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Cypress Semiconductor Corp CY7C1514AV18-167BZC

Part No.:
CY7C1514AV18-167BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514AV18-167BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,279

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Product details

Overview

CY7C1514AV18-167BZC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 1.8V core supply, and 1.4–1.8V I/O supply. It delivers 167 MHz maximum operating frequency, 2-word burst architecture, and dual DDR read/write ports for concurrent access. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1514AV18-167BZC datasheet, CY7C1514AV18-167BZC pinout, CY7C1514AV18-167BZC application, or CY7C1514AV18-167BZC equivalent, key selection factors include DLL-enabled 1.5-cycle read latency, HSTL-18-compatible 36-bit DDR data interface, 165-ball FBGA package compatibility, and JTAG 1149.1 test support.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports with separate address latching on alternating K/K clock edges. Its dual-clock domain (K/K for inputs, C/C for outputs) eliminates bus turnaround and enables true concurrent read/write operations at 167 MHz.

The device supports both DLL-on mode (1.5-cycle read latency, precise echo clock alignment via CQ/CQ) and DLL-off mode (1-cycle latency, QDR I timing). Output impedance is tunable via ZQ pin to match system trace impedance, and all I/Os comply with HSTL Class I specifications.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency167 MHz - defines maximum sustained transaction rate per port
Read Latency1.5 cycles (DLL enabled) or 1 cycle (DLL disabled) - determines pipeline depth and controller timing margin
Core Supply (VDD)1.8 V ± 0.1 V - powers internal logic and memory array; requires tight regulation
I/O Supply (VDDQ)1.4 V to 1.8 V - sets HSTL output drive strength and input threshold reference
Burst Length2 words per access - fixed burst delivers two 36-bit words per clock edge pair
Package165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count high-speed memory

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsLatched on rising edges of K/K; 36-bit parallel input path for burst writes
Q[35:0]Synchronous read data outputsDriven on rising edges of C/C; tristated automatically when RPS deasserted
RPS / WPSRead/Write port select (active LOW)Enables independent port activation; controls data register enable and address latch timing
BWS[3:0]Byte write selects (active LOW)Permits selective 9-bit byte updates within 36-bit word; avoids full-word read-modify-write
K / KPositive/negative input clocksEdge-aligned clocks for all synchronous inputs; rising edges capture addresses, data, and control
C / CPositive/negative output clocksDeskew-capable clocks for Q[35:0]; used with CQ/CQ for source-synchronous capture at controller
CQ / CQEcho clocks referenced to C/CFree-running copies of C/C; simplify timing closure by aligning data valid window at receiver
ZQOutput impedance calibration inputConnects to external resistor to ground to tune Q[35:0] and CQ/CQ output drive strength
DOFFDLL disable control (active LOW)Pulls low to force QDR I timing mode (1-cycle latency); must be pulled up for QDR II operation
TCK/TMS/TDI/TDOJTAG boundary scan interfaceIEEE 1149.1-compliant test access port for production testing and debug

Key Features

FeatureDesign Value
Separate read/write data pathsEliminates bus turnaround overhead and enables true concurrent access without arbitration logic
2-word burst architectureDelivers two 36-bit words per access cycle-reducing address strobe overhead and improving bandwidth efficiency
HSTL-18 I/O interfaceEnsures signal integrity at 334 MT/s (167 MHz DDR); compatible with industry-standard memory controllers
Programmable output driveVariable drive strength controlled via ZQ pin tuning-matches PCB trace impedance to minimize reflections
On-chip Delay Lock Loop (DLL)Aligns internal data paths to eliminate clock skew; enables 1.5-cycle latency and precise CQ/CQ generation

Applications

High-Speed Network Switch BufferingTelecom Line Card Packet Memory

Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switching ASICs.

IC Role / Device Role / Timing Role: Dedicated QDR II SRAM serving as dual-port packet buffer with zero contention between ingress write and egress read paths.

Use Value: Enables line-rate forwarding at 10 Gbps+ by sustaining 334 MT/s sustained throughput with deterministic 1.5-cycle read latency.

