Cypress Semiconductor Corp CY7C1514KV18-333BZI
- Part No.:
- CY7C1514KV18-333BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514KV18-333BZI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1514KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 333 MHz maximum operating frequency, 1.8V core supply, and 1.4–1.8V I/O supply. It implements separate read/write ports with DDR interfaces on both, 2-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.
For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include its 333 MHz clock support, 2M × 36 x18-bit-wide interface, FBGA-165 package, DOFF-controlled 1.5-cycle vs. 1-cycle read latency, and JTAG 1149.1 compliance for boundary scan testability.
Technical Context
This QDR II SRAM uses dual independent DDR clock domains: K/K for address/data input timing and C/C (or CQ/CQ) for output timing, enabling concurrent read/write operations without bus turnaround. Its synchronous self-timed write circuitry eliminates external write pulse control, while the PLL ensures precise data placement relative to echo clocks.
The device supports depth expansion via RPS/WPS port selects and byte-level write masking through four active-low BWS signals (BWS0–BWS3), each controlling a 9-bit segment of the 36-bit D[35:0] bus. Address latching occurs on alternate rising edges of K, supporting 20-bit addressing (A[19:0]) for the 2M-depth array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 bits) |
| Max Clock Frequency | 333 MHz - enables 700 MT/s effective data rate per port via DDR |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing mode |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - supports 1.5V/1.8V system interfacing |
| Burst Length | 2-word burst on all accesses - fixed, non-programmable, optimized for pipeline efficiency |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory devices |
| JTAG Support | IEEE 1149.1 compliant - enables boundary scan testing and debug in assembled systems |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous data input | 36-bit wide write data bus, sampled on rising edge of K/K; supports byte-select masking via BWS0–BWS3 |
| Q[35:0] | Synchronous data output | 36-bit wide read data bus, registered to C/C or echoed via CQ/CQ for skew-insensitive capture |
| A[19:0] | Address input | 20-bit multiplexed address bus latched on alternating rising edges of K (read) and K (write) |
| WPS | Write port select | Active-low signal enabling write transactions; deassertion disables write port and ignores D[35:0] |
| RPS | Read port select | Active-low signal enabling read transactions; deassertion disables read port and drives Q[35:0] to high-Z |
| BWS[3:0] | Byte write select | Four active-low signals controlling 9-bit segments of D[35:0]; unused bytes retain prior data |
| K / K | Input clock pair | Dual-phase clock inputs for address and data sampling; rising edges only used for synchronization |
| C / C / CQ / CQ | Output clock pair + echo clocks | C/C drive Q[35:0] registers; CQ/CQ replicate clock edges at output pins to simplify receiver timing closure |
| DOFF | Read latency control | High = 1.5-cycle latency; Low = 1-cycle latency - configures internal pipeline depth for timing optimization |
| VDD / VDDQ / VSS | Power and ground | Separate 1.8V core (VDD), 1.4–1.8V I/O (VDDQ), and ground (VSS) rails - decoupling critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Enables true concurrent access - no arbitration or bus turnaround required between read and write operations |
| DDR Interfaces on Both Ports | Delivers 700 MT/s effective bandwidth per port at 333 MHz, doubling throughput versus single-data-rate SRAMs |
| Echo Clocks (CQ/CQ) | Eliminates flight-time mismatch between clock and data paths, simplifying PCB layout and timing margin analysis |
| Programmable Read Latency (DOFF) | Allows system-level trade-off between latency and setup/hold timing margins without changing clock phase |
| Byte-Write Masking (BWS[3:0]) | Permits partial writes to any 9-bit segment of the 36-bit bus, preserving unmasked data without read-modify-write overhead |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches and routers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer with simultaneous read (forwarding engine) and write (ingress parser) access. Use Value: 700 MT/s per port sustains full line-rate traffic at 10 Gbps+ with zero bus turnaround delay, reducing packet queuing jitter. | Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency and error-free data retention. IC Role / Device Role / Timing Role: Synchronous pipelined memory for time-critical header processing and payload reassembly pipelines. Use Value: 1-cycle read latency (DOFF = LOW) meets sub-10 ns timing budgets for real-time frame alignment logic. |
| Baseband Processing in 4G/LTE | High-Speed Test Equipment Memory |
