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Cypress Semiconductor Corp CY7C1514KV18-333BZXC

Part No.:
CY7C1514KV18-333BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514KV18-333BZXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,327

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Product details

Overview

CY7C1514KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 333 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces on both, 2-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.

For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include 333 MHz clock support, x36 bus width, 165-ball FBGA package, DOFF-controlled read latency (1.5-cycle or 1-cycle), and JTAG 1149.1 test access compliance.

Technical Context

The CY7C1514KV18 uses synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of the K clock, enabling concurrent transactions without bus turnaround.

It integrates a PLL for precise data placement, supports variable-drive HSTL output buffers, and provides full data coherency via on-chip self-timed writes. Echo clocks (CQ/CQ) align with output data to simplify timing closure in systems operating at 700 MT/s effective data rate.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36)
Max Clock Frequency333 MHz - enables 666 MT/s per port (DDR)
Core Supply Voltage1.8 V ±0.1 V - defines minimum power rail stability requirement
I/O Supply Range1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V logic families
Burst Length2-word - fixed burst delivers two 36-bit words per access
Read Latency1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing mode for system synchronization
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB layout

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data input36-bit parallel data sampled on rising edge of K/K clocks during write operations
Q[35:0]Synchronous read data output36-bit parallel data driven on rising edges of C/C clocks with aligned CQ echo clock
K, KInput clocks for address/data samplingDual-phase clocks used for address latching and write data capture; only rising edges active
C, COutput clocks for data timingSeparate clocks for read data register control to minimize skew vs. Q outputs
CQ, CQEcho clocksOutput-aligned clocks synchronized to Q[35:0] transitions for reliable high-speed capture
WPSWrite port selectActive-low signal enabling write operation; deassertion disables write port and ignores D[35:0]
BWS[3:0]Byte write selectsFour active-low signals controlling 8-bit byte masking for partial writes across 36-bit bus
DOFFRead latency mode controlHigh = 1.5-cycle latency; Low = 1-cycle latency - configures internal pipeline depth
RPSRead port selectActive-low signal enabling read operation; deassertion disables read port and tristates Q[35:0]
TCK/TMS/TDI/TDOJTAG boundary scan interfaceIEEE 1149.1-compliant test access port for production testing and debug

Key Features

FeatureDesign Value
Independent read/write portsEnables true concurrent memory access - no bus turnaround required between reads and writes
2-word DDR burstDelivers 72 bits per access cycle at 333 MHz clock → 2.4 Gbps sustained bandwidth per port
Echo clock (CQ/CQ) supportEliminates board-level timing margin uncertainty by providing data-aligned strobes for FPGA/ASIC capture
Programmable read latency (DOFF)Allows system-level optimization: 1-cycle for minimal latency or 1.5-cycle for improved setup/hold margin
HSTL-compatible I/O with variable driveEnsures signal integrity on high-speed traces while supporting multiple load conditions and termination schemes

Applications

Packet Buffering in Switch ASICsLine Card Memory in Telecom Routers

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switching fabric.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to switch fabric controller via x36 DDR interface.

Use Value: Concurrent read/write capability eliminates arbitration delay; 333 MHz clock supports ≥2.4 Gbps throughput per port required for 10G line-rate buffering.

Use Scenario: Frame buffering and queue management in OC-192/STM-64 line cards handling SONET/SDH traffic.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store between framer and traffic manager, synchronized to system clock domain using CQ echo clocks.

Use Value: 1.5-cycle latency mode (DOFF = HIGH) provides timing margin for long trace routing; 165-ball FBGA fits dense line card layouts.

Baseband Processing in 4G LTE eNodeBReal-Time Video Frame Buffering

Use Scenario: Temporary storage of IQ samples and channel estimation results in digital baseband processing chain.

IC Role / Device Role / Timing Role: Synchronous SRAM serving as ping-pong buffer between FFT/IFFT engines and MAC layer scheduler.

Use Value: Separate RPS/WPS controls enable deterministic read/write scheduling; BWS[3:0] allows byte-granular updates to avoid full-word overwrites.

Use Scenario: Inter-frame buffering in broadcast-grade video encoders requiring zero-frame-drop operation at 4K60 resolution.

IC Role / Device Role / Timing Role: Dual-port memory holding current and next frame data, accessed simultaneously by encoder and sensor interface logic.

Use Value: 2M × 36 organization matches 4K UHD pixel packing (e.g., 3840 × 2160 × 12 bpp ≈ 12 Mbit/frame); 700 MT/s effective rate sustains >2.5 GB/s bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C3256A-15JCINAsynchronous 32 Mbit SRAM, 15 ns access, x32 bus, 3.3 V onlyLacks DDR, echo clocks, and concurrent ports - suitable only for non-pipelined, lower-bandwidth control-plane buffersSelect only if system clock < 100 MHz and no simultaneous read/write required
IS61WV102432BLL-10TLISynchronous 32 Mbit SSRAM, 10 ns cycle time, x32, 3.3 V, single-portNo QDR architecture - requires external arbitration for read/write interleaving; no CQ timing aidUse where cost sensitivity outweighs bandwidth needs and design can tolerate bus turnaround overhead

Compared with AS7C3256A-15JCIN and IS61WV102432BLL-10TLI, CY7C1514KV18 uniquely delivers true concurrent access, DDR bandwidth, and echo-clock timing - making it irreplaceable in 10G+ packet processing and real-time video pipelines where deterministic latency and >2 Gbps throughput are mandatory.

Availability

CY7C1514KV18 is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in telecom routers, and baseband processing in 4G LTE infrastructure requiring stable component supply across extended production lifecycles.

Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1514KV18 belongs to the QDR® II SRAM product line, engineered specifically for high-throughput, low-latency data buffering in packet-switched networks and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1514KV18?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for improved timing margin; when LOW, it enables 1-cycle latency for minimal delay. This setting affects internal pipeline staging but does not alter burst length, clock frequency, or data width.

How does the CY7C1514KV18 handle partial writes to its 36-bit data bus?

Partial writes are controlled by four active-low Byte Write Select signals (BWS[3:0]), each enabling one 8-bit byte lane. When a BWS signal is deasserted, the corresponding byte remains unaltered in memory. This allows selective update of sub-word fields without read-modify-write cycles or external logic.

Can CY7C1514KV18 operate with only one clock domain instead of separate K/K and C/C pairs?

Yes - the device supports single-clock-domain operation where K and C are tied together (and K and C likewise), simplifying clock tree design. In this mode, all inputs are registered on K, and all outputs are registered on C, maintaining full functionality except that echo clock alignment is relative to C rather than dedicated CQ.

What is the purpose of the NC/144M and NC/288M pins on the 165-ball FBGA package?

NC/144M and NC/288M are no-connect pins not bonded to the die; they may be left floating or tied to any voltage level (VDD, VSS, or mid-rail) without affecting operation. These pins exist for package compatibility across the QDR II family and have no electrical function in CY7C1514KV18.

CY7C1514KV18-333BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1514KV18-333BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1514KV18-333BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514KV18-333BZXC reliable?

The price and inventory of CY7C1514KV18-333BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-333BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1514KV18-333BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514KV18-333BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1514KV18-333BZXC?

CY7C1514KV18-333BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514KV18-333BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514KV18-333BZXC?

For technical support, including CY7C1514KV18-333BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-333BZXC requirements.

6.How does Aetrix verify that CY7C1514KV18-333BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1514KV18-333BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-333BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1514KV18-333BZXC?

All CY7C1514KV18-333BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-333BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514KV18-333BZXC part is unused and in its original packaging.

Return procedure for CY7C1514KV18-333BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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