterministic memory access for FFT/IFFT and channel estimation pipelines. IC Role / Device Role / Timing Role: Synchronous memory co-processor interfacing with DSP/FPGA, providing pipelined read data with configurable 1- or 1.5-cycle latency. Use Value: DOFF-selectable latency allows alignment with algorithm pipeline stages; BWS[1:0] enables efficient coefficient updates without full-word overwrites. |
| Network Processor Cache | Test Equipment Pattern Memory |
Use Scenario: Embedded network processors performing deep packet inspection where metadata and payload must be accessed concurrently. IC Role / Device Role / Timing Role: On-chip cache extension with independent read (rule lookup) and write (payload store) ports operating at same clock domain. Use Value: Full data coherency guarantees most recent payload is available during rule-match evaluation; no software-managed coherence required. | Use Scenario: Automated test equipment generating high-speed stimulus patterns and capturing response waveforms simultaneously. IC Role / Device Role / Timing Role: Deterministic pattern storage with synchronized read (output waveform) and write (input capture) under shared clocking. Use Value: PLL-synchronized timing ensures sub-nanosecond jitter between stimulus generation and response sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1513KV18-300BZI | Lower max clock (300 MHz → 600 MT/s DDR), reduced IDD (570 mA vs. 620 mA @ 333 MHz) | Acceptable where 666 MT/s not required; lower power and thermal load | Select when system timing margin permits 300 MHz operation and power budget is constrained |
| AS7C3256A-15JCIN | Asynchronous 256K × 16 SRAM; no DDR, no echo clocks, no DOFF latency control | Only suitable for non-concurrent, lower-bandwidth applications with relaxed timing | Not a functional replacement; consider only if QDR II features are unnecessary and cost is primary driver |
Compared with CY7C1513KV18-333BZI, the -300BZI variant trades 66 MT/s bandwidth for lower power and improved timing margin, while the AS7C3256A lacks QDR II's concurrency, DDR, and echo clocking-making it unsuitable for high-speed networking or baseband use cases.
Availability
CY7C1513KV18-333BZI is available at Aetrix Electronics and suitable for packet buffer memory, baseband processing memory, and network processor cache applications requiring stable component supply across multi-year production cycles.
Supply support for CY7C1513KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.
The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in communications infrastructure-specifically engineered to eliminate bus turnaround and support deterministic DDR capture in FPGA- and ASIC-based datapaths.
FAQ
What is the function of the DOFF pin on CY7C1513KV18-333BZI?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle pipelined read latency for maximum throughput; when LOW, it reverts to 1-cycle latency matching QDR I behavior. This setting directly affects controller pipeline depth and must be fixed at power-up; it is not dynamically switchable during operation.
Can CY7C1513KV18-333BZI operate with 1.5 V I/O supply?
Yes, the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V nominal. Its HSTL Class I–compatible output drivers are designed for this range, and DC/AC electrical characteristics-including setup/hold times and output swing-are fully specified at 1.5 V. No configuration register or external resistor is needed to enable 1.5 V operation.
How does the CY7C1513KV18-333BZI handle concurrent read and write to the same address?
The device guarantees full data coherency: a read access returns the most recently written data, even if the write is still in progress within the same burst cycle. Internally, the write path is pipelined and self-timed, and the read path samples the memory array after write completion-ensuring reads always reflect the latest valid write without software intervention.
What is the purpose of the CQ and CQ echo clocks?
CQ and CQ are output-replica clocks synchronized to C and C, respectively, and routed alongside Q[17:0] signals. They allow the receiving controller to perform source-synchronous capture using the same clock edge that launched the data, eliminating need for board-level clock-data skew compensation. This is critical for reliable 666 MT/s DDR operation across temperature and voltage variations.
CY7C1513KV18-333BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1513KV18-333BZI FAQ
1.How can I place an order for CY7C1513KV18-333BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1513KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1513KV18-333BZI reliable?
The price and inventory of CY7C1513KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-333BZI is usually 5 days.
3.What payment methods are accepted for CY7C1513KV18-333BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-333BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1513KV18-333BZI?
CY7C1513KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1513KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1513KV18-333BZI?
For technical support, including CY7C1513KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-333BZI requirements.
6.How does Aetrix verify that CY7C1513KV18-333BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1513KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-333BZI meets industry standards.
7.What is the process for return or replacement of CY7C1513KV18-333BZI?
All CY7C1513KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-333BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1513KV18-333BZI part is unused and in its original packaging.
Return procedure for CY7C1513KV18-333BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1513KV18-333BZI Tags

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