Cypress Semiconductor Corp CY7C1514AV18-167BZC
- Part No.:
- CY7C1514AV18-167BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514AV18-167BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1514AV18-167BZC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 1.8V core supply, and 1.4–1.8V I/O supply. It delivers 167 MHz maximum operating frequency, 2-word burst architecture, and dual DDR read/write ports for concurrent access. Used in high-bandwidth packet buffering for network switches and routers.
For engineers reviewing the CY7C1514AV18-167BZC datasheet, CY7C1514AV18-167BZC pinout, CY7C1514AV18-167BZC application, or CY7C1514AV18-167BZC equivalent, key selection factors include DLL-enabled 1.5-cycle read latency, HSTL-18-compatible 36-bit DDR data interface, 165-ball FBGA package compatibility, and JTAG 1149.1 test support.
Technical Context
This QDR II SRAM implements fully independent synchronous read and write ports with separate address latching on alternating K/K clock edges. Its dual-clock domain (K/K for inputs, C/C for outputs) eliminates bus turnaround and enables true concurrent read/write operations at 167 MHz.
The device supports both DLL-on mode (1.5-cycle read latency, precise echo clock alignment via CQ/CQ) and DLL-off mode (1-cycle latency, QDR I timing). Output impedance is tunable via ZQ pin to match system trace impedance, and all I/Os comply with HSTL Class I specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 167 MHz - defines maximum sustained transaction rate per port |
| Read Latency | 1.5 cycles (DLL enabled) or 1 cycle (DLL disabled) - determines pipeline depth and controller timing margin |
| Core Supply (VDD) | 1.8 V ± 0.1 V - powers internal logic and memory array; requires tight regulation |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - sets HSTL output drive strength and input threshold reference |
| Burst Length | 2 words per access - fixed burst delivers two 36-bit words per clock edge pair |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count high-speed memory |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; 36-bit parallel input path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tristated automatically when RPS deasserted |
| RPS / WPS | Read/Write port select (active LOW) | Enables independent port activation; controls data register enable and address latch timing |
| BWS[3:0] | Byte write selects (active LOW) | Permits selective 9-bit byte updates within 36-bit word; avoids full-word read-modify-write |
| K / K | Positive/negative input clocks | Edge-aligned clocks for all synchronous inputs; rising edges capture addresses, data, and control |
| C / C | Positive/negative output clocks | Deskew-capable clocks for Q[35:0]; used with CQ/CQ for source-synchronous capture at controller |
| CQ / CQ | Echo clocks referenced to C/C | Free-running copies of C/C; simplify timing closure by aligning data valid window at receiver |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[35:0] and CQ/CQ output drive strength |
| DOFF | DLL disable control (active LOW) | Pulls low to force QDR I timing mode (1-cycle latency); must be pulled up for QDR II operation |
| TCK/TMS/TDI/TDO | JTAG boundary scan interface | IEEE 1149.1-compliant test access port for production testing and debug |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead and enables true concurrent access without arbitration logic |
| 2-word burst architecture | Delivers two 36-bit words per access cycle-reducing address strobe overhead and improving bandwidth efficiency |
| HSTL-18 I/O interface | Ensures signal integrity at 334 MT/s (167 MHz DDR); compatible with industry-standard memory controllers |
| Programmable output drive | Variable drive strength controlled via ZQ pin tuning-matches PCB trace impedance to minimize reflections |
| On-chip Delay Lock Loop (DLL) | Aligns internal data paths to eliminate clock skew; enables 1.5-cycle latency and precise CQ/CQ generation |
Applications
| High-Speed Network Switch Buffering | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switching ASICs. IC Role / Device Role / Timing Role: Dedicated QDR II SRAM serving as dual-port packet buffer with zero contention between ingress write and egress read paths. Use Value: Enables line-rate forwarding at 10 Gbps+ by sustaining 334 MT/s sustained throughput with deterministic 1.5-cycle read latency. | Use Scenario: Temporary storage of voice-over-IP (VoIP) packets and signaling messages in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Burst-access memory supporting simultaneous VoIP stream buffering and control-plane message queuing. Use Value: Reduces jitter and packet loss via deterministic latency and eliminates bus turnaround delays during mixed traffic bursts. |
| Baseband Processing in Wireless Infrastructure | Real-Time Video Frame Buffering |
