Cypress Semiconductor Corp CY7C1514AV18-200BZI
- Part No.:
- CY7C1514AV18-200BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514AV18-200BZI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1514AV18-200BZI from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 200 MHz maximum operating frequency, 1.8 V core supply (VDD), and 1.4–1.8 V I/O supply (VDDQ), deployed in high-bandwidth networking packet buffers and switch fabric memory subsystems.
For engineers reviewing the CY7C1514AV18-200BZI datasheet, CY7C1514AV18-200BZI pinout, CY7C1514AV18-200BZI application, or CY7C1514AV18-200BZI equivalent, key selection criteria include DDR read/write ports, 1.5-cycle DLL-enabled read latency, echo clock (CQ/CQ) support for timing deskew, and HSTL-18-compatible variable-drive outputs.
Technical Context
This device implements true dual-port synchronous pipelined architecture with physically separate read and write data paths-no bus turnaround required. It uses independent K/K input clocks for address/data capture and C/C output clocks for data launch, enabling concurrent read and write operations at 200 MHz (400 MT/s per port).
The integrated Delay Lock Loop (DLL) aligns internal timing to achieve precise 1.5-cycle read latency; when disabled via DOFF pin, it reverts to QDR I mode with 1-cycle latency and reduced max frequency (167 MHz). All I/Os comply with HSTL Class I specifications and support impedance tuning via ZQ pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 200 MHz - supports 400 MT/s effective throughput per port |
| Read Latency | 1.5 cycles (DLL enabled); 1 cycle (DLL disabled via DOFF) |
| VDD / VDDQ | 1.8 V ±0.1 V core; 1.4–1.8 V I/O - enables low-power, noise-resilient signaling |
| Burst Length | 2-word burst - delivers two 36-bit words per access, optimizing bandwidth efficiency |
| Output Interface | HSTL-18 Class I with variable drive strength - ensures signal integrity on high-speed PCB traces |
| Timing Reference | Dual echo clocks CQ/CQ synchronized to C/C - simplifies controller-side data capture alignment |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; supports byte-write via BWS[3:0] for partial-word updates |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tristated automatically when RPS deasserted |
| RPS / WPS | Active-low port select controls | Enable independent read/write initiation without shared control arbitration |
| BWS[3:0] | Byte write select inputs | Each selects one 9-bit byte within 36-bit word; enables non-destructive partial writes |
| C / C, K / K | Differential clock inputs | K/K drive all synchronous inputs; C/C time-stamp read outputs to minimize skew |
| CQ / CQ | Free-running echo clocks | Phase-aligned to C/C; used by controller to sample Q[35:0] with deterministic setup/hold |
| ZQ | Impedance calibration reference | Connects to external resistor to ground to tune output driver impedance to 0.2 × RQ |
| DOFF | DLL disable control | Pull LOW to disable DLL and operate in QDR I mode (1-cycle latency, ≤167 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Separate Read/Write Ports | Eliminates bus turnaround overhead and contention-enables full-duplex memory access |
| DDR Interfaces on Both Ports | Doubles effective data rate per clock edge: 200 MHz clock → 400 MT/s per port |
| Integrated Delay Lock Loop (DLL) | Enables 1.5-cycle read latency with sub-nanosecond timing accuracy across voltage/temperature |
| HSTL-18 Output Drivers | Variable drive strength and ZQ-calibrated impedance ensure clean 400 MT/s signaling on FR4 backplanes |
| JTAG 1149.1 Test Access Port | Supports boundary-scan testing and in-system diagnostics without additional test logic |
Applications
| Packet Buffer Memory | Switch Fabric Lookup Table |
|---|---|
Use Scenario: High-speed Ethernet line cards buffering ingress/egress packets at 10/40/100 GbE rates. IC Role / Device Role / Timing Role: Dual-port SRAM serving as temporary storage for variable-length packets with zero-turnaround concurrent read/write. Use Value: 72-Mbit capacity and 400 MT/s per port sustain >80 Gbps aggregate throughput under real-time traffic load. | Use Scenario: Layer-2/Layer-3 forwarding engines performing parallel CAM/SRAM lookups in multi-stage switches. IC Role / Device Role / Timing Role: QDR II SRAM storing next-hop and VLAN tables accessed simultaneously by lookup and update pipelines. Use Value: Independent read/write ports enable concurrent table read (for forwarding decision) and write (for aging/updates) without arbitration delay. |
| Network Processor Data Cache | Baseband Digital Front-End Buffer |
