Cypress Semiconductor Corp CY7C1515AV18-250BZC
- Part No.:
- CY7C1515AV18-250BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1515AV18-250BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:321
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Product details
Overview
CY7C1515AV18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, 1.8V core supply, and 1.4–1.8V I/O interface. It delivers 600 MHz DDR data transfer on independent read/write ports using separate K/K and C/C clock pairs, supports 4-word burst, and operates in 165-ball FBGA (15 × 17 × 1.4 mm) for high-bandwidth packet buffering in network line cards.
For engineers reviewing the CY7C1515AV18 datasheet, CY7C1515AV18 pinout, CY7C1515AV18 application, or CY7C1515AV18 equivalent, key selection criteria include QDR-II dual-port timing compliance, 250 MHz maximum operating frequency, DLL-enabled 1.5-cycle read latency, HSTL-18 I/O compatibility, and depth-expansion support via BWS[3:0] and port-select signals.
Technical Context
The CY7C1515AV18 implements true synchronous pipelined QDR-II architecture with physically isolated read and write data paths-no bus turnaround required. Its 19-bit address bus accesses a 512K × 36 internal array across four sub-arrays, latched on alternating rising edges of K and K clocks.
Read operations use C/C echo clocks to deskew output timing; write operations use self-timed internal logic synchronized to K/K. The Delay Lock Loop (DLL) enables precise 1.5-cycle read latency at 250 MHz, while DOFF pin disables DLL to fall back to QDR-I mode with 1-cycle latency up to 167 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 250 MHz K/K input clock → 600 MHz effective DDR data rate |
| Read Latency | 1.5 cycles with DLL enabled; 1 cycle with DLL disabled (DOFF = LOW) |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm), RoHS-compliant |
| I/O Standard | HSTL-18 Class I outputs with programmable drive strength and ZQ impedance calibration |
| Burst Length | Fixed 4-word burst per access, reducing address bus toggling frequency by 4× |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Sampled on rising edge of K/K; 36-bit parallel input path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edge of C/C; full 36-bit output bus with echo-clock-aligned timing |
| A[18:0] | Multiplexed address inputs | 19-bit bus shared by read/write ports; latched on alternating K/K edges to reduce pin count |
| BWS[3:0] | Byte write select (active LOW) | Enables selective 8-bit byte writes: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27] |
| RPS / WPS | Read/Write Port Select (active LOW) | Independent enable control per port; deselecting tri-states Q[35:0] or ignores D[35:0] |
| C / C, K / K | Differential clock inputs | K/K drives all synchronous inputs; C/C clocks read outputs and enables flight-time deskew |
| CQ / CQ | Output echo clocks | Free-running copies of C/C referenced to device outputs; simplify high-speed data capture at controller |
| ZQ | Impedance calibration reference | Connects to external 100 Ω resistor to ground to tune Q[35:0]/CQ/CQ output impedance to 20 Ω |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port architecture | Simultaneous independent read and write operations eliminate bus turnaround overhead and maximize throughput |
| 4-word burst + DDR interface | Delivers 600 MT/s effective bandwidth at 250 MHz clock, reducing system address bus frequency by 4× |
| Programmable DLL operation | Enables 1.5-cycle read latency for timing-critical applications; DOFF pin allows fallback to deterministic 1-cycle QDR-I mode |
| HSTL-18 I/O with ZQ calibration | Ensures signal integrity on high-speed buses; on-die impedance matching eliminates external termination resistors |
| JTAG 1149.1 test access | Supports boundary-scan testing and in-system debug without requiring additional test pads or probes |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Line-rate buffering of 10G Ethernet frames in telecom switching fabric. IC Role / Device Role / Timing Role: Dedicated QDR-II SRAM providing zero-wait-state, concurrent ingress/egress packet storage with deterministic 1.5-cycle read latency. Use Value: Enables full-duplex 10 Gbps traffic handling using single CY7C1515AV18 per port, eliminating arbitration delay between read/write paths. |
Use Scenario: Interfacing multi-core network processors with external memory for header parsing and flow table lookups. IC Role / Device Role / Timing Role: High-bandwidth, low-latency scratchpad memory accessed simultaneously by multiple NPU execution units. Use Value: Sustains >4.8 GB/s aggregate bandwidth (250 MHz × 36-bit × 2 transfers/cycle) to prevent pipeline stalls during deep packet inspection. |
| Telecom Baseband Processing | Test Equipment Memory Subsystem |
|