Use Scenario: Intermediate storage of OFDM symbol data between FFT processing stages in LTE/5G baseband units. IC Role / Device Role / Timing Role: High-throughput memory bridge between digital front-end and channel estimation blocks. Use Value: Sustains 2×36-bit DDR transfers at 167 MHz to match symbol processing pipeline rates without stalling. | Use Scenario: Dual-port frame store for HD video scalers and chroma-key compositors in broadcast equipment. IC Role / Device Role / Timing Role: Simultaneous write of incoming sensor frames and read of processed output frames at pixel clock rates. Use Value: Prevents frame tearing and motion artifacts by decoupling capture and display timing domains with dedicated ports. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3616L10PFI | 36-bit QDR II+, 10 ns access, 250 MHz max, 1.5V core, different pinout and BWS mapping | Supports higher frequency but lacks DOFF pin for QDR I fallback mode | Choose when system requires >167 MHz operation and can accommodate revised layout and timing constraints |
| ISSI IS61WV102436B | 1024K × 36 sync SRAM, single-port, 167 MHz, 3.3V core, no DDR or echo clocks | No concurrent read/write; requires external arbitration and bus turnaround management | Choose only for cost-sensitive legacy designs where bandwidth < 167 MHz and latency tolerance > 3 cycles |
Compared with IDT72T3616L10PFI and IS61WV102436B, CY7C1514AV18-167BZC uniquely balances 167 MHz QDR II performance with DLL flexibility, echo clock support for timing closure, and backward-compatible QDR I mode-making it optimal for upgrade paths in telecom and networking hardware.
Availability
CY7C1514AV18-167BZC is available at Aetrix Electronics and suitable for high-speed network switch buffering, telecom line card packet memory, and baseband processing applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1514AV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip.
CY7C1514AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, telecommunications, and high-end test equipment.
FAQ
What is the function of the DOFF pin on CY7C1514AV18-167BZC?
The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and relaxed timing margins. For standard QDR II operation at 167 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
Can CY7C1514AV18-167BZC operate with only one clock pair instead of two?
Yes - it supports single-clock mode using only K/K for both input registration and output timing. In this mode, C/C are unused, and Q[35:0] are clocked directly by K/K. However, echo clocks (CQ/CQ) and deskew benefits are lost, and timing margins tighten due to increased clock-to-output skew.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin calibrates the output driver impedance of Q[35:0], CQ, and CQ to match the system data bus. Connecting ZQ to a precision resistor (typically 50 Ω) to ground sets output impedance to 10 Ω (0.2 × RQ), minimizing reflections and ensuring clean eye diagrams at 334 MT/s. Leaving ZQ unconnected or tied to GND violates specification and risks signal integrity failure.
Is CY7C1514AV18-167BZC pin-compatible with other QDR II devices in the same package?
No - while it shares the 165-ball FBGA footprint with CY7C1512AV18-167BZC, pin assignments differ significantly (e.g., BWS[3:0] vs. BWS[1:0], D/Q width, address bit count). Direct replacement requires PCB redesign. The CY7C1514AV18-167BZC is not pin-compatible with IDT or Micron QDR II offerings due to differing control pin allocations and echo clock routing.
CY7C1514AV18-167BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514AV18-167BZC FAQ
1.How can I place an order for CY7C1514AV18-167BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514AV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514AV18-167BZC reliable?
The price and inventory of CY7C1514AV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-167BZC is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-167BZC transactions.
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Once your CY7C1514AV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514AV18-167BZC?
For technical support, including CY7C1514AV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-167BZC requirements.
6.How does Aetrix verify that CY7C1514AV18-167BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1514AV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-167BZC meets industry standards.
7.What is the process for return or replacement of CY7C1514AV18-167BZC?
All CY7C1514AV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-167BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514AV18-167BZC part is unused and in its original packaging.
Return procedure for CY7C1514AV18-167BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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