Cypress Semiconductor Corp CY7C1514AV18-200BZC
- Part No.:
- CY7C1514AV18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514AV18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:161
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Product details
Overview
CY7C1514AV18-200BZC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 1.8V core supply, and 200 MHz maximum operating frequency. It features dual independent read/write ports, DDR interfaces on both ports (400 Mbps effective data rate per port), 1.5-cycle read latency with DLL enabled, and HSTL-compatible I/Os for high-speed networking memory buffers.
For engineers reviewing the CY7C1514AV18-200BZC datasheet, CY7C1514AV18-200BZC pinout, CY7C1514AV18-200BZC application, or CY7C1514AV18-200BZC equivalent, key selection criteria include burst depth (2-word), byte write select granularity (four 9-bit bytes), echo clock support (CQ/CQ), JTAG 1149.1 test access, and FBGA-165 package compatibility with high-density PCB routing.
Technical Context
The CY7C1514AV18-200BZC implements QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its synchronous pipelined design uses rising edges of K/K clocks for address/data capture and C/C clocks for output timing, enabling concurrent read and write operations without arbitration delay.
It supports DLL-enabled operation for precise 1.5-cycle read latency at 200 MHz, or DLL-off QDR I mode with 1-cycle latency up to 167 MHz. Output impedance is tunable via ZQ pin (0.2×RQ), and all I/Os comply with HSTL Class I specifications with VDDQ = 1.4–1.8 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36) |
| Max Clock Frequency | 200 MHz - defines maximum sustained transaction rate for both ports |
| Read Latency | 1.5 cycles (DLL on) - determines minimum time from RPS assertion to first valid Q[35:0] word |
| Core Supply Voltage | 1.8 V ±0.1 V - powers internal logic and array; requires tight regulation |
| I/O Supply Voltage | VDDQ = 1.4–1.8 V - sets HSTL output drive strength and input threshold reference |
| Burst Length | 2-word - delivers two sequential 36-bit words per access, optimizing bandwidth efficiency |
| Byte Write Select | BWS[3:0] - enables independent 9-bit byte masking during writes, preserving unselected data |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; supports full 36-bit or byte-masked writes via BWS[3:0] |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tristated automatically when RPS is deasserted |
| A[19:0] | Multiplexed address bus | Latched alternately on K (read) and K (write) rising edges; 20 bits address entire 2M-depth array |
| RPS / WPS | Port enable controls | Active-low synchronous selects initiating read or write transactions on respective ports |
| C / C, K / K | Differential clock inputs | Four dedicated clocks: K/K for input timing, C/C for output timing-enables skew management |
| CQ / CQ | Echo clocks | Free-running outputs synchronized to C/C; simplify high-speed data capture at controller side |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune Q[35:0] and CQ/CQ output drive to match board trace impedance |
| DOFF | DLL disable control | Low = disables DLL, forces QDR I timing (1-cycle latency, ≤167 MHz); high = enables QDR II mode |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround delays and contention-enables true concurrent access in packet buffering |
| DDR Interfaces on Both Ports | Doubles effective data throughput per clock cycle without increasing clock frequency |
| Programmable Output Drive Strength | HSTL Class I outputs with ZQ-calibrated impedance matching reduce signal integrity issues on long traces |
| JTAG 1149.1 Test Access Port | Enables boundary-scan testing and in-system diagnostics without additional test fixtures |
| Variable Byte Write Select | BWS[3:0] allows partial 36-bit writes (9-bit granularity), reducing unnecessary read-modify-write cycles |
Applications
| High-Speed Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switch fabric ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO buffer with zero-wait-state concurrent read/write. Use Value: 200 MHz clock + 2-word burst delivers 14.4 Gbps aggregate bandwidth-meets 10G/40G line-rate buffering requirements. | Use Scenario: Frame assembly/disassembly in SONET/SDH OC-192 line interface units. IC Role / Device Role / Timing Role: QDR II memory serving as elastic store between framer and backplane interface. Use Value: 1.5-cycle read latency and echo clocks (CQ/CQ) enable deterministic timing alignment across multi-device memory banks. |
| Baseband Processing in Wireless Infrastructure | High-Performance Test Equipment Memory |
Use Scenario: Real-time channel estimation and FFT buffer in LTE eNodeB baseband processors. IC Role / Device Role / Timing Role: Low-latency shared memory between DSP cores and RF front-end controllers. Use Value: DLL-off mode (1-cycle latency at 167 MHz) provides predictable timing for time-critical signal processing loops. | Use Scenario: Pattern generation and response capture in automated test systems for ASIC validation. IC Role / Device Role / Timing Role: High-bandwidth memory staging data between pattern generator and comparator logic. Use Value: Full data coherency and synchronous self-timed writes ensure bit-accurate stimulus/response correlation at 400 Mbps per port. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit, 200 MHz, 72-Mbit QDR II+ with enhanced DLL stability and lower IDD | Supports higher temperature range (−40°C to +105°C) and tighter tAC spec (1.2 ns vs. 1.3 ns) | Preferred for extended-temperature telecom deployments requiring improved thermal margin |
| ISSI IS61WV102436B | 36-bit, 166 MHz, 72-Mbit QDR II with identical pinout but no echo clocks or ZQ calibration | Lacks CQ/CQ and ZQ pins-requires external termination and manual timing margining | Lower-cost option where echo clock simplification and impedance tuning are not required |
Compared with IDT72T3615L10BG and ISSI IS61WV102436B, the CY7C1514AV18-200BZC offers native echo clock support and ZQ-based output tuning-critical for robust 200 MHz system-level timing closure-while maintaining full functional equivalence in burst depth, port independence, and byte write capability.
Availability
CY7C1514AV18-200BZC is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom line card memory, and baseband processing applications requiring stable component supply and long-term production continuity.
Supply support for CY7C1514AV18-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
The QDR II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking ASICs and FPGA-based infrastructure-optimized for deterministic timing, concurrent access, and signal integrity at >200 MHz.
FAQ
What is the function of the DOFF pin on CY7C1514AV18-200BZC?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For standard QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
How does the ZQ pin affect output drive strength?
The ZQ pin connects to an external resistor (RQ) tied to ground to calibrate output driver impedance. The device sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ. If ZQ is tied directly to VDDQ, minimum impedance mode is enabled. Connecting ZQ to GND or leaving it floating violates the specification and may cause signal integrity failures.
Can CY7C1514AV18-200BZC operate with only one clock pair?
Yes-it supports single-clock mode using only K and K to control both input and output registers. In this configuration, C and C are unused, and data is clocked out on K/K edges. However, echo clocks (CQ/CQ) and deskew benefits are lost, and timing margins tighten due to lack of dedicated output clock path.
What is the purpose of BWS[3:0] in CY7C1514AV18-200BZC?
BWS[3:0] are active-low byte write select signals controlling four independent 9-bit segments of the 36-bit data bus. Each asserted BWS[x] enables writing to its corresponding 9-bit byte; deassertion preserves existing data in that byte. This enables efficient partial writes without requiring read-modify-write sequences.
CY7C1514AV18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514AV18-200BZC FAQ
1.How can I place an order for CY7C1514AV18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514AV18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514AV18-200BZC reliable?
The price and inventory of CY7C1514AV18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1514AV18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1514AV18-200BZC?
CY7C1514AV18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514AV18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514AV18-200BZC?
For technical support, including CY7C1514AV18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-200BZC requirements.
6.How does Aetrix verify that CY7C1514AV18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1514AV18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1514AV18-200BZC?
All CY7C1514AV18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514AV18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1514AV18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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