Cypress Semiconductor Corp CY7C1514AV18-250BZC
- Part No.:
- CY7C1514AV18-250BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514AV18-250BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:277
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Product details
Overview
CY7C1514AV18-250BZC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 250 MHz clock operation, 1.8 V core supply (VDD), and 1.4–1.8 V I/O supply (VDDQ), delivering 500 MT/s DDR throughput on both read and write ports for high-bandwidth packet buffering in network switches.
For engineers reviewing the CY7C1514AV18-250BZC datasheet, CY7C1514AV18-250BZC pinout, CY7C1514AV18-250BZC application, or CY7C1514AV18-250BZC equivalent, key selection considerations include dual-clock DDR timing (K/K and C/C), echo clocks (CQ/CQ) for source-synchronous capture, DLL-enabled 1.5-cycle read latency, and 165-ball FBGA (15 × 17 × 1.4 mm) package compatibility with HSTL-18 I/O.
Technical Context
The CY7C1514AV18-250BZC implements a true dual-port synchronous architecture with physically separate read and write data paths-Q[35:0] outputs and D[35:0] inputs-eliminating bus turnaround overhead. It uses independent K/K input clocks for address/data capture and C/C output clocks for data launch, with CQ/CQ echo clocks aligned to C/C for precise PCB trace deskew.
Internally organized as two 1M × 36 arrays, it supports 2-word burst transfers per access, synchronized by a Delay Lock Loop (DLL) that enables 1.5-cycle read latency at 250 MHz; when DOFF = LOW, it reverts to QDR I mode with 1-cycle latency and max 167 MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s DDR data rate on both ports |
| Read Latency | 1.5 cycles (DLL enabled) - deterministic timing for pipeline-aligned controller design |
| Core Supply (VDD) | 1.8 V ±0.1 V - defines internal logic voltage and power consumption profile |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - sets HSTL-18 output drive strength and termination compatibility |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count memory routing |
| Output Interface | HSTL Class I - ensures signal integrity at 500 MT/s with controlled impedance matching via ZQ pin |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 1.0 mm ball pitch, RoHS-compliant (Pb-free option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS[3:0] for partial-word updates |
| Q[35:0] | Synchronous read data output | Driven on rising edges of C/C; tristated automatically after burst completion when RPS deasserted |
| K / K | Positive/negative input clock | Captures all synchronous inputs (address, control, data); defines write initiation and address latching timing |
| C / C | Positive/negative output clock | Controls Q[35:0] launch timing; used with CQ/CQ for source-synchronous capture at controller |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C - simplify PCB layout by enabling matched flight-time compensation |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[35:0] and CQ/CQ output drive to match 50 Ω system bus |
| DOFF | DLL disable control | Pull LOW to disable DLL and operate in QDR I mode (1-cycle latency, ≤167 MHz); pull HIGH for full QDR II performance |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround delay and contention-enables concurrent read+write in same cycle for full-duplex traffic buffers |
| 2-word burst architecture | Guarantees two sequential 36-bit words per access-reduces address strobe overhead and improves effective bandwidth utilization |
| Source-synchronous echo clocks (CQ/CQ) | Enables controller-side deskew without complex trace-length matching-critical for reliable 500 MT/s capture across multi-device stacks |
| Programmable DLL enable/disable (via DOFF) | Allows seamless migration between QDR II (250 MHz, 1.5-cycle latency) and QDR I (167 MHz, 1-cycle latency) modes for design flexibility |
| HSTL-18 I/O with ZQ calibration | Ensures consistent 50 Ω output impedance across voltage/temperature-minimizes reflections and timing jitter on high-speed buses |
Applications
| Layer 2/Layer 3 Switching | Telecom Line Cards |
|---|---|
Use Scenario: High-speed packet buffering in enterprise Ethernet switches handling 10 GbE line rates with deep queueing requirements. IC Role / Device Role / Timing Role: Dual-port SRAM serving as ingress/egress FIFO with simultaneous read (forwarding engine fetch) and write (ingress packet store) operations. Use Value: 500 MT/s DDR throughput and zero-turnaround architecture reduce packet drop under bursty traffic, improving QoS for real-time services. | Use Scenario: ATM or Packet-over-SONET interface cards requiring deterministic latency for cell/packet reassembly. IC Role / Device Role / Timing Role: QDR II buffer staging incoming cells for header inspection and scheduling before transmission over backplane. Use Value: 1.5-cycle DLL-enabled read latency and echo-clock synchronization ensure sub-nanosecond timing margin for 250 MHz controller interfaces. |
| Network Processor Offload | High-Frequency Trading Systems |
