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Cypress Semiconductor Corp CY7C1514KV18-300BZXI

Part No.:
CY7C1514KV18-300BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514KV18-300BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
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Payment:
Payment
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Inventory:589

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Product details

Overview

CY7C1514KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz clock frequency, 1.8V core supply, and 1.4–1.8V I/O supply, supporting concurrent read/write operations via independent ports in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include DDR interface timing at 700 Mbps effective data rate, 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ) support for high-speed data capture, and 165-ball FBGA package compatibility with depth expansion using BWS[3:0] and port selects.

Technical Context

The CY7C1514KV18 implements QDR II architecture with fully independent read and write ports sharing a multiplexed address bus, enabling true concurrent access without bus turnaround. It uses separate K/K clocks for address/data latching and C/C clocks for output timing, with echo clocks (CQ/CQ) aligned to output data edges.

Internally, it features synchronous self-timed writes, programmable impedance (ZQ), JTAG 1149.1 boundary scan, and a PLL for precise data placement. Read latency is configurable: 1.5 cycles when DOFF is HIGH (QDR II mode) or 1 cycle when DOFF is LOW (QDR I compatibility mode).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 bits) - supports large burst buffers in switch fabric and line cards.
Max Clock Frequency 300 MHz - enables 600 MT/s effective throughput per port with DDR interface.
Data Rate (Effective) 700 Mbps per port - achieved via double-data-rate transfers on rising edges of K/K and C/C clocks.
Read Latency 1.5 cycles (DOFF = HIGH) - balances bandwidth and timing margin in high-speed systems.
Supply Voltages VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - allows interoperability with 1.5V or 1.8V I/O interfaces.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in dense PCB layouts.
Burst Length 2-word burst - fixed burst minimizes address overhead and ensures deterministic latency.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous data input 36-bit wide write data bus sampled on rising edge of K clock; supports full-word or byte-selectable writes via BWS[3:0].
Q[35:0] Synchronous data output 36-bit wide read data bus driven on rising edge of C clock; outputs aligned with echo clock CQ for simplified capture.
A[19:0] Multiplexed address input 20-bit address bus latched alternately on rising edges of K (read) and K (write) clocks for depth expansion.
WPS Write port select Active-LOW signal enabling write transactions; deassertion disables write port and ignores D[35:0] and BWS inputs.
RPS Read port select Active-LOW signal enabling read transactions; deassertion disables read port and drives Q[35:0] to high-impedance.
BWS[3:0] Byte write select Four active-LOW signals controlling write enable per 9-bit byte group (D[8:0], D[17:9], D[26:18], D[35:27]).
K / K Input clocks Differential pair (K, K) used for address and data latching on rising edges only; supports precise DDR timing alignment.
C / C Output clocks Differential pair (C, C) driving output registers; minimizes skew between Q[35:0] and CQ/CQ echo clocks.
CQ / CQ Echo clocks Output-aligned clocks synchronized to Q[35:0] edges; simplifies source-synchronous data capture in FPGA/ASIC receivers.
DOFF Read latency control Active-HIGH selects 1.5-cycle latency (QDR II); LOW selects 1-cycle latency (QDR I compatibility mode).
VDD / VDDQ Power supplies VDD = 1.8 V core supply; VDDQ = 1.4–1.8 V I/O supply - decoupled domains reduce noise coupling between logic and I/O.
ZQ Impedance calibration Reference pin for on-die termination calibration; connects to external 240 Ω resistor to ground for HSTL output drive matching.

Key Features

Feature Design Value
Independent Read/Write Ports Enables simultaneous read and write to different addresses - eliminates bus turnaround delay in packet buffer architectures.
2-Word Burst + DDR Interface Delivers 700 Mbps per port without increasing clock frequency - reduces EMI and timing closure complexity vs. single-data-rate alternatives.
Echo Clocks (CQ/CQ) Provides receiver-side timing reference aligned to Q[35:0] - removes need for complex deskew circuitry in high-speed SerDes/FPGA interfaces.
Programmable Impedance (ZQ) On-die termination calibration ensures consistent HSTL output drive strength across voltage/temperature - improves signal integrity without external resistors.
JTAG 1149.1 Boundary Scan Enables in-system test and debug of interconnects in dense memory subsystems - supports production test and field diagnostics.

Applications

Packet Buffering in Ethernet Switches Line Card Memory in Telecom Routers

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switching ASICs.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer with concurrent read/write capability for cut-through and store-and-forward modes.

Use Value: 700 Mbps per port sustains 10 GbE+ line rates; 1.5-cycle latency meets sub-100 ns forwarding requirements.