Use Scenario: Temporary storage of voice-over-IP (VoIP) packets and signaling messages in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: Burst-access memory supporting simultaneous VoIP stream buffering and control-plane message queuing.

Use Value: Reduces jitter and packet loss via deterministic latency and eliminates bus turnaround delays during mixed traffic bursts.

Baseband Processing in Wireless InfrastructureReal-Time Video Frame Buffering

Use Scenario: Intermediate storage of OFDM symbol data between FFT processing stages in LTE/5G baseband units.

IC Role / Device Role / Timing Role: High-throughput memory bridge between digital front-end and channel estimation blocks.

Use Value: Sustains 2×36-bit DDR transfers at 167 MHz to match symbol processing pipeline rates without stalling.

Use Scenario: Dual-port frame store for HD video scalers and chroma-key compositors in broadcast equipment.

IC Role / Device Role / Timing Role: Simultaneous write of incoming sensor frames and read of processed output frames at pixel clock rates.

Use Value: Prevents frame tearing and motion artifacts by decoupling capture and display timing domains with dedicated ports.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3616L10PFI36-bit QDR II+, 10 ns access, 250 MHz max, 1.5V core, different pinout and BWS mappingSupports higher frequency but lacks DOFF pin for QDR I fallback modeChoose when system requires >167 MHz operation and can accommodate revised layout and timing constraints
ISSI IS61WV102436B1024K × 36 sync SRAM, single-port, 167 MHz, 3.3V core, no DDR or echo clocksNo concurrent read/write; requires external arbitration and bus turnaround managementChoose only for cost-sensitive legacy designs where bandwidth < 167 MHz and latency tolerance > 3 cycles

Compared with IDT72T3616L10PFI and IS61WV102436B, CY7C1514AV18-167BZC uniquely balances 167 MHz QDR II performance with DLL flexibility, echo clock support for timing closure, and backward-compatible QDR I mode-making it optimal for upgrade paths in telecom and networking hardware.

Availability

CY7C1514AV18-167BZC is available at Aetrix Electronics and suitable for high-speed network switch buffering, telecom line card packet memory, and baseband processing applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1514AV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip.

CY7C1514AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, telecommunications, and high-end test equipment.

FAQ

What is the function of the DOFF pin on CY7C1514AV18-167BZC?

The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and relaxed timing margins. For standard QDR II operation at 167 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.

Can CY7C1514AV18-167BZC operate with only one clock pair instead of two?

Yes - it supports single-clock mode using only K/K for both input registration and output timing. In this mode, C/C are unused, and Q[35:0] are clocked directly by K/K. However, echo clocks (CQ/CQ) and deskew benefits are lost, and timing margins tighten due to increased clock-to-output skew.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin calibrates the output driver impedance of Q[35:0], CQ, and CQ to match the system data bus. Connecting ZQ to a precision resistor (typically 50 Ω) to ground sets output impedance to 10 Ω (0.2 × RQ), minimizing reflections and ensuring clean eye diagrams at 334 MT/s. Leaving ZQ unconnected or tied to GND violates specification and risks signal integrity failure.

Is CY7C1514AV18-167BZC pin-compatible with other QDR II devices in the same package?

No - while it shares the 165-ball FBGA footprint with CY7C1512AV18-167BZC, pin assignments differ significantly (e.g., BWS[3:0] vs. BWS[1:0], D/Q width, address bit count). Direct replacement requires PCB redesign. The CY7C1514AV18-167BZC is not pin-compatible with IDT or Micron QDR II offerings due to differing control pin allocations and echo clock routing.

CY7C1514AV18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1514AV18-167BZC FAQ

1.How can I place an order for CY7C1514AV18-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514AV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514AV18-167BZC reliable?

The price and inventory of CY7C1514AV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1514AV18-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-167BZC transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1514AV18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514AV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514AV18-167BZC?

For technical support, including CY7C1514AV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-167BZC requirements.

6.How does Aetrix verify that CY7C1514AV18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1514AV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1514AV18-167BZC?

All CY7C1514AV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514AV18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1514AV18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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