Cypress Semiconductor Corp CY7C1514V18-200BZC
- Part No.:
- CY7C1514V18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514V18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,106
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Product details
Overview
CY7C1514V18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, 1.8V core supply, and dual DDR interfaces supporting 250 MHz operation (500 MT/s per port). It implements separate read/write ports with echo clocks (CQ/CQ), DLL-based data alignment, and HSTL I/O for high-speed networking buffers and packet memory in telecom line cards.
For engineers reviewing the CY7C1514V18 datasheet, CY7C1514V18 pinout, CY7C1514V18 application, or CY7C1514V18 equivalent, key selection criteria include x36 bus width, 20-bit address mapping, BWS[3:0] byte write control, VDDQ = 1.4–1.8V compliance, and 165-ball FBGA (15 × 17 mm) mechanical fit.
Technical Context
This device uses synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch, enabling concurrent read/write operations without bus turnaround. The Delay Lock Loop (DLL) aligns Q[35:0] outputs to CQ/CQ edges with sub-cycle timing precision.
All 36-bit data writes are controlled by four active-low Byte Write Selects (BWS[3:0]), each gating one 9-bit byte; reads deliver two sequential 36-bit words per access on rising edges of C and C. Address inputs A[19:0] are multiplexed for both ports, latched on alternating K/K edges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s DDR throughput per port |
| Core Supply (VDD) | 1.8 V ±0.1 V - defines internal logic voltage and power domain isolation |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - sets HSTL Class I output drive strength and termination reference |
| Data Bus Width | 36-bit bidirectional - supports parallel packet payload storage with byte-level write granularity |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - matches standard high-density PCB layout spacing for telecom modules |
| Timing Architecture | DLL-synchronized echo clocks (CQ/CQ) - eliminates board-level flight-time skew for reliable >400 Mbps capture at FPGA receivers |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm body, 1.4 mm height, 0.8 mm ball pitch. RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edge of K/K; 36-bit parallel path for burst write payloads |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tri-stated when RPS inactive |
| BWS[3:0] | Byte write select (active low) | Each controls one 9-bit byte; enables partial-word updates without read-modify-write |
| A[19:0] | Multiplexed address bus | Shared by read/write ports; 20 bits address full 2M depth |
| RPS / WPS | Read/Write port select (active low) | Enables independent port arbitration; supports depth expansion with multiple devices |
| C / C, CQ / CQ | Output clock pair + echo clocks | C/C launch data; CQ/CQ replicate C/C phase at device output for receiver deskew |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q[35:0]/CQ/CQ output impedance to 0.2×RQ |
| DOFF | DLL disable control | Pulling low disables DLL; alters tAC/tCO timing - used only for specific system-level timing margining |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay - enables true concurrent access for pipeline buffering |
| 2-word burst architecture | Delivers two 36-bit words per access cycle - matches common packet header+payload segmentation |
| HSTL Class I I/O with ZQ calibration | Ensures signal integrity at 500 MT/s with programmable output impedance matching to PCB trace Z₀ |
| JTAG 1149.1 test access port | Supports boundary-scan testing and in-system debug without additional test fixtures |
| Variable drive strength outputs | Reduces EMI and crosstalk in dense routing environments via configurable slew rate |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
Use Scenario: Storing ingress/egress packet queues in 10G/40G line cards where latency must be deterministic and bandwidth ≥20 Gbps. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-wait-state FIFO buffer between SERDES PHY and network processor, synchronized to K/C clocks. Use Value: 2M × 36 capacity provides 9 MB buffer space; 250 MHz DDR delivers 18 Gbps aggregate bandwidth per port - sufficient for full-duplex 40G Ethernet traffic. | Use Scenario: Interfacing multi-core NPU clusters requiring simultaneous instruction fetch and data caching with minimal arbitration overhead. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by multiple NPU cores via dedicated read/write ports and BWS-controlled partial writes. Use Value: Independent RPS/WPS enables lock-free producer-consumer handoff; echo clocks (CQ/CQ) simplify timing closure at FPGA/NPU receiver inputs. |
| Telecom Baseband Processing | Test Equipment Memory Subsystem |
