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Cypress Semiconductor Corp CY7C1514AV18-250BZC

Part No.:
CY7C1514AV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514AV18-250BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:277

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Product details

Overview

CY7C1514AV18-250BZC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 250 MHz clock operation, 1.8 V core supply (VDD), and 1.4–1.8 V I/O supply (VDDQ), delivering 500 MT/s DDR throughput on both read and write ports for high-bandwidth packet buffering in network switches.

For engineers reviewing the CY7C1514AV18-250BZC datasheet, CY7C1514AV18-250BZC pinout, CY7C1514AV18-250BZC application, or CY7C1514AV18-250BZC equivalent, key selection considerations include dual-clock DDR timing (K/K and C/C), echo clocks (CQ/CQ) for source-synchronous capture, DLL-enabled 1.5-cycle read latency, and 165-ball FBGA (15 × 17 × 1.4 mm) package compatibility with HSTL-18 I/O.

Technical Context

The CY7C1514AV18-250BZC implements a true dual-port synchronous architecture with physically separate read and write data paths-Q[35:0] outputs and D[35:0] inputs-eliminating bus turnaround overhead. It uses independent K/K input clocks for address/data capture and C/C output clocks for data launch, with CQ/CQ echo clocks aligned to C/C for precise PCB trace deskew.

Internally organized as two 1M × 36 arrays, it supports 2-word burst transfers per access, synchronized by a Delay Lock Loop (DLL) that enables 1.5-cycle read latency at 250 MHz; when DOFF = LOW, it reverts to QDR I mode with 1-cycle latency and max 167 MHz operation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36)
Max Clock Frequency250 MHz - enables 500 MT/s DDR data rate on both ports
Read Latency1.5 cycles (DLL enabled) - deterministic timing for pipeline-aligned controller design
Core Supply (VDD)1.8 V ±0.1 V - defines internal logic voltage and power consumption profile
I/O Supply (VDDQ)1.4 V to 1.8 V - sets HSTL-18 output drive strength and termination compatibility
Package165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count memory routing
Output InterfaceHSTL Class I - ensures signal integrity at 500 MT/s with controlled impedance matching via ZQ pin

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 1.0 mm ball pitch, RoHS-compliant (Pb-free option available).

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputLatched on rising edges of K/K; supports byte-write via BWS[3:0] for partial-word updates
Q[35:0]Synchronous read data outputDriven on rising edges of C/C; tristated automatically after burst completion when RPS deasserted
K / KPositive/negative input clockCaptures all synchronous inputs (address, control, data); defines write initiation and address latching timing
C / CPositive/negative output clockControls Q[35:0] launch timing; used with CQ/CQ for source-synchronous capture at controller
CQ / CQEcho clocks referenced to C/CFree-running, phase-aligned copies of C/C - simplify PCB layout by enabling matched flight-time compensation
ZQOutput impedance calibration inputConnects to external resistor to ground to tune Q[35:0] and CQ/CQ output drive to match 50 Ω system bus
DOFFDLL disable controlPull LOW to disable DLL and operate in QDR I mode (1-cycle latency, ≤167 MHz); pull HIGH for full QDR II performance

Key Features

FeatureDesign Value
Separate read/write data portsEliminates bus turnaround delay and contention-enables concurrent read+write in same cycle for full-duplex traffic buffers
2-word burst architectureGuarantees two sequential 36-bit words per access-reduces address strobe overhead and improves effective bandwidth utilization
Source-synchronous echo clocks (CQ/CQ)Enables controller-side deskew without complex trace-length matching-critical for reliable 500 MT/s capture across multi-device stacks
Programmable DLL enable/disable (via DOFF)Allows seamless migration between QDR II (250 MHz, 1.5-cycle latency) and QDR I (167 MHz, 1-cycle latency) modes for design flexibility
HSTL-18 I/O with ZQ calibrationEnsures consistent 50 Ω output impedance across voltage/temperature-minimizes reflections and timing jitter on high-speed buses

Applications

Layer 2/Layer 3 SwitchingTelecom Line Cards

Use Scenario: High-speed packet buffering in enterprise Ethernet switches handling 10 GbE line rates with deep queueing requirements.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as ingress/egress FIFO with simultaneous read (forwarding engine fetch) and write (ingress packet store) operations.

Use Value: 500 MT/s DDR throughput and zero-turnaround architecture reduce packet drop under bursty traffic, improving QoS for real-time services.

