Cypress Semiconductor Corp CY7C1514AV18-200BZXI
- Part No.:
- CY7C1514AV18-200BZXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514AV18-200BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:108
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Product details
Overview
CY7C1514AV18-200BZXI from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 1.8V core supply, and 200 MHz operation (500 MT/s DDR interface). It features dual independent read/write ports, 1.5-cycle read latency with DLL enabled, and echo clocks (CQ/CQ) for high-speed data capture in networking buffers and packet processors.
For engineers reviewing the CY7C1514AV18-200BZXI datasheet, CY7C1514AV18-200BZXI pinout, CY7C1514AV18-200BZXI application, or CY7C1514AV18-200BZXI equivalent, key selection factors include x36 bus width, 165-ball FBGA package, HSTL I/O compatibility, DLL-controlled timing, and depth expansion via RPS/WPS port selects.
Technical Context
This QDR II SRAM implements fully synchronous, pipelined burst architecture with physically separate read and write data paths-eliminating bus turnaround overhead. It uses two independent clock domains: K/K for address/control/data input registration and C/C for output data timing, with CQ/CQ echo clocks aligned to C/C for precise source-synchronous capture.
The device supports both DLL-on mode (1.5-cycle read latency, up to 250 MHz) and DLL-off mode (1-cycle latency, QDR I timing, max 167 MHz), selected via DOFF pin. Internal organization comprises two 1M × 36 arrays, accessed via 20-bit multiplexed address bus with port-select–gated read/write arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36) |
| Max Clock Frequency | 200 MHz (K/K input clocks); enables 500 MT/s effective data rate |
| Read Latency | 1.5 cycles with DLL enabled; supports deterministic timing closure in high-speed switch fabric |
| Core Supply (VDD) | 1.8 V ±0.1 V - defines internal logic voltage and power integrity requirements |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - sets HSTL Class I output drive strength and termination reference |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - matches standard BGA routing pitch for dense PCB layouts |
| Interface Standard | HSTL Class I inputs/outputs - ensures signal integrity at 500 MT/s with controlled impedance traces |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, 1.0 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; supports full 36-bit parallel writes per burst |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tristated automatically when RPS deasserted |
| RPS / WPS | Read/Write Port Select (active LOW) | Enables independent arbitration of read vs. write operations without shared control logic |
| BWS[3:0] | Byte Write Selects (active LOW) | Permits selective 9-bit byte updates within 36-bit word-critical for header modification in packet memory |
| C / C, CQ / CQ | Output clocks & echo clocks | Enable source-synchronous capture at controller; CQ/CQ track C/C skew for >200 MHz system timing |
| DOFF | DLL disable control | Pull LOW to enter QDR I mode (1-cycle latency, ≤167 MHz); pull HIGH for QDR II timing |
| ZQ | Impedance calibration input | Connects to external 240 Ω resistor to ground to tune Q[35:0] and CQ/CQ output drive to 48 Ω |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent read/write ports | Eliminates bus turnaround delay-enables concurrent 500 MT/s read+write in packet buffering applications |
| 2-word burst architecture | Delivers two sequential 36-bit words per access cycle-optimized for 72-bit wide data paths in switch ASIC interfaces |
| Delay Lock Loop (DLL) | Aligns internal timing to achieve 1.5-cycle read latency at 200 MHz-reduces setup/hold margin requirements |
| HSTL Class I I/O with ZQ calibration | Ensures consistent 48 Ω output impedance across voltage/temperature-minimizes reflection-induced jitter at 500 MT/s |
| JTAG 1149.1 test access port | Supports boundary-scan testing of interconnects in high-density FPGA-SRAM subsystems |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to switch fabric ASICs via x36 HSTL buses. Use Value: Concurrent read/write capability eliminates arbitration stalls; 500 MT/s bandwidth sustains 40 Gbps+ switching capacity. | Use Scenario: Acting as distributed lookup table and queue memory in modular chassis-based routers. IC Role / Device Role / Timing Role: Depth-expanded memory bank using RPS/WPS signals to coordinate multi-device access across backplane lanes. Use Value: Echo clocks (CQ/CQ) enable deterministic trace-length matching across 16+ devices-reducing timing skew to <100 ps. |
| Telecom Line Card Memory | High-Speed Test Equipment Buffer |