Use Scenario: Offloading packet classification, encryption, and deep-packet inspection in programmable NPU subsystems. IC Role / Device Role / Timing Role: Low-latency scratchpad memory interfaced directly to NPU's internal bus with DLL-aligned timing. Use Value: 1.5-cycle DLL-enabled read latency reduces pipeline stalls, improving instruction throughput by up to 18% vs. QDR I. | Use Scenario: LTE/5G remote radio units buffering IQ samples between ADC/DAC and FPGA-based digital processing blocks. IC Role / Device Role / Timing Role: Burst-mode SRAM absorbing variable-rate sampling bursts while feeding fixed-rate DSP pipelines. Use Value: 2-word burst architecture matches typical FFT/FFT-size data chunks, minimizing bus idle cycles and memory controller overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit (1M × 36), 100 MHz max, LVDS interface, no DLL, 2.5 V VDDQ | Lower density and bandwidth; suited for legacy telecom systems with relaxed timing margins | Select only if system clock <125 MHz and LVDS signaling is mandatory |
| ISSI IS61WV102436B | 36-Mbit (1M × 36), asynchronous interface, 15 ns access, 3.3 V only, no DDR or echo clocks | Non-pipelined, no concurrent access-requires external arbitration and wait states | Choose only for cost-sensitive, low-speed control-plane memory where timing predictability outweighs bandwidth |
Compared with IDT72T3615L10BG and IS61WV102436B, CY7C1514AV18-200BZI delivers double the density and bandwidth, DLL-controlled sub-cycle timing, and echo-clock–assisted data capture-making it uniquely suitable for modern packet-processing ASIC/FPGA interfaces requiring deterministic 400 MT/s throughput.
Availability
CY7C1514AV18-200BZI is available at Aetrix Electronics and suitable for network switch fabric design, high-end packet buffer implementation, and FPGA-based baseband processing requiring stable component supply across extended production lifecycles.
Supply support for CY7C1514AV18-200BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems.
CY7C1514AV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switching infrastructure and high-speed digital signal processing subsystems.
FAQ
What is the function of the DOFF pin on CY7C1514AV18-200BZI?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. For standard QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
How does the ZQ pin affect output driver performance?
The ZQ pin enables on-die impedance calibration for Q[35:0] and CQ/CQ outputs. When connected to a precision resistor (RQ) to ground, the device tunes its output drivers to 0.2 × RQ, matching typical 50 Ω transmission lines. If tied directly to VDDQ, it enters minimum-impedance mode-useful for short-trace, low-noise environments but not recommended for long backplane runs.
Can CY7C1514AV18-200BZI operate with only a single clock pair?
Yes-it supports single-clock mode using only K/K to drive both input registers and output registers (replacing C/C). In this mode, data is launched on K/K edges, eliminating need for separate output clocks. However, echo clocks (CQ/CQ) remain functional and aligned to K/K, preserving timing deskew capability for controller-side capture.
What is the purpose of BWS[3:0] in a 36-bit configuration?
BWS[3:0] are four independent active-low byte write select signals, each controlling a 9-bit segment of the 36-bit D[35:0] bus. BWS0 governs D[8:0], BWS1 covers D[17:9], BWS2 handles D[26:18], and BWS3 manages D[35:27]. This allows partial-word writes without read-modify-write cycles-critical for updating metadata fields or protocol headers in packet buffers.
CY7C1514AV18-200BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514AV18-200BZI FAQ
1.How can I place an order for CY7C1514AV18-200BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514AV18-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514AV18-200BZI reliable?
The price and inventory of CY7C1514AV18-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-200BZI is usually 5 days.
3.What payment methods are accepted for CY7C1514AV18-200BZI?
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CY7C1514AV18-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514AV18-200BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514AV18-200BZI?
For technical support, including CY7C1514AV18-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-200BZI requirements.
6.How does Aetrix verify that CY7C1514AV18-200BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1514AV18-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-200BZI meets industry standards.
7.What is the process for return or replacement of CY7C1514AV18-200BZI?
All CY7C1514AV18-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-200BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514AV18-200BZI part is unused and in its original packaging.
Return procedure for CY7C1514AV18-200BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1514AV18-200BZI Tags

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