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Cypress Semiconductor Corp CY7C1514V18-200BZXI

Part No.:
CY7C1514V18-200BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514V18-200BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:298

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Product details

Overview

CY7C1514V18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, operating at 200 MHz (500 MT/s DDR), supporting concurrent read/write ports and 2-word burst transfers. It delivers high-bandwidth memory for network packet buffering in telecom line cards and switch fabric controllers where deterministic latency and full data coherency are required.

For engineers reviewing the CY7C1514V18 datasheet, CY7C1514V18 pinout, CY7C1514V18 application, or CY7C1514V18 equivalent, key selection criteria include its 165-ball FBGA package, dual-clock DDR interface (K/K and C/C), echo clocks (CQ/CQ), HSTL I/O compatibility, and synchronous self-timed write architecture.

Technical Context

The CY7C1514V18 implements QDR-II architecture with physically separate read and write data paths-36-bit input D[35:0] and 36-bit output Q[35:0]-eliminating bus turnaround overhead. Address inputs A[19:0] are multiplexed for both ports and latched on alternate rising edges of K/K clocks.

It uses two independent clock domains: K/K for write/control timing and C/C for read data output, with echo clocks CQ/CQ synchronized to C/C to simplify high-speed capture. The internal Delay Lock Loop (DLL) ensures precise data placement relative to output clocks, and DOFF allows DLL disable for specific timing constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density72 Mbit (2M × 36 organization)
Max Clock Frequency200 MHz K/K input clock → 400 MT/s effective throughput per port
Data Rate500 MT/s DDR on both read and write ports (2-word burst per cycle)
Supply VoltagesVDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O)
Package165-ball FBGA (15 × 17 × 1.4 mm), RoHS-compliant
I/O StandardHSTL Class I compatible with programmable drive strength
Timing ArchitectureSynchronous, pipelined, self-timed writes with DLL-based data alignment

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-245 compliant.

Pin/Terminal Circuit Role Design Meaning
D[35:0]Synchronous write data input36-bit parallel data sampled on rising edge of K/K; supports byte-level write masking via BWS[3:0]
Q[35:0]Synchronous read data output36-bit parallel data driven on rising edge of C/C; tri-stated when RPS inactive
A[19:0]Multiplexed address input20-bit address shared by read/write ports; latched on alternating K/K edges for pipelined access
RPS, WPSPort enable controlsActive-low synchronous selects; RPS enables read burst, WPS initiates write with D[35:0] and BWS[3:0]
BWS[3:0]Byte write selectFour active-low signals controlling 8-bit byte lanes; enables partial writes without read-modify-write
K, KWrite/control clock pairDifferential input clocks for all write operations and control sampling; only rising edges used
C, CRead data clock pairDifferential output clocks for Q[35:0]; deskew-critical for system-level timing closure
CQ, CQEcho clocksFree-running outputs synchronized to C/C; used by controller for source-synchronous data capture
ZQImpedance calibrationConnects to external 240 Ω resistor to ground to tune Q[35:0]/CQ/CQ output impedance to 48 Ω
DOFFDLL disableActive-low signal to bypass internal DLL; alters output timing-requires revalidation of setup/hold margins

Key Features

Feature Design Value
Concurrent Read/Write PortsEliminates bus turnaround delay and arbitration logic in high-throughput packet buffers
2-Word Burst ArchitectureDelivers 72 bits per clock cycle (36-bit × 2) with fixed latency-no variable burst length overhead
Echo Clocks (CQ/CQ)Enables source-synchronous capture at controller side without trace-length matching between clock and data lines
JTAG 1149.1 Test AccessSupports boundary-scan testing of interconnects in dense FBGA layouts without physical probe access
HSTL I/O with Variable DriveConfigurable output strength reduces simultaneous switching noise in multi-device memory subsystems

Applications

Network Packet Buffering Switch Fabric Controller Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches with sub-10 ns access latency requirements.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-wait-state buffer between ingress parser and egress scheduler, synchronized to 200 MHz system clock domain.

Use Value: Concurrent read/write eliminates pipeline stalls during back-to-back packet processing, sustaining 500 MT/s sustained bandwidth per port.

Use Scenario: Holding forwarding table entries and queue state in modular chassis-based routers with distributed control planes.