Use Scenario: Buffering ATM cells or IP packets in OC-192/STM-64 line cards with distributed processing.

IC Role / Device Role / Timing Role: Depth-expandable SRAM providing synchronized access to multiple DSPs or network processors via port selects (RPS/WPS).

Use Value: BWS[3:0] enables partial writes without read-modify-write cycles; echo clocks simplify timing closure across backplane traces.

High-Speed Test Equipment Memory Real-Time Video Frame Buffering

Use Scenario: Capturing and analyzing high-speed serial data streams in protocol analyzers and bit error rate testers.

IC Role / Device Role / Timing Role: Dual-port FIFO replacement with deterministic burst access and no bus contention during streaming capture.

Use Value: Concurrent read/write avoids pipeline stalls; 300 MHz clock supports >600 MS/s sampling with 2-word burst packing.

Use Scenario: Storing uncompressed 4K video frames for real-time processing in broadcast encoders or medical imaging systems.

IC Role / Device Role / Timing Role: 36-bit wide memory interface feeding parallel pixel pipelines in FPGA-based video processors.

Use Value: 2M × 36 organization matches 3840×2160@10-bit resolution; DDR interface delivers >5 Gbps bandwidth needed for 60 fps frame transfer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit, 2M × 36, 100 MHz QDR II+, LVDS I/O, 1.8V core - lower max frequency but tighter AC specs and integrated DLL. Preferred in ultra-low-jitter timing-critical systems (e.g., optical transport); lacks ZQ calibration and echo clocks. Select when system-level jitter budget is <15 ps RMS and DLL-based deskew is required over CQ-based capture.
ISSI IS61WV204836BLL-15BLI 36-bit, 2M × 36, 150 MHz sync SRAM, single-ended HSTL, 3.3V/2.5V/1.8V I/O - no DDR, no echo clocks, no port independence. Suitable for cost-sensitive, lower-bandwidth control-plane buffers where concurrency is not required. Select only if bandwidth ≤300 MB/s suffices and design can tolerate bus turnaround delays and higher power per bit.

Compared with IDT72T3615L10BG, CY7C1514KV18 offers higher bandwidth (700 vs. 200 Mbps) and echo-clock simplicity but less jitter immunity; versus IS61WV204836BLL-15BLI, it delivers 2.3× more throughput and true concurrency at the cost of greater layout and timing complexity.

Availability

CY7C1514KV18 is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, line card memory in telecom routers, and real-time video frame buffering requiring stable component supply across extended product lifecycles.

Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1514KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure where concurrent read/write and sub-100 ns latency are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1514KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables QDR II operation with 1.5-cycle latency for optimized bandwidth and timing margin; when LOW, it reverts to QDR I compatibility mode with 1-cycle latency. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

How does the BWS[3:0] signal work in byte-selectable writes?

BWS[3:0] are four active-LOW signals that independently enable writing to each 9-bit byte group within the 36-bit D[35:0] bus: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Only selected bytes are updated; unselected bytes retain prior contents, eliminating need for read-modify-write sequences in partial updates.

Can CY7C1514KV18 operate with a single clock domain instead of separate K/K and C/C pairs?

Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together), with outputs registered on the same clock edges. In this configuration, echo clocks (CQ/CQ) remain functional but align to the shared clock, reducing skew compensation flexibility while simplifying clock distribution in less demanding systems.

What is the purpose of the ZQ pin and how must it be connected?

ZQ is the impedance calibration reference pin for on-die termination. It must be connected to a precision 240 Ω resistor tied to ground to calibrate internal HSTL output drivers. Calibration occurs automatically at power-up and can be triggered manually via JTAG; incorrect ZQ termination causes output drive mismatch and signal integrity degradation.

CY7C1514KV18-300BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1514KV18-300BZXI FAQ

1.How can I place an order for CY7C1514KV18-300BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514KV18-300BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514KV18-300BZXI reliable?

The price and inventory of CY7C1514KV18-300BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-300BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1514KV18-300BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514KV18-300BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1514KV18-300BZXI?

CY7C1514KV18-300BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514KV18-300BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514KV18-300BZXI?

For technical support, including CY7C1514KV18-300BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-300BZXI requirements.

6.How does Aetrix verify that CY7C1514KV18-300BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1514KV18-300BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-300BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1514KV18-300BZXI?

All CY7C1514KV18-300BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-300BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514KV18-300BZXI part is unused and in its original packaging.

Return procedure for CY7C1514KV18-300BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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