Use Scenario: Offloading packet classification and flow table lookups from main NPU to dedicated search engines with local memory. IC Role / Device Role / Timing Role: Memory-mapped SRAM providing low-latency access to TCAM result caches and statistics counters. Use Value: Independent RPS/WPS controls allow concurrent lookup result reads and counter updates without arbitration stalls. | Use Scenario: Ultra-low-latency order book synchronization between co-located trading engines and market gateways. IC Role / Device Role / Timing Role: Shared memory buffer enabling atomic write-to-read handoff between feed handler and order matcher threads. Use Value: Full data coherency and deterministic 1.5-cycle read latency guarantee microsecond-level consistency across parallel processing paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit, 256K × 36 (9 Mbit), 100 MHz max, LVDS I/O, no DLL | Lower density and speed; suited for legacy systems with slower controllers and differential signaling | Select only if system clock ≤100 MHz and LVDS interface required; not suitable for 250 MHz QDR II designs |
| ISSI IS61WV102436B | 36-bit, 1M × 36 (36 Mbit), 167 MHz max, QDR I only, no echo clocks | Half the density, no DLL or CQ/CQ support-requires simpler controller timing but lacks QDR II burst efficiency | Choose for cost-sensitive, lower-bandwidth applications where 1-cycle latency suffices and echo-clock deskew is unnecessary |
Compared with IDT72T3615L10BG and IS61WV102436B, the CY7C1514AV18-250BZC delivers 2× higher density, 2.5× higher bandwidth, and integrated DLL + echo clocks-making it uniquely suited for next-generation 10G+ networking ASIC interfaces demanding deterministic sub-2-cycle latency and source-synchronous timing closure.
Availability
CY7C1514AV18-250BZC is available at Aetrix Electronics and suitable for high-bandwidth packet buffering, telecom line card memory, network processor offload, and ultra-low-latency financial infrastructure requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1514AV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for networking, automotive, and industrial markets.
The CY7C1514AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for ASIC/FPGA-based networking equipment requiring deterministic, dual-port, high-throughput memory with source-synchronous timing and minimal latency variation.
FAQ
What is the function of the DOFF pin on CY7C1514AV18-250BZC?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For full QDR II performance at 250 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
How does the ZQ pin affect output drive strength?
The ZQ pin calibrates the output impedance of Q[35:0], CQ, and CQ pins to match the system data bus. Connecting ZQ to a precision resistor (RQ) to ground sets output impedance to 0.2 × RQ; connecting ZQ directly to VDDQ enables minimum impedance mode. ZQ must never be left floating or tied to GND, as this disables calibration and risks signal integrity failure.
Can CY7C1514AV18-250BZC operate with only one clock pair?
Yes - the device supports single-clock mode using only K/K for both input registration and output launching (Q[35:0] timed to K/K instead of C/C). In this mode, echo clocks CQ/CQ are generated relative to K/K, and C/C pins may be left unconnected. However, dual-clock mode with C/C and CQ/CQ is required to achieve full 250 MHz timing margins and source-synchronous capture.
What is the role of BWS[3:0] in byte-write operations?
BWS[3:0] are active-low byte write select signals that determine which 9-bit segments of the 36-bit D[35:0] bus are written during each half-burst. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Deasserting any BWS[x] preserves the corresponding byte in memory, enabling efficient partial-word updates without read-modify-write cycles.
CY7C1514AV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514AV18-250BZC FAQ
1.How can I place an order for CY7C1514AV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514AV18-250BZC reliable?
The price and inventory of CY7C1514AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514AV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1514AV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514AV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1514AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514AV18-250BZC?
For technical support, including CY7C1514AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514AV18-250BZC requirements.
6.How does Aetrix verify that CY7C1514AV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1514AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514AV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1514AV18-250BZC?
All CY7C1514AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514AV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514AV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1514AV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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