Use Scenario: Interfacing with FPGA-based digital front-end (DFE) modules for uplink/downlink symbol buffering in wireless base stations. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ping-pong buffer between ADC/DAC interfaces and FFT/IFFT engines. Use Value: Separate D[35:0] and Q[35:0] buses eliminate contention during simultaneous sample capture and transform execution. | Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation at 333 MHz clock rates. IC Role / Device Role / Timing Role: Deterministic-access memory storing stimulus/response vectors synchronized to tester clock domains. Use Value: JTAG 1149.1 support enables in-system verification of memory integrity and interconnect routing on ATE load boards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-15JIN | 32-Mbit, 256K × 128, 15 ns async access, 3.3V only, no DDR or echo clocks | Limited to lower-speed, non-pipelined systems; lacks concurrency and high-frequency timing support | Select only when cost sensitivity outweighs bandwidth and latency requirements |
| IS61WV102432BLL-15BLI | 32-Mbit, 1M × 32, 15 ns async, 3.3V/2.5V, no QDR architecture or DOFF latency control | Single-port, asynchronous operation - requires external arbitration and suffers bus turnaround penalty | Use only in legacy designs where QDR II features are not required and clock rates ≤100 MHz |
Compared with AS7C3256B-15JIN and IS61WV102432BLL-15BLI, CY7C1514KV18 delivers 2.25× higher density, DDR-enabled 700 MT/s throughput, and deterministic 1-cycle/1.5-cycle latency-critical for modern packet-processing pipelines where timing predictability and concurrent access are non-negotiable.
Availability
CY7C1514KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing in 4G/LTE infrastructure, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.
CY7C1514KV18 belongs to the QDR® II SRAM product line, designed specifically for high-bandwidth, low-latency, concurrent-access memory subsystems in networking, telecommunications, and test instrumentation.
FAQ
What is the function of the DOFF pin on CY7C1514KV18?
The DOFF (Data Output OFFset) pin controls read latency mode: when asserted HIGH, it configures the device for 1.5-cycle read latency; when LOW, it enables 1-cycle latency. This setting affects internal pipeline staging and must be held stable during operation. It does not impact write timing or burst behavior, and no reconfiguration is possible mid-operation without resetting the device.
Can CY7C1514KV18 operate with only one clock domain (K = C)?
Yes - the device supports single-clock-domain operation by tying K to C and K to C, though this reduces timing margin and eliminates skew compensation benefits of echo clocks. In this mode, CQ/CQ outputs still reflect the same clock edges, but system-level timing closure becomes more sensitive to PCB trace length mismatches between clock and data nets.
How many address bits are used for the 2M × 36 configuration?
The CY7C1514KV18 uses 20 address bits (A[19:0]) to access its 2M-depth memory array. These are multiplexed onto a single address bus and latched on alternating rising edges of the K clock for read addresses and K clock for write addresses - no external address demultiplexing is required.
What is the purpose of the BWS[3:0] signals, and how do they map to D[35:0]?
BWS[3:0] are active-low byte write select signals: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each enables writing to its corresponding 9-bit segment; deselected segments retain their prior stored values, eliminating need for read-modify-write cycles during partial updates.
CY7C1514KV18-333BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1514KV18-333BZI FAQ
1.How can I place an order for CY7C1514KV18-333BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514KV18-333BZI reliable?
The price and inventory of CY7C1514KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-333BZI is usually 5 days.
3.What payment methods are accepted for CY7C1514KV18-333BZI?
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CY7C1514KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514KV18-333BZI?
For technical support, including CY7C1514KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-333BZI requirements.
6.How does Aetrix verify that CY7C1514KV18-333BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1514KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-333BZI meets industry standards.
7.What is the process for return or replacement of CY7C1514KV18-333BZI?
All CY7C1514KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-333BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514KV18-333BZI part is unused and in its original packaging.
Return procedure for CY7C1514KV18-333BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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