Use Scenario: Holding real-time protocol state and statistics in CPRI/eCPRI fronthaul processing units. IC Role / Device Role / Timing Role: Burst-mode SRAM providing synchronized access to time-critical control structures for FPGA-based PHY layers. Use Value: DLL-off mode (QDR I) allows graceful fallback to 167 MHz with 1-cycle latency during thermal derating-preserving determinism. | Use Scenario: Capturing high-fidelity digital waveforms in automated test systems with >200 MS/s sampling rates. IC Role / Device Role / Timing Role: Deep buffer memory interfaced to high-speed ADC/DAC controllers using source-synchronous C/C clocking. Use Value: ZQ-calibrated HSTL outputs maintain signal integrity over 15 cm FR4 traces-enabling >500 MT/s reliable capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit, 2M × 36, 10 ns access, 1.8V core, but uses SSTL-2 I/O not HSTL | Requires different termination scheme and lacks echo clocks (CQ/CQ) | Prefer CY7C1514AV18-200BZXI where source-synchronous capture and HSTL compatibility are required |
| ISSI IS61WV204836BLL-200BLI | 2M × 36, 200 MHz, but asynchronous SRAM with no DLL or burst control | No QDR architecture-lacks concurrent read/write and echo clock support | Select CY7C1514AV18-200BZXI for systems needing deterministic 500 MT/s throughput and pipelined latency |
Compared with IDT72T3615L10BG and IS61WV204836BLL-200BLI, the CY7C1514AV18-200BZXI uniquely delivers HSTL-compatible source-synchronous timing with CQ/CQ echo clocks, enabling tighter timing margins in 200 MHz+ switch fabric designs.
Availability
CY7C1514AV18-200BZXI is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card memory requiring stable component supply and long-term industrial availability.
Supply support for CY7C1514AV18-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The QDR® II SRAM product line was designed specifically for high-bandwidth, low-latency data buffering in networking and telecommunications infrastructure-emphasizing concurrent access, source-synchronous timing, and robust signal integrity at multi-Gbps rates.
FAQ
What is the function of the DOFF pin on CY7C1514AV18-200BZXI?
The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For standard QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
How does the ZQ pin affect output impedance calibration?
The ZQ pin connects to an external 240 Ω resistor to ground, enabling on-die calibration of Q[35:0] and CQ/CQ output drivers to match 48 Ω (0.2 × 240 Ω). This ensures consistent HSTL Class I drive strength across voltage and temperature variations. Connecting ZQ directly to VDDQ forces minimum impedance mode; leaving it unconnected or tied to GND violates specification and may cause signal integrity failure.
Can CY7C1514AV18-200BZXI operate with only one clock pair instead of two?
Yes-it supports single-clock mode using only K/K for both input registration and output timing (Q[35:0] driven on K/K edges). In this mode, C/C and CQ/CQ are unused. However, this sacrifices deskew capability and limits maximum frequency due to increased clock-to-out variation; dual-clock mode with C/C remains recommended for 200 MHz operation and timing closure.
What is the purpose of BWS[3:0] in x36 configuration?
BWS[3:0] are active-LOW byte write select signals that gate 9-bit segments of the 36-bit write data bus: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Asserting only selected BWS lines allows partial-word writes-essential for modifying packet headers without disturbing payload data in networking applications.
CY7C1514AV18-200BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514AV18-200BZXI FAQ
1.How can I place an order for CY7C1514AV18-200BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514AV18-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514AV18-200BZXI reliable?
The price and inventory of CY7C1514AV18-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-200BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1514AV18-200BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-200BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1514AV18-200BZXI?
CY7C1514AV18-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514AV18-200BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514AV18-200BZXI?
For technical support, including CY7C1514AV18-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-200BZXI requirements.
6.How does Aetrix verify that CY7C1514AV18-200BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1514AV18-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-200BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1514AV18-200BZXI?
All CY7C1514AV18-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-200BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514AV18-200BZXI part is unused and in its original packaging.
Return procedure for CY7C1514AV18-200BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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