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Cypress Semiconductor Corp CY7C1514AV18-200BZXI

Part No.:
CY7C1514AV18-200BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514AV18-200BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:108

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Product details

Overview

CY7C1514AV18-200BZXI from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 1.8V core supply, and 200 MHz operation (500 MT/s DDR interface). It features dual independent read/write ports, 1.5-cycle read latency with DLL enabled, and echo clocks (CQ/CQ) for high-speed data capture in networking buffers and packet processors.

For engineers reviewing the CY7C1514AV18-200BZXI datasheet, CY7C1514AV18-200BZXI pinout, CY7C1514AV18-200BZXI application, or CY7C1514AV18-200BZXI equivalent, key selection factors include x36 bus width, 165-ball FBGA package, HSTL I/O compatibility, DLL-controlled timing, and depth expansion via RPS/WPS port selects.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined burst architecture with physically separate read and write data paths-eliminating bus turnaround overhead. It uses two independent clock domains: K/K for address/control/data input registration and C/C for output data timing, with CQ/CQ echo clocks aligned to C/C for precise source-synchronous capture.

The device supports both DLL-on mode (1.5-cycle read latency, up to 250 MHz) and DLL-off mode (1-cycle latency, QDR I timing, max 167 MHz), selected via DOFF pin. Internal organization comprises two 1M × 36 arrays, accessed via 20-bit multiplexed address bus with port-select–gated read/write arbitration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36)
Max Clock Frequency200 MHz (K/K input clocks); enables 500 MT/s effective data rate
Read Latency1.5 cycles with DLL enabled; supports deterministic timing closure in high-speed switch fabric
Core Supply (VDD)1.8 V ±0.1 V - defines internal logic voltage and power integrity requirements
I/O Supply (VDDQ)1.4 V to 1.8 V - sets HSTL Class I output drive strength and termination reference
Package165-ball FBGA (15 × 17 × 1.4 mm) - matches standard BGA routing pitch for dense PCB layouts
Interface StandardHSTL Class I inputs/outputs - ensures signal integrity at 500 MT/s with controlled impedance traces

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, 1.0 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsLatched on rising edges of K/K; supports full 36-bit parallel writes per burst
Q[35:0]Synchronous read data outputsDriven on rising edges of C/C; tristated automatically when RPS deasserted
RPS / WPSRead/Write Port Select (active LOW)Enables independent arbitration of read vs. write operations without shared control logic
BWS[3:0]Byte Write Selects (active LOW)Permits selective 9-bit byte updates within 36-bit word-critical for header modification in packet memory
C / C, CQ / CQOutput clocks & echo clocksEnable source-synchronous capture at controller; CQ/CQ track C/C skew for >200 MHz system timing
DOFFDLL disable controlPull LOW to enter QDR I mode (1-cycle latency, ≤167 MHz); pull HIGH for QDR II timing
ZQImpedance calibration inputConnects to external 240 Ω resistor to ground to tune Q[35:0] and CQ/CQ output drive to 48 Ω

Key Features

FeatureDesign Value
Dual independent read/write portsEliminates bus turnaround delay-enables concurrent 500 MT/s read+write in packet buffering applications
2-word burst architectureDelivers two sequential 36-bit words per access cycle-optimized for 72-bit wide data paths in switch ASIC interfaces
Delay Lock Loop (DLL)Aligns internal timing to achieve 1.5-cycle read latency at 200 MHz-reduces setup/hold margin requirements
HSTL Class I I/O with ZQ calibrationEnsures consistent 48 Ω output impedance across voltage/temperature-minimizes reflection-induced jitter at 500 MT/s
JTAG 1149.1 test access portSupports boundary-scan testing of interconnects in high-density FPGA-SRAM subsystems

Applications

Network Packet BufferingSwitch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to switch fabric ASICs via x36 HSTL buses.

Use Value: Concurrent read/write capability eliminates arbitration stalls; 500 MT/s bandwidth sustains 40 Gbps+ switching capacity.

Use Scenario: Acting as distributed lookup table and queue memory in modular chassis-based routers.

IC Role / Device Role / Timing Role: Depth-expanded memory bank using RPS/WPS signals to coordinate multi-device access across backplane lanes.