Use Scenario: Real-time symbol buffering in LTE/5G baseband units where bursty channel data must be time-aligned across multiple antennas. IC Role / Device Role / Timing Role: Synchronous pipeline stage holding IQ samples before FFT processing; clocked by K/C with DLL alignment to minimize jitter-induced SNR degradation. Use Value: DLL-synchronized CQ/CQ ensures <±50 ps clock-to-data skew at 500 MT/s - critical for maintaining EVM in 256-QAM waveforms. | Use Scenario: High-fidelity pattern memory in automated test equipment generating multi-gigabit serial stimulus with precise timing margins. IC Role / Device Role / Timing Role: Deterministic waveform storage element feeding high-speed DACs; uses DOFF pin to disable DLL when system-level clock tree dominates timing budget. Use Value: VDDQ range (1.4–1.8 V) allows direct interface to 1.5V or 1.8V DAC drivers; ZQ calibration maintains consistent rise/fall times across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-20BIN | 2M × 36, 200 MHz max, 3.3V core, no DLL or echo clocks | Lacks CQ/CQ deskew and DLL - requires tighter board-level timing control | Select when cost sensitivity outweighs need for >200 MHz operation and system-level skew compensation |
| IS61WV204836BLL-15BLI | 2M × 36, 150 MHz max, 3.3V I/O, asynchronous burst mode | No DDR interface or separate ports - relies on external arbitration for concurrent access | Choose for legacy systems using standard SRAM controllers without QDR-II protocol support |
Compared with AS7C362000B-20BIN and IS61WV204836BLL-15BLI, CY7C1514V18 delivers 25% higher bandwidth, eliminates external bus turnaround logic via true dual-port architecture, and integrates DLL + echo clocks to relax PCB routing constraints in >200 MHz designs.
Availability
CY7C1514V18 is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and test equipment memory subsystems requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1514V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
CY7C1514V18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory in packet infrastructure and real-time signal processing applications.
FAQ
What is the minimum VDDQ voltage supported for CY7C1514V18 operation?
The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed - HSTL Class I output drive strength and timing parameters are specified only within this range. Using 1.5 V VDDQ is typical for compatibility with 1.5 V FPGA I/O banks while maintaining noise margin.
Can CY7C1514V18 operate with only the K clock (single-clock mode)?
Yes. In single-clock mode, K serves as both input and output clock: data inputs are latched on K's rising edge, and data outputs are driven on the same edge. C/C and CQ/CQ are unused, simplifying clock routing but reducing maximum achievable bandwidth due to lack of deskew capability.
How does the ZQ pin affect output impedance calibration?
ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and scales all output drivers (Q[35:0], CQ, CQ) to 0.2×RQ. If ZQ is tied to VDDQ, outputs default to minimum impedance (~25 Ω); leaving ZQ floating or grounded violates specification and may cause signal integrity failure.
What happens when DOFF is asserted low?
Asserting DOFF disables the internal Delay Lock Loop, reverting output timing to basic flip-flop propagation paths. This increases tAC (address-to-output) variation by up to ±150 ps and invalidates DLL-dependent timing specs - use only when system-level clock distribution fully compensates for skew.
CY7C1514V18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1514V18-200BZC FAQ
1.How can I place an order for CY7C1514V18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514V18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514V18-200BZC reliable?
The price and inventory of CY7C1514V18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514V18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1514V18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514V18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1514V18-200BZC?
CY7C1514V18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514V18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514V18-200BZC?
For technical support, including CY7C1514V18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514V18-200BZC requirements.
6.How does Aetrix verify that CY7C1514V18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1514V18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514V18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1514V18-200BZC?
All CY7C1514V18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514V18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514V18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1514V18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1514V18-200BZC Tags

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