IC Role / Device Role / Timing Role: High-coherency memory providing atomic updates to lookup tables while supporting parallel search reads.

Use Value: Full data coherency ensures scheduler always reads most recently written queue depth or priority flags without software intervention.

Telecom Line Card Buffering High-Speed Test Equipment Memory

Use Scenario: Temporary storage of SONET/SDH frame payloads in OC-192 line interface modules requiring deterministic jitter tolerance.

IC Role / Device Role / Timing Role: Burst-access memory interfaced to SerDes PHY via dedicated read/write data buses and echo-clocked capture.

Use Value: CQ/CQ echo clocks align data valid windows to controller sampling points, enabling reliable capture at 500 MT/s despite PCB skew.

Use Scenario: Waveform generation and acquisition buffer in automated test equipment capturing multi-channel digital patterns at 200+ MHz rates.

IC Role / Device Role / Timing Role: Synchronous memory staging stimulus vectors and expected responses with precise clock-domain isolation.

Use Value: Independent K/K and C/C clock domains allow stimulus generation and response checking to operate on separate, phase-controlled timing paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG36-bit QDR-II+ (250 MHz), 72-Mbit, supports 1.5-word burst and dynamic latency adjustmentHigher max frequency but requires more complex DLL calibration; lacks ZQ pin for impedance tuningSelect when >200 MHz operation is mandatory and board layout supports tighter timing margins
ISSI IS61WV102436B36-bit sync SRAM (166 MHz), single-clock, no echo clocks or DDR interfaceLacks concurrent ports-requires external arbitration; lower bandwidth (332 MT/s) and higher latencySelect only for cost-sensitive legacy designs where QDR-II features are unused and bandwidth <400 MT/s suffices

Compared with IDT72T3615L10BG and ISSI IS61WV102436B, the CY7C1514V18 offers optimal balance of 200 MHz guaranteed operation, built-in echo clocks for simplified capture, and ZQ-based impedance tuning-making it preferred for new telecom and test equipment designs targeting robust 500 MT/s DDR performance.

Availability

CY7C1514V18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric controllers, telecom line card buffering, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1514V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

The QDR-II SRAM product line targets high-speed networking infrastructure requiring deterministic latency, concurrent access, and DDR bandwidth-specifically optimized for packet processing, switch fabrics, and protocol acceleration.

FAQ

What is the minimum VDDQ voltage supported by CY7C1514V18?

The device specifies VDDQ = 1.4 V to 1.8 V. Operation below 1.4 V violates HSTL Class I input thresholds and output drive capability; 1.5 V is commonly used to ensure margin against noise and droop while maintaining compatibility with 1.8 V core logic.

Can CY7C1514V18 operate in single-clock mode using only K and K?

Yes-when C and C are tied to K and K respectively, the device enters single-clock mode. In this configuration, Q[35:0] is clocked by K/K instead of C/C, and CQ/CQ track K/K. All timing parameters shift accordingly, and DLL behavior remains active unless DOFF is asserted.

How does the BWS[3:0] signal map to D[35:0] byte lanes?

BWS0 controls D[7:0], BWS1 controls D[15:8], BWS2 controls D[23:16], and BWS3 controls D[31:24]. D[35:32] are not byte-maskable and always written when WPS is active; they correspond to upper nibble of the 36-bit word.

Is the ZQ pin required for functional operation?

No-ZQ is optional for impedance calibration. If omitted, outputs default to minimum drive strength (≈60 Ω). For optimal signal integrity on 50 Ω traces, connect ZQ to a 240 Ω resistor to ground to set output impedance to 48 Ω, matching typical PCB routing.

CY7C1514V18-200BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1514V18-200BZXI FAQ

1.How can I place an order for CY7C1514V18-200BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514V18-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514V18-200BZXI reliable?

The price and inventory of CY7C1514V18-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514V18-200BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1514V18-200BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514V18-200BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1514V18-200BZXI?

CY7C1514V18-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514V18-200BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514V18-200BZXI?

For technical support, including CY7C1514V18-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514V18-200BZXI requirements.

6.How does Aetrix verify that CY7C1514V18-200BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1514V18-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514V18-200BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1514V18-200BZXI?

All CY7C1514V18-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514V18-200BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514V18-200BZXI part is unused and in its original packaging.

Return procedure for CY7C1514V18-200BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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