Use Value: Echo clocks (CQ/CQ) enable deterministic trace-length matching across 16+ devices-reducing timing skew to <100 ps.

Telecom Line Card MemoryHigh-Speed Test Equipment Buffer

Use Scenario: Holding real-time protocol state and statistics in CPRI/eCPRI fronthaul processing units.

IC Role / Device Role / Timing Role: Burst-mode SRAM providing synchronized access to time-critical control structures for FPGA-based PHY layers.

Use Value: DLL-off mode (QDR I) allows graceful fallback to 167 MHz with 1-cycle latency during thermal derating-preserving determinism.

Use Scenario: Capturing high-fidelity digital waveforms in automated test systems with >200 MS/s sampling rates.

IC Role / Device Role / Timing Role: Deep buffer memory interfaced to high-speed ADC/DAC controllers using source-synchronous C/C clocking.

Use Value: ZQ-calibrated HSTL outputs maintain signal integrity over 15 cm FR4 traces-enabling >500 MT/s reliable capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG36-bit, 2M × 36, 10 ns access, 1.8V core, but uses SSTL-2 I/O not HSTLRequires different termination scheme and lacks echo clocks (CQ/CQ)Prefer CY7C1514AV18-200BZXI where source-synchronous capture and HSTL compatibility are required
ISSI IS61WV204836BLL-200BLI2M × 36, 200 MHz, but asynchronous SRAM with no DLL or burst controlNo QDR architecture-lacks concurrent read/write and echo clock supportSelect CY7C1514AV18-200BZXI for systems needing deterministic 500 MT/s throughput and pipelined latency

Compared with IDT72T3615L10BG and IS61WV204836BLL-200BLI, the CY7C1514AV18-200BZXI uniquely delivers HSTL-compatible source-synchronous timing with CQ/CQ echo clocks, enabling tighter timing margins in 200 MHz+ switch fabric designs.

Availability

CY7C1514AV18-200BZXI is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C1514AV18-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The QDR® II SRAM product line was designed specifically for high-bandwidth, low-latency data buffering in networking and telecommunications infrastructure-emphasizing concurrent access, source-synchronous timing, and robust signal integrity at multi-Gbps rates.

FAQ

What is the function of the DOFF pin on CY7C1514AV18-200BZXI?

The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For standard QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.

How does the ZQ pin affect output impedance calibration?

The ZQ pin connects to an external 240 Ω resistor to ground, enabling on-die calibration of Q[35:0] and CQ/CQ output drivers to match 48 Ω (0.2 × 240 Ω). This ensures consistent HSTL Class I drive strength across voltage and temperature variations. Connecting ZQ directly to VDDQ forces minimum impedance mode; leaving it unconnected or tied to GND violates specification and may cause signal integrity failure.

Can CY7C1514AV18-200BZXI operate with only one clock pair instead of two?

Yes-it supports single-clock mode using only K/K for both input registration and output timing (Q[35:0] driven on K/K edges). In this mode, C/C and CQ/CQ are unused. However, this sacrifices deskew capability and limits maximum frequency due to increased clock-to-out variation; dual-clock mode with C/C remains recommended for 200 MHz operation and timing closure.

What is the purpose of BWS[3:0] in x36 configuration?

BWS[3:0] are active-LOW byte write select signals that gate 9-bit segments of the 36-bit write data bus: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Asserting only selected BWS lines allows partial-word writes-essential for modifying packet headers without disturbing payload data in networking applications.

CY7C1514AV18-200BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1514AV18-200BZXI FAQ

1.How can I place an order for CY7C1514AV18-200BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514AV18-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514AV18-200BZXI reliable?

The price and inventory of CY7C1514AV18-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-200BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1514AV18-200BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-200BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1514AV18-200BZXI?

CY7C1514AV18-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514AV18-200BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514AV18-200BZXI?

For technical support, including CY7C1514AV18-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-200BZXI requirements.

6.How does Aetrix verify that CY7C1514AV18-200BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1514AV18-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-200BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1514AV18-200BZXI?

All CY7C1514AV18-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-200BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514AV18-200BZXI part is unused and in its original packaging.

Return procedure for CY7C1514AV18-200BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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