Cypress Semiconductor Corp CY7C1513V18-200BZC
- Part No.:
- CY7C1513V18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1513V18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:100
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Product details
Overview
CY7C1513V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 200 MHz maximum operating frequency, DDR interfaces on both ports (400 Mbps per data pin), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1513V18 datasheet, CY7C1513V18 pinout, CY7C1513V18 application, or CY7C1513V18 equivalent, key selection criteria include burst depth (4-word), dual-clock timing (K/K and C/C), echo clocks (CQ/CQ), HSTL I/O compatibility, and synchronous self-timed write control.
Technical Context
The CY7C1513V18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated input clocks (K/K for address/control, C/C for output timing). Address latching occurs on alternating rising edges of K/K, enabling 4-word burst transfers per access without bus turnaround.
It uses a 1M × 18 internal array organization with four parallel sub-arrays, supports byte write selects (BWS[1:0]), includes a DLL for precise data-eye alignment, and features echo clocks (CQ/CQ) referenced to C/C to compensate for PCB flight-time skew in high-speed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18-bit organization) |
| Max Clock Frequency | 200 MHz - sets maximum sustained throughput of 1.44 GB/s (18-bit × 4 words × 200 MHz) |
| Data Interface | Double Data Rate (DDR) on both read and write ports - enables 400 Mbps per pin at 200 MHz clock |
| Supply Voltages | VDD = 1.8 V ± 0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - supports HSTL-compatible signaling with adjustable drive strength |
| Burst Length | 4-word fixed burst - reduces address bus toggling and simplifies controller address generation logic |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count, thermally efficient board layout |
| JTAG Support | IEEE 1149.1 compliant test access port - enables boundary-scan testing and in-system diagnostics |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edge of K/K; supports full 18-bit parallel writes per cycle |
| Q[17:0] | Synchronous read data outputs | Driven on rising edges of C/C; tri-stated when RPS is deasserted |
| K, K | Positive/negative input clocks | Control all synchronous inputs (address, WPS, RPS, BWS); rising edges initiate accesses |
| C, C | Positive/negative output clocks | Gate read data output timing; used with CQ/CQ to deskew data capture at controller |
| CQ, CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify high-speed source-synchronous capture |
| BWS[1:0] | Byte write select inputs | Active-low controls write enable for D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes |
| RPS, WPS | Read/Write port select | Active-low enables independent read or write port activation; allows concurrent operation |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[17:0]/CQ/CQ output driver impedance to 0.2×RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround delay and data contention, enabling true simultaneous read+write at full bandwidth |
| 4-word burst architecture | Reduces required address bus transitions by 75% per access versus single-word addressing |
| Delay Lock Loop (DLL) | Aligns internal data launch timing to C/C edges, ensuring setup/hold compliance at 200 MHz DDR |
| HSTL-compatible I/O | Variable-drive output buffers support system-level impedance matching and signal integrity across trace lengths |
| Full data coherency | Guarantees most recently written data is returned on subsequent reads, even during overlapping transactions |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer between ingress and egress traffic managers. Use Value: Concurrent 4-word bursts at 200 MHz deliver 1.44 GB/s bandwidth, meeting OC-192/STM-64 line-rate buffering requirements. | Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring deterministic memory access. IC Role / Device Role / Timing Role: Dual-port SRAM serving as time-slot interchange (TSI) buffer with independent read/write scheduling. Use Value: Separate K/K and C/C clock domains allow independent timing control for ingress (write) and egress (read) paths, minimizing jitter accumulation. |
| Baseband Processing Buffer | High-Speed Test Equipment Memory |
Use Scenario: Temporary storage of IQ samples between digital downconverters and channelizers in wireless base stations. IC Role / Device Role / Timing Role: Burst-access memory interfacing with FPGA-based signal processing pipelines using source-synchronous timing. Use Value: CQ/CQ echo clocks enable reliable capture of 400 Mbps DDR data at the FPGA receiver, compensating for interconnect skew up to ±150 ps. | Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic, low-jitter memory delivering stimulus/response vectors to DUT under precise clock control. Use Value: Synchronous self-timed writes guarantee consistent write latency (fixed 3-cycle pipeline), critical for timing-critical ATE vector execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus width, 10 ns access time, 1.5V core, no echo clocks or DLL | Designed for legacy QDR-I systems; lacks CQ/CQ and DLL for >200 MHz DDR timing closure | Select only if migrating from QDR-I infrastructure and bandwidth ≤1.2 GB/s suffices |
| ISSI IS61WV102418B | 1M × 18 sync SRAM, single-port, 166 MHz max, no DDR or burst mode | Lower cost, lower performance; requires external arbitration for read/write concurrency | Choose only for non-concurrent applications where 720 MB/s peak bandwidth is adequate |
Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1513V18 uniquely delivers true concurrent DDR read/write at 200 MHz with echo-clock–assisted timing closure-enabling deterministic 1.44 GB/s throughput without external FIFOs or arbitration logic.
Availability
CY7C1513V18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and high-speed test equipment requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1513V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
The QDR-II SRAM product line targets high-speed communications infrastructure requiring deterministic latency, concurrent access, and DDR bandwidth-optimized for packet switching, TDM, and real-time signal processing.
FAQ
What is the minimum supported clock frequency for CY7C1513V18?
The device operates down to DC - no minimum clock frequency is specified. All timing parameters are guaranteed over the full 0–200 MHz range, and the DLL remains functional at any enabled frequency. System-level timing margins must still be verified at low frequencies due to hold-time dependencies on clock duty cycle and skew.
Can CY7C1513V18 operate in single-clock mode?
Yes - it supports single-clock mode where K/K serve as both input and output clocks (C/C internally derived from K/K). In this mode, echo clocks CQ/CQ are referenced to K/K instead of C/C, and output timing aligns to K/K edges. This simplifies clock routing but reduces maximum achievable bandwidth compared to dual-clock operation.
How does ZQ pin calibration affect signal integrity?
ZQ connects to an external resistor (typically 100 Ω) to ground, tuning output driver impedance to 20 Ω (0.2 × RQ). This matches typical 100 Ω differential or 50 Ω single-ended PCB traces, reducing reflections and improving eye height at 400 Mbps DDR rates. Leaving ZQ unconnected or tied to GND violates specification and causes excessive overshoot/undershoot.
Is JTAG accessible during normal operation?
Yes - the IEEE 1149.1 TAP controller operates independently of memory function. TDI, TDO, TCK, and TMS remain active and controllable at any time, including during active read/write cycles. Boundary-scan testing can be performed without halting memory operations or resetting the device.
CY7C1513V18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1513V18-200BZC FAQ
1.How can I place an order for CY7C1513V18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1513V18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1513V18-200BZC reliable?
The price and inventory of CY7C1513V18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513V18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1513V18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513V18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1513V18-200BZC?
CY7C1513V18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1513V18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1513V18-200BZC?
For technical support, including CY7C1513V18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513V18-200BZC requirements.
6.How does Aetrix verify that CY7C1513V18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1513V18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513V18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1513V18-200BZC?
All CY7C1513V18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513V18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1513V18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1513V18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1513V18-200BZC Tags

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STMicroelectronics
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