Use Scenario: ATM or Packet-over-SONET interface cards requiring deterministic latency for cell/packet reassembly.

IC Role / Device Role / Timing Role: QDR II buffer staging incoming cells for header inspection and scheduling before transmission over backplane.

Use Value: 1.5-cycle DLL-enabled read latency and echo-clock synchronization ensure sub-nanosecond timing margin for 250 MHz controller interfaces.

Network Processor OffloadHigh-Frequency Trading Systems

Use Scenario: Offloading packet classification and flow table lookups from main NPU to dedicated search engines with local memory.

IC Role / Device Role / Timing Role: Memory-mapped SRAM providing low-latency access to TCAM result caches and statistics counters.

Use Value: Independent RPS/WPS controls allow concurrent lookup result reads and counter updates without arbitration stalls.

Use Scenario: Ultra-low-latency order book synchronization between co-located trading engines and market gateways.

IC Role / Device Role / Timing Role: Shared memory buffer enabling atomic write-to-read handoff between feed handler and order matcher threads.

Use Value: Full data coherency and deterministic 1.5-cycle read latency guarantee microsecond-level consistency across parallel processing paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG36-bit, 256K × 36 (9 Mbit), 100 MHz max, LVDS I/O, no DLLLower density and speed; suited for legacy systems with slower controllers and differential signalingSelect only if system clock ≤100 MHz and LVDS interface required; not suitable for 250 MHz QDR II designs
ISSI IS61WV102436B36-bit, 1M × 36 (36 Mbit), 167 MHz max, QDR I only, no echo clocksHalf the density, no DLL or CQ/CQ support-requires simpler controller timing but lacks QDR II burst efficiencyChoose for cost-sensitive, lower-bandwidth applications where 1-cycle latency suffices and echo-clock deskew is unnecessary

Compared with IDT72T3615L10BG and IS61WV102436B, the CY7C1514AV18-250BZC delivers 2× higher density, 2.5× higher bandwidth, and integrated DLL + echo clocks-making it uniquely suited for next-generation 10G+ networking ASIC interfaces demanding deterministic sub-2-cycle latency and source-synchronous timing closure.

Availability

CY7C1514AV18-250BZC is available at Aetrix Electronics and suitable for high-bandwidth packet buffering, telecom line card memory, network processor offload, and ultra-low-latency financial infrastructure requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1514AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for networking, automotive, and industrial markets.

The CY7C1514AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for ASIC/FPGA-based networking equipment requiring deterministic, dual-port, high-throughput memory with source-synchronous timing and minimal latency variation.

FAQ

What is the function of the DOFF pin on CY7C1514AV18-250BZC?

The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For full QDR II performance at 250 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.

How does the ZQ pin affect output drive strength?

The ZQ pin calibrates the output impedance of Q[35:0], CQ, and CQ pins to match the system data bus. Connecting ZQ to a precision resistor (RQ) to ground sets output impedance to 0.2 × RQ; connecting ZQ directly to VDDQ enables minimum impedance mode. ZQ must never be left floating or tied to GND, as this disables calibration and risks signal integrity failure.

Can CY7C1514AV18-250BZC operate with only one clock pair?

Yes - the device supports single-clock mode using only K/K for both input registration and output launching (Q[35:0] timed to K/K instead of C/C). In this mode, echo clocks CQ/CQ are generated relative to K/K, and C/C pins may be left unconnected. However, dual-clock mode with C/C and CQ/CQ is required to achieve full 250 MHz timing margins and source-synchronous capture.

What is the role of BWS[3:0] in byte-write operations?

BWS[3:0] are active-low byte write select signals that determine which 9-bit segments of the 36-bit D[35:0] bus are written during each half-burst. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Deasserting any BWS[x] preserves the corresponding byte in memory, enabling efficient partial-word updates without read-modify-write cycles.

CY7C1514AV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1514AV18-250BZC FAQ

1.How can I place an order for CY7C1514AV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514AV18-250BZC reliable?

The price and inventory of CY7C1514AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1514AV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1514AV18-250BZC?

CY7C1514AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514AV18-250BZC?

For technical support, including CY7C1514AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-250BZC requirements.

6.How does Aetrix verify that CY7C1514AV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1514AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1514AV18-250BZC?

All CY7C1514AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514AV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1514AV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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