Use Scenario: Real-time buffering of IQ samples in 4G/LTE baseband units prior to FFT processing. IC Role / Device Role / Timing Role: Burst-oriented SRAM staging intermediate data between ADC/DAC interfaces and DSP engines. Use Value: 4-word burst mode aligns with standard LTE symbol lengths, minimizing address bus activity and power consumption per sample block. |
Use Scenario: High-fidelity waveform capture and replay in automated test equipment (ATE) with nanosecond timing resolution. IC Role / Device Role / Timing Role: Deterministic-latency memory for timestamped data acquisition and pattern generation engines. Use Value: DLL-controlled 1.5-cycle latency ensures sub-2 ns jitter in trigger-to-data-output timing, critical for <100 ps measurement accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1515AV18-250BZI | Same die, industrial temperature grade (−40°C to +85°C) vs. commercial (0°C to +70°C); identical timing and pinout | Required for extended-temperature deployments in outdoor base stations or industrial controllers | Select BZI for operation beyond 70°C ambient; no redesign needed |
| AS7C3256A-25JCIN | Asynchronous 32K × 8 SRAM; no DDR, no dual-port, no DLL; 25 ns access time, 5V tolerant | Only suitable for low-speed control-plane buffers where concurrency and bandwidth are not required | Not a functional substitute-lacks QDR-II architecture, burst, or DDR capability |
Compared with CY7C1515AV18-250BZI, the BZC variant trades extended temperature range for lower cost in commercial environments; AS7C3256A lacks all QDR-II features and cannot replace it in high-speed data-path roles.
Availability
CY7C1515AV18 is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and ATE memory subsystems requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1515AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.
The QDR-II SRAM product line targets applications demanding deterministic latency, concurrent access, and DDR bandwidth without bus turnaround-specifically optimized for network infrastructure and real-time signal processing.
FAQ
What is the minimum supported clock frequency for CY7C1515AV18?
The device has no specified minimum clock frequency; it operates down to DC for static timing analysis. Functional operation requires stable K/K and C/C clocks meeting setup/hold requirements per the datasheet's AC timing tables. At very low frequencies, DLL lock time increases but does not prevent operation.
Can CY7C1515AV18 operate without connecting the ZQ pin?
No-ZQ must be connected either to a 100 Ω resistor to ground (for calibrated 20 Ω output impedance) or directly to VDDQ (for minimum impedance mode). Leaving ZQ floating or tied to VSS violates the absolute maximum ratings and may cause output driver instability or excessive current draw.
How does the BWS[3:0] signal map to the 36-bit data bus?
BWS0 controls D[8:0] (9 bits), BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each active-low signal enables its corresponding 9-bit byte group during write operations; deselected bytes retain prior contents, enabling partial-word updates without read-modify-write cycles.
Is the CQ/CQ echo clock required for proper read data capture?
Yes-CQ and CQ are essential for reliable high-speed read capture. They are phase-aligned copies of C and C, referenced to the Q[35:0] output drivers. Using CQ/CQ at the controller allows deskewing of flight-time mismatches across the 36-bit bus, ensuring setup/hold margin at 600 MT/s operation.
CY7C1515AV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1515AV18-250BZC FAQ
1.How can I place an order for CY7C1515AV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1515AV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1515AV18-250BZC reliable?
The price and inventory of CY7C1515AV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515AV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1515AV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515AV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1515AV18-250BZC?
CY7C1515AV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1515AV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1515AV18-250BZC?
For technical support, including CY7C1515AV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515AV18-250BZC requirements.
6.How does Aetrix verify that CY7C1515AV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1515AV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515AV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1515AV18-250BZC?
All CY7C1515AV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515AV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1515AV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1515AV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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